13 Fundamentals of Heat Dissipation in 3D IC Packaging …
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combined with aggressive air cooling designs with compact heat exchangers, pool
boiling in vapor space or liquid cooled microchannels as shown in Fig. 13.2 [9].
Fig. 13.2 Integrated
conduction cooling of 3D
ICs with other cooling
systems: (a) aggressive air
cooling with compact HX,
(b) pool boiling with vapor
space condensation,
(c) microchannel cooling,
[9]. Redrawn from [9]
Aggressive air cooling
design with compact HX
Face-to-back packaging
Aggressive air cooling
design with compact HX
Hybrid face-to-back and face-to-face packaging
a)
Pool boiling with vapor
space condensation
Coolant inlet and outlet
Hybrid face-to-back and face-to-face packaging
b)
Microchannels on the
backside of a chip
Hybrid face-to-back and face-to-face packaging
c)
Top cover for
microchannels