520
P. Vianco and M. Neilsen
Fig. 16.26 Finite element models illustrate the effect of the limiting values of molding compound
CTE on the warpage behavior of individual packages comprising a PoPoP when the temperature is
raised from 25 to 125 °C
Fig. 16.27 Graph shows computational model predictions of the effects of substrate and molding
compound modulus values on the synergism between warpage (ordinate) and cycles to a crack open
(abscissa). The significant dependency is in the 20–50 μm range of warpage
the PoPoP component (top, middle, and bottom). The graphs showed that the cyclesto-failure data were sensitive to warpage over the range of approximately 20–50 μm.
Warpage had a negligible effect for displacements of less than 20 μm or greater than
50 μm. The latter limit resulted from the individual packages actually contacting
one-another.
P. Vianco and M. Neilsen
Fig. 16.26 Finite element models illustrate the effect of the limiting values of molding compound
CTE on the warpage behavior of individual packages comprising a PoPoP when the temperature is
raised from 25 to 125 °C
Fig. 16.27 Graph shows computational model predictions of the effects of substrate and molding
compound modulus values on the synergism between warpage (ordinate) and cycles to a crack open
(abscissa). The significant dependency is in the 20–50 μm range of warpage
the PoPoP component (top, middle, and bottom). The graphs showed that the cyclesto-failure data were sensitive to warpage over the range of approximately 20–50 μm.
Warpage had a negligible effect for displacements of less than 20 μm or greater than
50 μm. The latter limit resulted from the individual packages actually contacting
one-another.