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30. H. McCormick, J. Chow, M. Berry, J. Trudell, R. Brush, J. Qian, R. Cortero, Effect of assembly
variations on package on package reliability in thermal cycling, in Proceedings of Surface
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31. A. Daya, S. Ramkumar, Influence of alloy combination and pcb location on package on package
(PoP) component assembly drop test. in Proceedings of Surface Mount Technology Association
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32. Y. Ejiri, T. Noudou, T. Sakarai, Y. Arayama, Y. Tsubomatsu, K. Hasegawa, Influence of
surface finishes and solder alloys on solder ball joint reliability. Proceedings of Surface Mount
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33. B. Roggeman, M. Meilunas, Assembly and reliability investigation of package on package, in
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34. Z. Hai, J. Zhang, C. Shen, J. Evans, M. Bozack, Long term aging effects on reliability
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35. J. Zhang, Z. Hai, S. Thirugnanasambandam, J. Evans, M. Bozack, Y. Zhang, J. Suhling, Thermal
aging effect on the thermal cycling reliability of lead free fine pitch packages. IEEE Trans.
Comp. Pack Manuf. Tech. 3, 1348–1357 (2013)
36. C. Zhao, C. Shen, H. Zhou, J. Zhang, M. Bozack, J. Evans, Long term aging effects on the
reliability of lead free solder joints in ball grid array packages with various pitch sizes and ball
alignments, in Proceedings of Surface Mount Technology Association International Conference
SMTA, Edina, MN, Sept 2015, pp. 199–206
37. P. Vianco, J. Rejent, J. Grazier, A. Kilgo, B. McKenzie, M. Neilsen, Predicting the reliability
of package-on-package-on-package (PoPoP) interconnections based on accelerated aging
experiments and computational modeling, in Proceedings of Surface Mount Technology
Association International Conference SMTA, Edina, MN, Sept 2016, pp. 24–45
38. P. Vianco, J. Rejent, J. Grazier, A. Kilgo, B. McKenzie, S. Williams, Unpublished data, Sandia
National Laboratories, Albuquerque, NM (2019)
39. W.Y. Lu, J. Lim, B. Boyce, J. Grazier, E. Fang, Small-scale multiaxial deformation experiments
on solder for high-fidelity model development. Sandia Report SAND2002-8592 (Sandia
National Laboratories, Livermore, CA, 2002)
P. Vianco and M. Neilsen
29. D. Shin, D. Lee, E. Ahn, T. Kim, T. Cho, Development of multi stack package with high drop
reliability by experimental and numerical methods, in Proceedings of Electronic Components
and Technology Conference (IEEE, New York, NY, 2006), pp. 377–382
30. H. McCormick, J. Chow, M. Berry, J. Trudell, R. Brush, J. Qian, R. Cortero, Effect of assembly
variations on package on package reliability in thermal cycling, in Proceedings of Surface
Mount Technology Association International Conference SMTA, Edina, MN, Sept 2009. CDROM
31. A. Daya, S. Ramkumar, Influence of alloy combination and pcb location on package on package
(PoP) component assembly drop test. in Proceedings of Surface Mount Technology Association
International Conference SMTA, Edina, MN, Sept 2012. CD-ROM
32. Y. Ejiri, T. Noudou, T. Sakarai, Y. Arayama, Y. Tsubomatsu, K. Hasegawa, Influence of
surface finishes and solder alloys on solder ball joint reliability. Proceedings of Surface Mount
Technology Association International Conference SMTA, Edina, MN, Sept 2015. pp. 957–971
33. B. Roggeman, M. Meilunas, Assembly and reliability investigation of package on package, in
Proceedings of IPC APEX (2009) CD-ROM
34. Z. Hai, J. Zhang, C. Shen, J. Evans, M. Bozack, Long term aging effects on reliability
performance of lead-free solder joints, in Proceedings of Surface Mount Technology Association
International Conference SMTA, Edina, MN, Sept 2013. www.smta.org
35. J. Zhang, Z. Hai, S. Thirugnanasambandam, J. Evans, M. Bozack, Y. Zhang, J. Suhling, Thermal
aging effect on the thermal cycling reliability of lead free fine pitch packages. IEEE Trans.
Comp. Pack Manuf. Tech. 3, 1348–1357 (2013)
36. C. Zhao, C. Shen, H. Zhou, J. Zhang, M. Bozack, J. Evans, Long term aging effects on the
reliability of lead free solder joints in ball grid array packages with various pitch sizes and ball
alignments, in Proceedings of Surface Mount Technology Association International Conference
SMTA, Edina, MN, Sept 2015, pp. 199–206
37. P. Vianco, J. Rejent, J. Grazier, A. Kilgo, B. McKenzie, M. Neilsen, Predicting the reliability
of package-on-package-on-package (PoPoP) interconnections based on accelerated aging
experiments and computational modeling, in Proceedings of Surface Mount Technology
Association International Conference SMTA, Edina, MN, Sept 2016, pp. 24–45
38. P. Vianco, J. Rejent, J. Grazier, A. Kilgo, B. McKenzie, S. Williams, Unpublished data, Sandia
National Laboratories, Albuquerque, NM (2019)
39. W.Y. Lu, J. Lim, B. Boyce, J. Grazier, E. Fang, Small-scale multiaxial deformation experiments
on solder for high-fidelity model development. Sandia Report SAND2002-8592 (Sandia
National Laboratories, Livermore, CA, 2002)