620
Index
Epoxy flux, 264, 265, 275, 277, 278, 280,
281, 286–289, 291–294, 297, 298,
323, 324
Erosion, 56, 373
F
Failure analysis, 3, 4, 14, 15, 497, 560, 575–
578, 598–600, 602, 604, 608, 610,
611, 614
Final sizing, testing, inspection and shipment, 427
Fluxes, 8, 13, 40, 93, 181, 189–191, 260, 264,
265, 273, 275–278, 280–289, 291–
294, 296–300, 307, 308, 323, 324,
332, 340, 348, 349, 354–358, 361–
365, 370, 372, 373, 375, 376, 386,
387, 390, 392, 416, 456, 476, 479–
484, 536, 544, 545, 553–556, 559,
563, 564, 566, 568, 598
G
General considerations, 400
H
Heat dissipation, 167, 203, 215, 260, 369,
370, 373, 376, 387, 391, 416, 553,
557, 561, 562, 568
Heterogeneous integration, 18, 27, 34, 569
I
Inner layer imaging, 424
Integrated microchannels, 386
Introduction, 397
J
Jet impingement, 370, 373
L
Laser scribe, 158, 163, 165, 166, 178–181,
194
Liquid cooling, 370, 376, 378, 383, 384, 386
Logic interposer attachment, 299
M
Materials employed in organic substrate
production, 399
Memory module, 299
to logic interposer attachment, 299
to silicon interposer attachment, 299
Micro-bumping, 329, 331, 342, 527
Microbumping process, 329
Micro bumps, 7, 12, 14, 15, 27, 274, 286,
299–301, 303, 324, 329–343, 347,
560
Microchannel cooling, 371, 374, 386
Moisture diffusion, 455–462, 466
Moisture-induced strain, 457
Moore’s Law, 1, 4, 5, 15, 18, 157, 397
Multi-layer buildup, 424
O
Organic substrate fabrication, 422
Organic substrate materials, 399
Overview of substrate technology evolution,
398
P
Packaging, 1–7, 10–15, 19, 37, 38, 47, 157,
178, 186, 189, 194, 201, 208, 213,
225, 259–261, 264, 266, 268, 289,
291, 293, 303, 322, 324, 329, 330,
333, 347, 349–351, 355, 359, 361,
365, 376, 397–400, 402, 405, 409,
411, 414–416, 418, 419, 422, 433,
434, 443, 444, 446, 452, 453, 455,
459, 465, 466, 471–476, 481, 523,
527, 528, 531, 550, 553, 557, 561,
562, 565, 568, 575, 576, 578, 586,
599, 610
Passivation with capping layers, 208
Pastes, 59–61, 72, 234, 235, 239–256, 264,
275, 277, 281, 287, 332, 333, 416,
476–484, 503, 504, 506
Performance considerations, 377, 400
PFC method, 98, 99
Polymeric packaging materials, 433
Pre-applied epoxy based materials, 289, 290
Pressure drop, 370, 373, 374, 386–390
PTH and via filling materials, 400, 416
Q
Quality challenges, 528
Quality of 3D packaging, 3, 14, 15, 527, 528
Quality of 3D packing, 527
R
Reinforcement materials, 406
Index
Epoxy flux, 264, 265, 275, 277, 278, 280,
281, 286–289, 291–294, 297, 298,
323, 324
Erosion, 56, 373
F
Failure analysis, 3, 4, 14, 15, 497, 560, 575–
578, 598–600, 602, 604, 608, 610,
611, 614
Final sizing, testing, inspection and shipment, 427
Fluxes, 8, 13, 40, 93, 181, 189–191, 260, 264,
265, 273, 275–278, 280–289, 291–
294, 296–300, 307, 308, 323, 324,
332, 340, 348, 349, 354–358, 361–
365, 370, 372, 373, 375, 376, 386,
387, 390, 392, 416, 456, 476, 479–
484, 536, 544, 545, 553–556, 559,
563, 564, 566, 568, 598
G
General considerations, 400
H
Heat dissipation, 167, 203, 215, 260, 369,
370, 373, 376, 387, 391, 416, 553,
557, 561, 562, 568
Heterogeneous integration, 18, 27, 34, 569
I
Inner layer imaging, 424
Integrated microchannels, 386
Introduction, 397
J
Jet impingement, 370, 373
L
Laser scribe, 158, 163, 165, 166, 178–181,
194
Liquid cooling, 370, 376, 378, 383, 384, 386
Logic interposer attachment, 299
M
Materials employed in organic substrate
production, 399
Memory module, 299
to logic interposer attachment, 299
to silicon interposer attachment, 299
Micro-bumping, 329, 331, 342, 527
Microbumping process, 329
Micro bumps, 7, 12, 14, 15, 27, 274, 286,
299–301, 303, 324, 329–343, 347,
560
Microchannel cooling, 371, 374, 386
Moisture diffusion, 455–462, 466
Moisture-induced strain, 457
Moore’s Law, 1, 4, 5, 15, 18, 157, 397
Multi-layer buildup, 424
O
Organic substrate fabrication, 422
Organic substrate materials, 399
Overview of substrate technology evolution,
398
P
Packaging, 1–7, 10–15, 19, 37, 38, 47, 157,
178, 186, 189, 194, 201, 208, 213,
225, 259–261, 264, 266, 268, 289,
291, 293, 303, 322, 324, 329, 330,
333, 347, 349–351, 355, 359, 361,
365, 376, 397–400, 402, 405, 409,
411, 414–416, 418, 419, 422, 433,
434, 443, 444, 446, 452, 453, 455,
459, 465, 466, 471–476, 481, 523,
527, 528, 531, 550, 553, 557, 561,
562, 565, 568, 575, 576, 578, 586,
599, 610
Passivation with capping layers, 208
Pastes, 59–61, 72, 234, 235, 239–256, 264,
275, 277, 281, 287, 332, 333, 416,
476–484, 503, 504, 506
Performance considerations, 377, 400
PFC method, 98, 99
Polymeric packaging materials, 433
Pre-applied epoxy based materials, 289, 290
Pressure drop, 370, 373, 374, 386–390
PTH and via filling materials, 400, 416
Q
Quality challenges, 528
Quality of 3D packaging, 3, 14, 15, 527, 528
Quality of 3D packing, 527
R
Reinforcement materials, 406