15 Die and Package Level Thermal and Thermal/Moisture Stresses …
469
65. P.S. Huang, M.Y. Tsai, C.Y. Huang, P.C. Lin, L. Huang, M. Chang, S. Shih, J.P. Lin, in Electronic
Materials and Packaging (EMAP), 2012 14th International Conference on, 2012, p. 1
66. Y. Shen, L. Zhang, X.J. Fan, in IEEE 65th Electronic Components and Technology Conference
(ECTC) 2015, p. 1546
67. A.N.V.D. Silva, Dissertation, Universidade de Lisboa, 2010
68. Y. Wen, C. Basaran, J. Electron. Packag. 125, 134 (2003)
69. S. Timoshenko, J. Opt. Soc. Am. 11, 233 (1925)
70. E. Suhir, ASME J. Appl. Mech. 53, 657 (1986)
71. R.R. Valisetty, L.W. Rehfield, A theory for stress analysis of composite laminates. Paper
presented at 4thAIAA/ASME/ASCE/AHS Structures, Structural Dynamics and Materials
Conference, Lake Tahoe, NV, 1983
72. X. Liu, M. Li, D.R. Mullen, J. Cline, S.K. Sitaraman, IEEE Trans. Device Mater. Reliab. 14,
512 (2014)
73. A.A.O. Tay, T.Y. Lin, in Inter-Society Conference on Thermal Phenomena in Electronic
Systems. I-THERM V (1996), p. 67
74. A.A.O. Tay, T.Y. Lin, in The Sixth Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems 1998, p. 179
75. J.E. Galloway, B.M. Miles, IEEE Trans. Compon. Packag. Manuf. Technol. 20, 274 (1997)
76. X.J. Fan, Mechanics of moisture for polymers: fundamental concepts and model study. Paper
presented at EuroSimE 2008—International Conference on Thermal, Mechanical and MultiPhysics Simulation and Experiments in Microelectronics and Micro-Systems, 2008
