17 Interconnect Quality and Reliability of 3D Packaging
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Fig. 17.26 (a) Sample A. 10-μm Cu/10-μm SnAg under thermal annealing. (1) 150 °C, 500 h; (2)
150 °C, 1000 h [12]. (b) Sample B. 14-μm Cu/8-μm SnAg under thermal annealing. (1) 150 °C,
500 h; (2) 150 °C, 1000 h [12]. (c) Sample C. 10-μm Cu/2-μm Ni/0.5-μm Cu/10-μm SnAg (1)
150 °C, 500 h; (2) 150 °C, 1000 h [12]