16 Processing and Reliability of Solder Interconnections …
525
8. P. Vianco, J. Grazier, J. Rejent, A. Kilgo, F. Verdi, C. Meola, Temperature cycling of Pb-free
and mixed solder interconnections used on a package-on-package test vehicle, in Proceedings
of the Surface Mount Technology Association International Conference SMTA, Edina, MN,
Sept 2010. CD-ROM
9. A. Yoshida, J. Taniguchi, K. Murata, M. Kada, Y. Yamamoto, Y. Takagi, T. Notomi, A. Fujita, A
study on package stacking process for package-on-package (PoP), in Proceedings of Electronic
Components and Technology Conference (IEEE, New York, NY, 2006). https://doi.org/10.1109/
ectc.2006.1645753
10. G. Padnos, PCB assembly system set-up for package-on-package (PoP) assembly, in Global
SMT and Pack, March 13–17 (2010)
11. J. Sjoberg, D. Geiger, T. Castello, D. Shangguan, Package-on-package (PoP) process
development and reliability evaluation. in Global SMT and Pack (2007), pp. 34–36
12. V. Srinivas, M. Osterman, R. Farrell, Reliability evaluation of one-pass and two-pass techniques
of assembly for package on packages under torsion loading, in Proceedings of IPC APEX Expo
(IEEE, New York, NY, 2009). CD-ROM
13. H. McCormick, I. Sterian, J. Chow, M. Berry, J. Trudell, R. Cortero, PoP (package on package):
an EMS perspective on assembly, rework, and reliability, in Proceedings of SMTA Pan Pacific
Conference (SMTA, Edina, MN, 2009), pp. 178–183
14. V. Wang, D. Maslyk, Analysis of the reliability of package-on-package devices manufactured
using various underfill methods. Proceedings of International Conference on Electronic
Packaging Technology and High Density Packaging (IEEE, New York, NY, 2008). https://
doi.org/10.1109/ecept.2008.4606944
15. E. Ibe, K. Loh, J. Luan, Y. Tee, Effect of unfilled underfill on board level reliability, in
Proceedings of Electronic Components and Technology Conference (IEEE, New York, NY,
2006). https://doi.org/10.1109/ectc.2006.1645687
16. M. Robins, Conformal coatings: to protect and serve. Electr. Proc. Prod. 16–22 (1999)
17. C. Tautscher, Conformal coatings: selection criteria. SMT 64–68 (1998)
18. L. Smith, M. Dreiza, A. Yoshida, Package on package (PoP) stacking and board level reliability,
in Proceedings of Surface Mount Technology Association International Conference SMTA,
Edina, MN, Sept 2006. CD-ROM
19. M.-J. Yim, R. Strode, R. Adimula, C. Yoo, Effects of material properties on PoP top package
warpage behaviors, in Proceedings of Electronic Components and Technology Conference
(IEEE, New York, NY, 2010). https://doi.org/10.1109/ectc.2010.5490834
20. K. Chiavone, Advanced analysis of package-on-package interconnect gaps during reflow
assembly, in Proceedings of Surface Mount Technology Association International Conference
SMTA, Edina, MN, Sept 2015, pp. 786–791
21. P. Lall, K. Patel, V. Narayan, Process and material envelop for allowable package-on-package
warpage. J. Surface Mount Tech. 28(3), 32–47 (2015)
22. Rokot™ User’s Guide EHB0003, Issue 5 (Euroket, Bremen, Germany, 2011), pp. 5-1–5-10
23. M. Berman, Electronic components for high-g hardened packaging, in ARL-TR-3705 (U.S.
Army Research Laboratory, Aberdeen, MD, 2006)
24. Performance test methods and qualification requirements for surface mount solder attachments,
in IPC-9701 (Association Connecting Electronics Industries, Bannockburn, IL)
25. M. Dreiza, A. Yoshida, K. Ishibashi, T. Maeda, High density PoP (package-on-package) and
package stacking development, in Proceedings of Electronic Components and Technology
Conference (IEEE, New York, NY, 2007)
26. Handbook for Robustness Validation of Automotive Electrical/Electronic Modules. Standard
J1211_20121 (SAE, International. Warrendale, PA, 2012)
