17 Interconnect Quality and Reliability of 3D Packaging
573
71. K. Tu, Electronic Thin-Film Reliability (2010)
72. H. Ye, C. Basaran, D. Hopkins, Thermomigration in Pb–Sn solder joints under joule heating
during electric current stressing. Appl. Phys. Lett. 82(7), 1045–1047 (2003)
73. H.Y. Hsiao, C. Chen, Thermomigration in Pb-free SnAg solder joint under alternating current
stressing. Appl. Phys. Lett. 94(9), 2007–2010 (2009)
74. H.Y. Chen C. Chen, In-situ observation of the failure induced by thermomigration of interstitial
Cu in Pb-free flip chip solder joints, Proceedings of Electronic Components and Technology
Conference, vol. 122103, no. 2008 (2009), pp. 319–324
75. X. Gu, K.C. Yung, Y.C. Chan, D. Yang, Thermomigration and electromigration in Sn 8 Zn 3 Bi
solder joints. J. Mater. Sci.: Mater. Electron. 22(3), 217–222 (2011)
76. C. Chen, H.M. Tong, K.N. Tu, Electromigration and thermomigration in pb-free flip-chip solder
joints. Annu. Rev. Mater. Res. 40(1), 531–555 (2010)
77. M.Y. Guo, C.K. Lin, C. Chen, K.N. Tu, Asymmetrical growth of Cu 6 Sn 5 intermetallic
compounds due to rapid thermomigration of Cu in molten SnAg solder joints. Intermetallics
29, 155–158 (2012)
78. F.Y. Ouyang, W.C. Jhu, T.C. Chang, Thermal-gradient induced abnormal Ni 3 Sn 4 interfacial
growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits. J. Alloys
Compd. 580(580), 114–119 (2013)
79. F.Y. Ouyang, W.C. Jhu, Comparison of thermomigration behaviors between Pb-free flip chip
solder joints and microbumps in three dimensional integrated circuits: Bump height effect, J.
Appl. Phys. 113(4) (2013)
80. C.J. Meechan, G.W. Lehman, Diffusion of Au and Cu in a temperature gradient. J. Appl. Phys.
33(2), 634–641 (1962)
81. K. Tanida, M. Umemoto, N. Tanaka, Y. Tomita, K. Takahashi, Micro Cu bump interconnection
on 3D chip stacking technology. Jpn. J. Appl. Phys. 43(4B), 2264–2270 (2004)
82. Y. Wang, Mechanical reliabilities of porous type Cu/Cu 3 Sn/Cu micro-joints. Unpublished
Manuscript (2016)
83. R.R. Chromik, R.P. Vinci, S.L. Allen, M.R. Notis, Nanoindentation measurements on Cu–Sn
and Ag–Sn intermetallics formed in Pb-free solder joints. J. Mater. Res. 18(09), 2251–2261
(2003)
84. R. Schwaiger, B. Moser, M. Dao, N. Chollacoop, S. Suresh, Some critical experiments on the
strain-rate sensitivity of nanocrystalline nickel. Acta Mater. 51(17), 5159–5172 (2003)
85. X. Deng, N. Chawla, K.K. Chawla, M. Koopman, Deformation behavior of (Cu, Ag)–Sn
intermetallics by nanoindentation. Acta Mater. 52(14), 4291–4303 (2004)
86. L. Xu, J.H.L. Pang, Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to
isothermal aging. Thin solid films 504(1–2), 362–366
87. R.A. Mirshams, C.H. Xiao, S.H. Whang, W.M. Yin, R-Curve characterization of the fracture
toughness of nanocrystalline nickel thin sheets. Mater. Sci. Eng. A 315(1–2), 21–27 (2001)
88. T.-T. Luu, N. Hoivik, K. Wang, K.E. Aasmundtveit, A.-S.B. Vardøy, High-temperature mechanical integrity of Cu–Sn SLID wafer-level bonds. Metall. Mater. Trans. A 46(11), 5266–5274
