Chapter 16
Processing and Reliability of Solder
Interconnections in Stacked Packaging
Paul Vianco and Mike Neilsen
16.1 Introduction
This chapter provides a synopsis of stacked packaging technology. The discussion
will highlight key aspects of materials and assembly processes, which have rapidly
matured to meet the implementation of these components in consumer electronics.
Particular focus will be placed on long-term solder joint performance, which is critical
information for the military, space, and other high-reliability electronics sectors.
There is a wealth of information available to the reader, which addresses the
materials, processes, and reliability aspects of stacked packages. Those resources
range from magazine feature articles to conference proceedings and peer-reviewed
journal articles. Search engines allow the reader easy access to nearly all of these
publications. Therefore, in order to avoid filling the available pages with reference
citations, which could easily be the case, the author provides a limited sampling of
citations within each topical area. The reader is encouraged to search for additional
resources.
16.1.1 Miniaturization and Functionality Trends
The miniaturization of electronic packages, whether passive devices such as capacitors and resistors, or active devices ranging from diodes to microprocessors, has
allowed a greater number of components to be assembled to the printed circuit boards
P. Vianco (B) · M. Neilsen
Sandia National Laboratories, Albuquerque, NM, USA
e-mail: ptvianc@sandia.gov
© The Editor(s) (if applicable) and The Author(s), under exclusive
license to Springer Nature Singapore Pte Ltd. 2021
Y. Li and D. Goyal (eds.), 3D Microelectronic Packaging,
Springer Series in Advanced Microelectronics 64,
https://doi.org/10.1007/978-981-15-7090-2_16
471
Processing and Reliability of Solder
Interconnections in Stacked Packaging
Paul Vianco and Mike Neilsen
16.1 Introduction
This chapter provides a synopsis of stacked packaging technology. The discussion
will highlight key aspects of materials and assembly processes, which have rapidly
matured to meet the implementation of these components in consumer electronics.
Particular focus will be placed on long-term solder joint performance, which is critical
information for the military, space, and other high-reliability electronics sectors.
There is a wealth of information available to the reader, which addresses the
materials, processes, and reliability aspects of stacked packages. Those resources
range from magazine feature articles to conference proceedings and peer-reviewed
journal articles. Search engines allow the reader easy access to nearly all of these
publications. Therefore, in order to avoid filling the available pages with reference
citations, which could easily be the case, the author provides a limited sampling of
citations within each topical area. The reader is encouraged to search for additional
resources.
16.1.1 Miniaturization and Functionality Trends
The miniaturization of electronic packages, whether passive devices such as capacitors and resistors, or active devices ranging from diodes to microprocessors, has
allowed a greater number of components to be assembled to the printed circuit boards
P. Vianco (B) · M. Neilsen
Sandia National Laboratories, Albuquerque, NM, USA
e-mail: ptvianc@sandia.gov
© The Editor(s) (if applicable) and The Author(s), under exclusive
license to Springer Nature Singapore Pte Ltd. 2021
Y. Li and D. Goyal (eds.), 3D Microelectronic Packaging,
Springer Series in Advanced Microelectronics 64,
https://doi.org/10.1007/978-981-15-7090-2_16
471