27. Road vehicles—Environmental conditions and testing for electrical and electronic equipment.
ISO 16750-2:2012 (International Standard Organisation, Geneva, Switzerland, 2012)
28. M. Dreiza, L. Smith, G. Dunn, N. Vijayaragavan, J. Werner, Package on package (PoP) stacking
and board level reliability, results of joint industry study, in Proceedings of IMAPS Conference
(IMAPS, Research Triangle Park, NC, 2006)
525
8. P. Vianco, J. Grazier, J. Rejent, A. Kilgo, F. Verdi, C. Meola, Temperature cycling of Pb-free
and mixed solder interconnections used on a package-on-package test vehicle, in Proceedings
of the Surface Mount Technology Association International Conference SMTA, Edina, MN,
Sept 2010. CD-ROM
9. A. Yoshida, J. Taniguchi, K. Murata, M. Kada, Y. Yamamoto, Y. Takagi, T. Notomi, A. Fujita, A
study on package stacking process for package-on-package (PoP), in Proceedings of Electronic
Components and Technology Conference (IEEE, New York, NY, 2006). https://doi.org/10.1109/
ectc.2006.1645753
10. G. Padnos, PCB assembly system set-up for package-on-package (PoP) assembly, in Global
SMT and Pack, March 13–17 (2010)
11. J. Sjoberg, D. Geiger, T. Castello, D. Shangguan, Package-on-package (PoP) process
development and reliability evaluation. in Global SMT and Pack (2007), pp. 34–36
12. V. Srinivas, M. Osterman, R. Farrell, Reliability evaluation of one-pass and two-pass techniques
of assembly for package on packages under torsion loading, in Proceedings of IPC APEX Expo
(IEEE, New York, NY, 2009). CD-ROM
13. H. McCormick, I. Sterian, J. Chow, M. Berry, J. Trudell, R. Cortero, PoP (package on package):
an EMS perspective on assembly, rework, and reliability, in Proceedings of SMTA Pan Pacific
Conference (SMTA, Edina, MN, 2009), pp. 178–183
14. V. Wang, D. Maslyk, Analysis of the reliability of package-on-package devices manufactured
using various underfill methods. Proceedings of International Conference on Electronic
Packaging Technology and High Density Packaging (IEEE, New York, NY, 2008). https://
doi.org/10.1109/ecept.2008.4606944
15. E. Ibe, K. Loh, J. Luan, Y. Tee, Effect of unfilled underfill on board level reliability, in
Proceedings of Electronic Components and Technology Conference (IEEE, New York, NY,
2006). https://doi.org/10.1109/ectc.2006.1645687
16. M. Robins, Conformal coatings: to protect and serve. Electr. Proc. Prod. 16–22 (1999)
17. C. Tautscher, Conformal coatings: selection criteria. SMT 64–68 (1998)
18. L. Smith, M. Dreiza, A. Yoshida, Package on package (PoP) stacking and board level reliability,
in Proceedings of Surface Mount Technology Association International Conference SMTA,
Edina, MN, Sept 2006. CD-ROM
19. M.-J. Yim, R. Strode, R. Adimula, C. Yoo, Effects of material properties on PoP top package
warpage behaviors, in Proceedings of Electronic Components and Technology Conference
(IEEE, New York, NY, 2010). https://doi.org/10.1109/ectc.2010.5490834
20. K. Chiavone, Advanced analysis of package-on-package interconnect gaps during reflow
assembly, in Proceedings of Surface Mount Technology Association International Conference
SMTA, Edina, MN, Sept 2015, pp. 786–791
21. P. Lall, K. Patel, V. Narayan, Process and material envelop for allowable package-on-package
warpage. J. Surface Mount Tech. 28(3), 32–47 (2015)
22. Rokot™ User’s Guide EHB0003, Issue 5 (Euroket, Bremen, Germany, 2011), pp. 5-1–5-10
23. M. Berman, Electronic components for high-g hardened packaging, in ARL-TR-3705 (U.S.
Army Research Laboratory, Aberdeen, MD, 2006)
24. Performance test methods and qualification requirements for surface mount solder attachments,
in IPC-9701 (Association Connecting Electronics Industries, Bannockburn, IL)
25. M. Dreiza, A. Yoshida, K. Ishibashi, T. Maeda, High density PoP (package-on-package) and
package stacking development, in Proceedings of Electronic Components and Technology
Conference (IEEE, New York, NY, 2007)
26. Handbook for Robustness Validation of Automotive Electrical/Electronic Modules. Standard
J1211_20121 (SAE, International. Warrendale, PA, 2012)
27. Road vehicles—Environmental conditions and testing for electrical and electronic equipment.
ISO 16750-2:2012 (International Standard Organisation, Geneva, Switzerland, 2012)
28. M. Dreiza, L. Smith, G. Dunn, N. Vijayaragavan, J. Werner, Package on package (PoP) stacking
and board level reliability, results of joint industry study, in Proceedings of IMAPS Conference
(IMAPS, Research Triangle Park, NC, 2006)