14 Fundamentals of Advanced Materials …
429
14. IPC-HDBK-840, Solder Mask Handbook (August, 2006)
15. T. Nagoshi, S. Tanaka, K. Yoshizako, S. Fukuzumi, K. Kurafuchi, Photosensitive Solder Resist
Film for Semiconductor Package “FZ Series”. Hitachi Chemical Technical Report No. 54,
Published by Hitachi Chemical (2012)
16. R.S. Khandpur, Printed Circuit Boards, Design Fabrication and Assembly and Testing.
McGraw-Hill (2006)
17. K. Gileo, Printed Circuit Board, ET-Trends (Fl, LLC Port Orange, 2014)
18. Recent Japanese developments in printed wiring boards for SMT. IEEE Electr. Insul. Magaz.
7(2), 9–16 (1991)
19. Advanced Full Additive Process for High Density Printed Wiring Boards, Japan IEMT
Symposium, pp. 141–146 (1989)
20. D. Walsh, G. Milad, D. Gudeczauskas, Know your final finish options. Printed Circuit Des
Manuf 23(2), 38 (2006)
21. The PWB Magazine (February, 2015)
22. M. Manusharow, S. Muthukumar, E. Zheng, A. Sadiq, C. Lee, Coreless substrate technology
investigation for ultra-thin CPU BGA packaging, 62nd IEEE ECTC (2012)
23. J. Kim, S. Lee, J. Lee, S. Jung, C. Ryu, Warpage issues and assembly challenges using coreless
substrates, IPC APEX EXPO proceedings (2010)
24. K.C. Hung, Y.C. Chan, C.W. Tang, H.C. Ong, Correlation between Ni3Sn4 intermetallics
and Ni3P due to solder reaction-assisted crystallization of electroless Ni-P metallization in
advanced packages. J. Mater. Res. 15, 2534–2539 (2000)
25. A. Kumar, M. He, Z. Chen, P.S. Teo, Effect of electromigration on interfacial reactions between
electroless Ni-P and Sn-3.5% Ag solder. Thin Solid Films 462–463(SPEC. ISS.), 413–418
(2004). https://doi.org/10.1016/j.tsf.2004.05.042
26. P. Liu, C. Chavali, A. Overson, D. Goyal, Failure mechanism and kinetics studies of electroless
Ni-P dissolution in Pb-free solder joints under electromigration, in Proceedings—Electronic
Components and Technology Conference (pp. 441–447). Institute of Electrical and Electronics
Engineers Inc. (2017). https://doi.org/10.1109/ECTC.2017.211
27. Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, W.K. Choi, Effects of phosphorus content on the
reaction of electroless Ni-P with Sn and crystallization of Ni-P. J. Electron. Mater. 33(7),
790–795 (2004). https://doi.org/10.1007/s11664-004-0243-2
28. M.O. Alam, Y.C. Chan, K.C. Hung, Reliability study of the electroless Ni-P layer against
solder alloy. Microelectron. Reliab. 42(7), 1065–1073 (2002). https://doi.org/10.1016/S00262714(02)00068-9
29. B. Morgan, X. Hua, T. Iguchi, T. Tomioka, G.S. Oehrlein, R. Ghodssi, Substrate interconnect
technologies for 3-D MEMS packaging. Microelectron. Eng. 81(1), 106–116 (2005)
30. R. Pitwon, M. Immonen, J. Wu, L. Brusberg, H. Itoh, T. Shioda, International and industrial
standardization of optical circuit board technologies, in Optical Interconnects for Data Centers
(pp. 309–342). Woodhead Publishing (2017)
429
14. IPC-HDBK-840, Solder Mask Handbook (August, 2006)
15. T. Nagoshi, S. Tanaka, K. Yoshizako, S. Fukuzumi, K. Kurafuchi, Photosensitive Solder Resist
Film for Semiconductor Package “FZ Series”. Hitachi Chemical Technical Report No. 54,
Published by Hitachi Chemical (2012)
16. R.S. Khandpur, Printed Circuit Boards, Design Fabrication and Assembly and Testing.
McGraw-Hill (2006)
17. K. Gileo, Printed Circuit Board, ET-Trends (Fl, LLC Port Orange, 2014)
18. Recent Japanese developments in printed wiring boards for SMT. IEEE Electr. Insul. Magaz.
7(2), 9–16 (1991)
19. Advanced Full Additive Process for High Density Printed Wiring Boards, Japan IEMT
Symposium, pp. 141–146 (1989)
20. D. Walsh, G. Milad, D. Gudeczauskas, Know your final finish options. Printed Circuit Des
Manuf 23(2), 38 (2006)
21. The PWB Magazine (February, 2015)
22. M. Manusharow, S. Muthukumar, E. Zheng, A. Sadiq, C. Lee, Coreless substrate technology
investigation for ultra-thin CPU BGA packaging, 62nd IEEE ECTC (2012)
23. J. Kim, S. Lee, J. Lee, S. Jung, C. Ryu, Warpage issues and assembly challenges using coreless
substrates, IPC APEX EXPO proceedings (2010)
24. K.C. Hung, Y.C. Chan, C.W. Tang, H.C. Ong, Correlation between Ni3Sn4 intermetallics
and Ni3P due to solder reaction-assisted crystallization of electroless Ni-P metallization in
advanced packages. J. Mater. Res. 15, 2534–2539 (2000)
25. A. Kumar, M. He, Z. Chen, P.S. Teo, Effect of electromigration on interfacial reactions between
electroless Ni-P and Sn-3.5% Ag solder. Thin Solid Films 462–463(SPEC. ISS.), 413–418
(2004). https://doi.org/10.1016/j.tsf.2004.05.042
26. P. Liu, C. Chavali, A. Overson, D. Goyal, Failure mechanism and kinetics studies of electroless
Ni-P dissolution in Pb-free solder joints under electromigration, in Proceedings—Electronic
Components and Technology Conference (pp. 441–447). Institute of Electrical and Electronics
Engineers Inc. (2017). https://doi.org/10.1109/ECTC.2017.211
27. Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, W.K. Choi, Effects of phosphorus content on the
reaction of electroless Ni-P with Sn and crystallization of Ni-P. J. Electron. Mater. 33(7),
790–795 (2004). https://doi.org/10.1007/s11664-004-0243-2
28. M.O. Alam, Y.C. Chan, K.C. Hung, Reliability study of the electroless Ni-P layer against
solder alloy. Microelectron. Reliab. 42(7), 1065–1073 (2002). https://doi.org/10.1016/S00262714(02)00068-9
29. B. Morgan, X. Hua, T. Iguchi, T. Tomioka, G.S. Oehrlein, R. Ghodssi, Substrate interconnect
technologies for 3-D MEMS packaging. Microelectron. Eng. 81(1), 106–116 (2005)
30. R. Pitwon, M. Immonen, J. Wu, L. Brusberg, H. Itoh, T. Shioda, International and industrial
standardization of optical circuit board technologies, in Optical Interconnects for Data Centers
(pp. 309–342). Woodhead Publishing (2017)