17 Interconnect Quality and Reliability of 3D Packaging
541
Fig. 17.14 Misorientation chart of alignment angle statistics of <0001>-oriented Cu 6 Sn 5 with
polycrystalline Cu substrate toward [001] direction [24]
Fig. 17.15 Morphologies of Cu 6 Sn 5 formed on Cu substrate at (a) 240 °C and (b) randomlyoriented Cu 6 Sn 5 at 280 °C for 1 min, and (c) [0001]-oriented Cu 6 Sn 5 at 280 °C for 1 min. The
joints were cooled in air. (d) Shear strength of solder joint of a–c condition [24]
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Fig. 17.14 Misorientation chart of alignment angle statistics of <0001>-oriented Cu 6 Sn 5 with
polycrystalline Cu substrate toward [001] direction [24]
Fig. 17.15 Morphologies of Cu 6 Sn 5 formed on Cu substrate at (a) 240 °C and (b) randomlyoriented Cu 6 Sn 5 at 280 °C for 1 min, and (c) [0001]-oriented Cu 6 Sn 5 at 280 °C for 1 min. The
joints were cooled in air. (d) Shear strength of solder joint of a–c condition [24]