Index
A
Air cooling of 3D ICs, 373
Assembly, 4, 7–9, 12, 14, 15, 23, 33, 34,
37–40, 49, 51, 58, 60, 62–65, 71, 72,
74–76, 80, 163, 178, 183, 186–188,
192, 204, 208, 259–261, 264, 265,
267, 269, 271, 275, 280–284, 287–
289, 291–296, 300, 303, 323, 324,
329, 337, 341, 351, 353, 402, 403,
416, 417, 422, 426–428, 446–448,
461–463, 466, 471–473, 476, 477,
479–500, 504–508, 510, 511, 513–
515, 519, 523, 528, 532, 533, 546,
551, 576–578, 597, 604, 608, 610,
612, 614
C
Capillary underfill, 191, 286, 292
Capped-die approach, 448, 449, 466
Codesign, 390
Conduction cooling, 370, 371, 374
Conductors, 412
Conformal coatings, 58, 59, 476, 483, 489,
490, 497, 498, 501, 502, 507–510,
523
Cooling layer, 369, 374, 376, 378–381, 383–
386
CPFE method, 97, 98, 100
Cu–Cu insertion bonding, 202, 223, 224
Cu/dielectric hybrid bonding, 213, 215, 225
D
Dielectric materials, 58, 162, 179, 215, 363,
400, 403, 404, 414–417, 422, 424,
425, 599
Die pick and place process, 186, 187
Die preparation, 157, 194
3D microelectronic packages, 63, 576–578,
582, 583, 585, 589, 600, 614
3D packages, 1, 3, 5–8, 11–15, 66, 81, 96,
157, 259–261, 263, 266, 267, 285,
294, 322, 330, 433, 443, 450, 575–
579, 582–586, 591, 592, 596–606,
608, 610, 614
3-D packaging variations, 473
3D stacking, 26, 27, 34, 40, 48, 202, 204,
205, 282, 286, 300, 323, 324
Dynamic temperature-aware task migration
reallocation, 375
E
Efficient FI-FA flow to identify defects, 610
Electromigration, 86, 87, 93–95, 99, 121–
123, 203, 316, 226, 304, 305, 307,
311–313, 315–319, 321, 322, 329,
342, 347–359, 361–366, 389, 418,
419, 483, 527, 528, 531, 553–564,
567, 598, 606, 607
Electron backscatter diffraction, 73, 74, 81,
84, 85, 89, 90, 207, 307, 309, 310,
312, 313, 322, 351, 352, 437, 438,
535, 539, 602, 606–608, 614
Embedded microchannels, 370
Encapsulants, 14, 27, 476, 483, 490, 497,
498, 501, 502
© The Editor(s) (if applicable) and The Author(s), under exclusive
license to Springer Nature Singapore Pte Ltd. 2021
Y. Li and D. Goyal (eds.), 3D Microelectronic Packaging,
Springer Series in Advanced Microelectronics 64,
https://doi.org/10.1007/978-981-15-7090-2
619
A
Air cooling of 3D ICs, 373
Assembly, 4, 7–9, 12, 14, 15, 23, 33, 34,
37–40, 49, 51, 58, 60, 62–65, 71, 72,
74–76, 80, 163, 178, 183, 186–188,
192, 204, 208, 259–261, 264, 265,
267, 269, 271, 275, 280–284, 287–
289, 291–296, 300, 303, 323, 324,
329, 337, 341, 351, 353, 402, 403,
416, 417, 422, 426–428, 446–448,
461–463, 466, 471–473, 476, 477,
479–500, 504–508, 510, 511, 513–
515, 519, 523, 528, 532, 533, 546,
551, 576–578, 597, 604, 608, 610,
612, 614
C
Capillary underfill, 191, 286, 292
Capped-die approach, 448, 449, 466
Codesign, 390
Conduction cooling, 370, 371, 374
Conductors, 412
Conformal coatings, 58, 59, 476, 483, 489,
490, 497, 498, 501, 502, 507–510,
523
Cooling layer, 369, 374, 376, 378–381, 383–
386
CPFE method, 97, 98, 100
Cu–Cu insertion bonding, 202, 223, 224
Cu/dielectric hybrid bonding, 213, 215, 225
D
Dielectric materials, 58, 162, 179, 215, 363,
400, 403, 404, 414–417, 422, 424,
425, 599
Die pick and place process, 186, 187
Die preparation, 157, 194
3D microelectronic packages, 63, 576–578,
582, 583, 585, 589, 600, 614
3D packages, 1, 3, 5–8, 11–15, 66, 81, 96,
157, 259–261, 263, 266, 267, 285,
294, 322, 330, 433, 443, 450, 575–
579, 582–586, 591, 592, 596–606,
608, 610, 614
3-D packaging variations, 473
3D stacking, 26, 27, 34, 40, 48, 202, 204,
205, 282, 286, 300, 323, 324
Dynamic temperature-aware task migration
reallocation, 375
E
Efficient FI-FA flow to identify defects, 610
Electromigration, 86, 87, 93–95, 99, 121–
123, 203, 316, 226, 304, 305, 307,
311–313, 315–319, 321, 322, 329,
342, 347–359, 361–366, 389, 418,
419, 483, 527, 528, 531, 553–564,
567, 598, 606, 607
Electron backscatter diffraction, 73, 74, 81,
84, 85, 89, 90, 207, 307, 309, 310,
312, 313, 322, 351, 352, 437, 438,
535, 539, 602, 606–608, 614
Embedded microchannels, 370
Encapsulants, 14, 27, 476, 483, 490, 497,
498, 501, 502
© The Editor(s) (if applicable) and The Author(s), under exclusive
license to Springer Nature Singapore Pte Ltd. 2021
Y. Li and D. Goyal (eds.), 3D Microelectronic Packaging,
Springer Series in Advanced Microelectronics 64,
https://doi.org/10.1007/978-981-15-7090-2
619