77. T.Y. Tee, Z. Zhong, Microelectron. Reliab. 44, 105 (2004)
78. L. Chen, J. Adams, H.-W. Chu, X.J. Fan, J Mater Sci. Mater. Electron. 1 (2015)
79. L. Chen, H.-W. Chu, X.J. Fan, J. Polym. Sci., Part B: Polym. Phys. 53, 1440 (2015)
80. X.J. Fan, S.W.R. Lee, Q. Han, Microelectron. Reliab. 49, 861 (2009)
81. X.J. Fan, J. Zhou, G.Q. Zhang, A. Chandra, in Moisture Sensitivity of Plastic Packages of IC
Devices, edited by X.J. Fan, E. Suhir (Springer, 2010), p. 279
82. M.D. Placette, X. Fan, J.-H. Zhao, D. Edwards, Microelectron. Reliab. 52, 1401 (2012)
83. W.D. van Driel, M. van Gils, X.J. Fan, G.Q. Zhang, L.J. Ernst, IEEE Trans. Compon. Packag.
Technol. 31, 260 (2008)
84. X.J. Fan, G.Q. Zhang, W.D. van Driel, L.J. Ernst, in Proceedings of Electronic Components
and Technology Conference, p. 733 (2003)
85. F. Le, S.W.R. Lee, K.M. Lau, C.P. Yue, J.K.O. Sin, P.K.T. Mok, K. Wing-Hung, C. Hoi Wai,
in IEEE 64th Electronic Components and Technology Conference (ECTC), p. 919 (2014)
86. J. Crank, The Mathematics of Diffusion (Oxford University Press, 1956)
87. S.R. DeGroot, P. Mazur, Non Equilibrium Thermodynamics (North Holland Publishing
Company, North Holland, Amsterdam, 1962)
88. P. Sofronis, R.M. McMeeking, J. Mech. Phys. Solids 37, 317 (1989)
89. X.J. Fan, J. Zhou, G.Q. Zhang, L.J. Ernst, ASME J. Electron. Packag. 127, 262 (2005)
90. Y.C. Fung, Foundations of Solid Mechanics (Prentice Hall, New Jersey, 1965)
469
65. P.S. Huang, M.Y. Tsai, C.Y. Huang, P.C. Lin, L. Huang, M. Chang, S. Shih, J.P. Lin, in Electronic
Materials and Packaging (EMAP), 2012 14th International Conference on, 2012, p. 1
66. Y. Shen, L. Zhang, X.J. Fan, in IEEE 65th Electronic Components and Technology Conference
(ECTC) 2015, p. 1546
67. A.N.V.D. Silva, Dissertation, Universidade de Lisboa, 2010
68. Y. Wen, C. Basaran, J. Electron. Packag. 125, 134 (2003)
69. S. Timoshenko, J. Opt. Soc. Am. 11, 233 (1925)
70. E. Suhir, ASME J. Appl. Mech. 53, 657 (1986)
71. R.R. Valisetty, L.W. Rehfield, A theory for stress analysis of composite laminates. Paper
presented at 4thAIAA/ASME/ASCE/AHS Structures, Structural Dynamics and Materials
Conference, Lake Tahoe, NV, 1983
72. X. Liu, M. Li, D.R. Mullen, J. Cline, S.K. Sitaraman, IEEE Trans. Device Mater. Reliab. 14,
512 (2014)
73. A.A.O. Tay, T.Y. Lin, in Inter-Society Conference on Thermal Phenomena in Electronic
Systems. I-THERM V (1996), p. 67
74. A.A.O. Tay, T.Y. Lin, in The Sixth Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems 1998, p. 179
75. J.E. Galloway, B.M. Miles, IEEE Trans. Compon. Packag. Manuf. Technol. 20, 274 (1997)
76. X.J. Fan, Mechanics of moisture for polymers: fundamental concepts and model study. Paper
presented at EuroSimE 2008—International Conference on Thermal, Mechanical and MultiPhysics Simulation and Experiments in Microelectronics and Micro-Systems, 2008
77. T.Y. Tee, Z. Zhong, Microelectron. Reliab. 44, 105 (2004)
78. L. Chen, J. Adams, H.-W. Chu, X.J. Fan, J Mater Sci. Mater. Electron. 1 (2015)
79. L. Chen, H.-W. Chu, X.J. Fan, J. Polym. Sci., Part B: Polym. Phys. 53, 1440 (2015)
80. X.J. Fan, S.W.R. Lee, Q. Han, Microelectron. Reliab. 49, 861 (2009)
81. X.J. Fan, J. Zhou, G.Q. Zhang, A. Chandra, in Moisture Sensitivity of Plastic Packages of IC
Devices, edited by X.J. Fan, E. Suhir (Springer, 2010), p. 279
82. M.D. Placette, X. Fan, J.-H. Zhao, D. Edwards, Microelectron. Reliab. 52, 1401 (2012)
83. W.D. van Driel, M. van Gils, X.J. Fan, G.Q. Zhang, L.J. Ernst, IEEE Trans. Compon. Packag.
Technol. 31, 260 (2008)
84. X.J. Fan, G.Q. Zhang, W.D. van Driel, L.J. Ernst, in Proceedings of Electronic Components
and Technology Conference, p. 733 (2003)
85. F. Le, S.W.R. Lee, K.M. Lau, C.P. Yue, J.K.O. Sin, P.K.T. Mok, K. Wing-Hung, C. Hoi Wai,
in IEEE 64th Electronic Components and Technology Conference (ECTC), p. 919 (2014)
86. J. Crank, The Mathematics of Diffusion (Oxford University Press, 1956)
87. S.R. DeGroot, P. Mazur, Non Equilibrium Thermodynamics (North Holland Publishing
Company, North Holland, Amsterdam, 1962)
88. P. Sofronis, R.M. McMeeking, J. Mech. Phys. Solids 37, 317 (1989)
89. X.J. Fan, J. Zhou, G.Q. Zhang, L.J. Ernst, ASME J. Electron. Packag. 127, 262 (2005)
90. Y.C. Fung, Foundations of Solid Mechanics (Prentice Hall, New Jersey, 1965)