(2015)
573
71. K. Tu, Electronic Thin-Film Reliability (2010)
72. H. Ye, C. Basaran, D. Hopkins, Thermomigration in Pb–Sn solder joints under joule heating
during electric current stressing. Appl. Phys. Lett. 82(7), 1045–1047 (2003)
73. H.Y. Hsiao, C. Chen, Thermomigration in Pb-free SnAg solder joint under alternating current
stressing. Appl. Phys. Lett. 94(9), 2007–2010 (2009)
74. H.Y. Chen C. Chen, In-situ observation of the failure induced by thermomigration of interstitial
Cu in Pb-free flip chip solder joints, Proceedings of Electronic Components and Technology
Conference, vol. 122103, no. 2008 (2009), pp. 319–324
75. X. Gu, K.C. Yung, Y.C. Chan, D. Yang, Thermomigration and electromigration in Sn 8 Zn 3 Bi
solder joints. J. Mater. Sci.: Mater. Electron. 22(3), 217–222 (2011)
76. C. Chen, H.M. Tong, K.N. Tu, Electromigration and thermomigration in pb-free flip-chip solder
joints. Annu. Rev. Mater. Res. 40(1), 531–555 (2010)
77. M.Y. Guo, C.K. Lin, C. Chen, K.N. Tu, Asymmetrical growth of Cu 6 Sn 5 intermetallic
compounds due to rapid thermomigration of Cu in molten SnAg solder joints. Intermetallics
29, 155–158 (2012)
78. F.Y. Ouyang, W.C. Jhu, T.C. Chang, Thermal-gradient induced abnormal Ni 3 Sn 4 interfacial
growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits. J. Alloys
Compd. 580(580), 114–119 (2013)
79. F.Y. Ouyang, W.C. Jhu, Comparison of thermomigration behaviors between Pb-free flip chip
solder joints and microbumps in three dimensional integrated circuits: Bump height effect, J.
Appl. Phys. 113(4) (2013)
80. C.J. Meechan, G.W. Lehman, Diffusion of Au and Cu in a temperature gradient. J. Appl. Phys.
33(2), 634–641 (1962)
81. K. Tanida, M. Umemoto, N. Tanaka, Y. Tomita, K. Takahashi, Micro Cu bump interconnection
on 3D chip stacking technology. Jpn. J. Appl. Phys. 43(4B), 2264–2270 (2004)
82. Y. Wang, Mechanical reliabilities of porous type Cu/Cu 3 Sn/Cu micro-joints. Unpublished
Manuscript (2016)
83. R.R. Chromik, R.P. Vinci, S.L. Allen, M.R. Notis, Nanoindentation measurements on Cu–Sn
and Ag–Sn intermetallics formed in Pb-free solder joints. J. Mater. Res. 18(09), 2251–2261
(2003)
84. R. Schwaiger, B. Moser, M. Dao, N. Chollacoop, S. Suresh, Some critical experiments on the
strain-rate sensitivity of nanocrystalline nickel. Acta Mater. 51(17), 5159–5172 (2003)
85. X. Deng, N. Chawla, K.K. Chawla, M. Koopman, Deformation behavior of (Cu, Ag)–Sn
intermetallics by nanoindentation. Acta Mater. 52(14), 4291–4303 (2004)
86. L. Xu, J.H.L. Pang, Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to
isothermal aging. Thin solid films 504(1–2), 362–366
87. R.A. Mirshams, C.H. Xiao, S.H. Whang, W.M. Yin, R-Curve characterization of the fracture
toughness of nanocrystalline nickel thin sheets. Mater. Sci. Eng. A 315(1–2), 21–27 (2001)
88. T.-T. Luu, N. Hoivik, K. Wang, K.E. Aasmundtveit, A.-S.B. Vardøy, High-temperature mechanical integrity of Cu–Sn SLID wafer-level bonds. Metall. Mater. Trans. A 46(11), 5266–5274
(2015)