428
S. Shi et al.
14.4.5 Final Sizing, Testing, Inspection and Shipment
Upon the completion of the finished circuit board, the individual circuits are sized out
from the larger panels and electrically tested. The electrical testing can range from
very simple clamshell fixtures to flying probe test systems. The comprehensiveness
of the test requirements can add a significant cost to the overall final substrate cost and
should be considered when reviewing with the designers and manufacturers. Upon
completion of the electrical testing, the substrates are processed through a final
cleaning before a visual inspection process prior to packing and shipping. Visual
inspection processes are typically manual in nature and customer requirements can
be as little as following simple IPC class I, II or III inspection requirements to
custom-designed quality requirements that can approach 100 pages in length. Upon
completion of the inspection procedure, the substrates are packed and then shipped
to the customer for assembly into the desired electronic module.
Acknowledgements The editors would like to thank Sangil Lee from Invensas Corporation, and
Kyu-oh Lee from Intel Corporation for their critical review of this Chapter.
References
1. Ivan Szendiuch, Development in electronic packaging—moving to 3D system configuration.
Radio Eng. 20(1), 214–220 (2011)
2. Y. Nakamura, S. Katogi, Technology Trends and Future History of Semiconductor Packaging
Substrate Material. Hitachi Chemical Technical Report No. 55, Published by Hitachi Chemical
(2013)
3. C.F. Coombs, Jr., Printed Circuits Handbook, 6th Edition. McGraw-Hill (2008)
4. M. Jassal, S. Ghosh, Aramid fibres—an overview. Indian J. Fibre Text. Res. 27, 290–306 (2002)
5. S. Bagen, D. Alcoe, F.D. Egitto, R.N. Das, G. Thomas, Advanced organic substrate technologies
to enable extreme electronics miniaturization, in Presented on IEEE Components, Packaging
and Manufacturing Technology Chapter. Endicott Interconnect Technologies, Inc., Santa Clara
Valley (February 13, 2013)
6. Design Guidelines 2013 (External). Published by DYCONEX, an MST Company (2013)
7. S. Shi, Study on No-Flow Underfill Materials for Low-Cost Flip-Chip Applications, Ph.D.
Thesis. Georgia Institute of Technology (March 28, 2000)
8. R.R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein, Microelectronics Packaging Handbook,
Semiconductor Packaging, Part II, Second Edition. Published by Kluwer Academic Publishers
(1997)
9. M.L. Minges, Electronic Materials Handbook TM, 1. Packaging, Published by ASM
International (1989)
10. Printed Circuit Board Materials Handbook, M. Jawitz, McGraw-Hill (1997)
11. D.C. Thompson, O. Tantot, H. Jallageas, G.E. Ponchak, M.M. Tentzeris, J. Papapolymerou,
Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP
substrates from 30 to 110 GHz. IEEE Trans. Microw. Theory Tech. 52(4), 1343–1352 (2004)
12. N. Kingsley, Liquid crystal polymer: enabling next-generation conformal and multilayer
electronics. Microw. J. 188–200 (May, 2008)
13. T. Shiraishi, K. Amami, Y. Bessho, K. Sakamaoto, K. Eda, T. Ishida, Flip chip MPU module
using high performance printed circuit board “ALIVH”. Int. J. Microcir. Electr. Packag. 21(2),
Second Quarter, 205–211 (1998)
S. Shi et al.
14.4.5 Final Sizing, Testing, Inspection and Shipment
Upon the completion of the finished circuit board, the individual circuits are sized out
from the larger panels and electrically tested. The electrical testing can range from
very simple clamshell fixtures to flying probe test systems. The comprehensiveness
of the test requirements can add a significant cost to the overall final substrate cost and
should be considered when reviewing with the designers and manufacturers. Upon
completion of the electrical testing, the substrates are processed through a final
cleaning before a visual inspection process prior to packing and shipping. Visual
inspection processes are typically manual in nature and customer requirements can
be as little as following simple IPC class I, II or III inspection requirements to
custom-designed quality requirements that can approach 100 pages in length. Upon
completion of the inspection procedure, the substrates are packed and then shipped
to the customer for assembly into the desired electronic module.
Acknowledgements The editors would like to thank Sangil Lee from Invensas Corporation, and
Kyu-oh Lee from Intel Corporation for their critical review of this Chapter.
References
1. Ivan Szendiuch, Development in electronic packaging—moving to 3D system configuration.
Radio Eng. 20(1), 214–220 (2011)
2. Y. Nakamura, S. Katogi, Technology Trends and Future History of Semiconductor Packaging
Substrate Material. Hitachi Chemical Technical Report No. 55, Published by Hitachi Chemical
(2013)
3. C.F. Coombs, Jr., Printed Circuits Handbook, 6th Edition. McGraw-Hill (2008)
4. M. Jassal, S. Ghosh, Aramid fibres—an overview. Indian J. Fibre Text. Res. 27, 290–306 (2002)
5. S. Bagen, D. Alcoe, F.D. Egitto, R.N. Das, G. Thomas, Advanced organic substrate technologies
to enable extreme electronics miniaturization, in Presented on IEEE Components, Packaging
and Manufacturing Technology Chapter. Endicott Interconnect Technologies, Inc., Santa Clara
Valley (February 13, 2013)
6. Design Guidelines 2013 (External). Published by DYCONEX, an MST Company (2013)
7. S. Shi, Study on No-Flow Underfill Materials for Low-Cost Flip-Chip Applications, Ph.D.
Thesis. Georgia Institute of Technology (March 28, 2000)
8. R.R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein, Microelectronics Packaging Handbook,
Semiconductor Packaging, Part II, Second Edition. Published by Kluwer Academic Publishers
(1997)
9. M.L. Minges, Electronic Materials Handbook TM, 1. Packaging, Published by ASM
International (1989)
10. Printed Circuit Board Materials Handbook, M. Jawitz, McGraw-Hill (1997)
11. D.C. Thompson, O. Tantot, H. Jallageas, G.E. Ponchak, M.M. Tentzeris, J. Papapolymerou,
Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP
substrates from 30 to 110 GHz. IEEE Trans. Microw. Theory Tech. 52(4), 1343–1352 (2004)
12. N. Kingsley, Liquid crystal polymer: enabling next-generation conformal and multilayer
electronics. Microw. J. 188–200 (May, 2008)
13. T. Shiraishi, K. Amami, Y. Bessho, K. Sakamaoto, K. Eda, T. Ishida, Flip chip MPU module
using high performance printed circuit board “ALIVH”. Int. J. Microcir. Electr. Packag. 21(2),
Second Quarter, 205–211 (1998)