13 Fundamentals of Heat Dissipation in 3D IC Packaging …
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49. J.-L. Hernandez-Gonzalez, S.G. Kandlikar, Performance assessment comparison of variable
fin density microchannels with offset configurations. Heat Transfer Eng. (2016). https://doi.
org/10.1080/01457632.2015.1136146
50. Y. Zhang, C.R. King, J. Zaveri, Y.J. Kim, V. Sahu, Y. Joshi, M.S. Bakir, Coupled electrical
and thermal 3D IC centric microfluidic heat sink design and technology, in 61st Electronic
Components and Technology Conference (ECTC), IEEE, pp. 2037–2044 (2011). https://doi.
org/10.1109/ectc.2011.5898797
51. S.G. Kandlikar, Fundamental issues related to flow boiling in minichannels and microchannels.
Exp. Therm. Fluid Sci. 26(2–4), 389–407 (2002)
52. S.G. Kandlikar, T. Widger, A. Kalani, V. Mejia, Enhanced flow boiling over open microchannels
with uniform and tapered gap manifolds. J. Heat Transfer 135(6), 061401, 9. https://doi.org/
10.1115/1.4023574
53. A. Kalani, S.G. Kandlikar, Combining liquid inertia with pressure recovery from bubble expansion for enhanced flow boiling. Appl. Phys. Lett. 107, 181601 (2015). https://doi.org/10.1063/
1.4935211
54. Y. Zhu, D.S. Antao, K.H. Chu, T.J. Hendricks, E.N. Wang, Enhanced flow boiling heat transfer
in microchannels with structures surfaces, in 15th International Heat Transfer Conference
(Kyoto, Japan, 2014), pp. 10–15
55. C. Green, P. Kottke, X. Han, C. Woodrum, T. Sarvey, P. Asrar, X. Zhang, Y. Joshi, A. Fedorov,
S. Sitaraman, M. Bakir, A review of two-phase forced cooling in three-dimensional stacked
electronics: technology integration. ASME J. Electr. Packag. 137(040802), 9 (2015)
56. H.W. Chiou, Y.M. Lee, H.H. Hsiao, L.C. Cheng, Thermal modeling and design on smartphones
with heat pipe cooling technique, in 2017 IEEE/ACM International Conference on ComputerAided Design (ICCAD). https://doi-org.ezproxy.rit.edu/10.1109/ICCAD.2017.8203816
57. N.E. Jerger, A. Kannan, Z. Li, G.H. Loh, NoC architectures for silicon interposer systems:
why pay for more wires when you can get them (from your interposer) for free? IEEE Micro,
Cambridge, pp. 458–470 (2014)
58. M.M. Ahmed, M.S. Shamim, N. Mansoor, S.A. Mamun, A. Ganguly, Increasing interposer
utilization: a scalable, energy efficient and high bandwidth multicore-multichip integration,
in 2017 Eighth International Green and Sustainable Computing Conference (IGSC), vol. 1,
pp. 1–6 (2017). https://doi.ieeecomputersociety.org/10.1109/IGCC.2017.8323583
395
49. J.-L. Hernandez-Gonzalez, S.G. Kandlikar, Performance assessment comparison of variable
fin density microchannels with offset configurations. Heat Transfer Eng. (2016). https://doi.
org/10.1080/01457632.2015.1136146
50. Y. Zhang, C.R. King, J. Zaveri, Y.J. Kim, V. Sahu, Y. Joshi, M.S. Bakir, Coupled electrical
and thermal 3D IC centric microfluidic heat sink design and technology, in 61st Electronic
Components and Technology Conference (ECTC), IEEE, pp. 2037–2044 (2011). https://doi.
org/10.1109/ectc.2011.5898797
51. S.G. Kandlikar, Fundamental issues related to flow boiling in minichannels and microchannels.
Exp. Therm. Fluid Sci. 26(2–4), 389–407 (2002)
52. S.G. Kandlikar, T. Widger, A. Kalani, V. Mejia, Enhanced flow boiling over open microchannels
with uniform and tapered gap manifolds. J. Heat Transfer 135(6), 061401, 9. https://doi.org/
10.1115/1.4023574
53. A. Kalani, S.G. Kandlikar, Combining liquid inertia with pressure recovery from bubble expansion for enhanced flow boiling. Appl. Phys. Lett. 107, 181601 (2015). https://doi.org/10.1063/
1.4935211
54. Y. Zhu, D.S. Antao, K.H. Chu, T.J. Hendricks, E.N. Wang, Enhanced flow boiling heat transfer
in microchannels with structures surfaces, in 15th International Heat Transfer Conference
(Kyoto, Japan, 2014), pp. 10–15
55. C. Green, P. Kottke, X. Han, C. Woodrum, T. Sarvey, P. Asrar, X. Zhang, Y. Joshi, A. Fedorov,
S. Sitaraman, M. Bakir, A review of two-phase forced cooling in three-dimensional stacked
electronics: technology integration. ASME J. Electr. Packag. 137(040802), 9 (2015)
56. H.W. Chiou, Y.M. Lee, H.H. Hsiao, L.C. Cheng, Thermal modeling and design on smartphones
with heat pipe cooling technique, in 2017 IEEE/ACM International Conference on ComputerAided Design (ICCAD). https://doi-org.ezproxy.rit.edu/10.1109/ICCAD.2017.8203816
57. N.E. Jerger, A. Kannan, Z. Li, G.H. Loh, NoC architectures for silicon interposer systems:
why pay for more wires when you can get them (from your interposer) for free? IEEE Micro,
Cambridge, pp. 458–470 (2014)
58. M.M. Ahmed, M.S. Shamim, N. Mansoor, S.A. Mamun, A. Ganguly, Increasing interposer
utilization: a scalable, energy efficient and high bandwidth multicore-multichip integration,
in 2017 Eighth International Green and Sustainable Computing Conference (IGSC), vol. 1,
pp. 1–6 (2017). https://doi.ieeecomputersociety.org/10.1109/IGCC.2017.8323583