12 Fundamentals of Electromigration in Interconnects of 3D Packaging
367
28. Y.W. Chang, C. Chen, T.C. Chang, C.J. Zhan, J.Y. Juang, A.T. Huang, Mater. Lett. 137, 136
(2014)
29. C. Chen, D. Yu, K.N. Chen, MRS Bull. 40, 257 (2015)
30. H.Y. Chen, C.H. Tung, Y.L. Hsiao, JL. Wu, T.C. Yeh, L.L.C. Lin, C. Chen, D.C.H. Yu, in
Electronic Components and Technology Conference (ECTC), p. 620 (2015)
31. H.Y. Chen, D.Y. Shih, C.C. Wei, C.H. Tung, Y.L. Hsiao, D.C.H. Yu, Y.C. Liang, C. Chen, in
Electronic Components and Technology Conference (ECTC), p. 49 (2015)
32. C.C. Wei, C.F. Chen, P.C. Liu, C. Chen, J. Appl. Phys. 105, 023715 (2009)
33. Y.B. Park, S.H. Kim, J.J. Park, J.B. Kim, H.Y. Son, K.W. Han, J.S. Oh, NS. Kim, S. Yoo, in
Electronic Components and Technology Conference (ECTC), p. 1988 (2013)
34. J.Y. Kim, J. Yu, Appl. Phys. Lett. 92, 092109 (2008)
35. S. Kumar, J. Smetana, D. Love, J. Watkowski, R. Parker, C.A. Handwerker, J. Electron. Mater.
40, 2415 (2011)
36. Y. Wang, S.H. Chae, J. Im, P.S. Ho, in Electronic Components and Technology Conference
(ECTC), p. 1953 (2013)
37. P.L. Liu, J.K. Shang, Scripta Mater. 53, 631 (2005)
38. C. Chen, H.Y. Hsiao, Y.W. Chang, F.Y. Ouyang, K.N. Tu, Mater. Sci. Eng. R 73, 85 (2012)
39. F.Y. Ouyang, W.C. Jhu, J. Appl. Phys. 113, 043711 (2013)
40. H. Hsu, T.Y. Lin, F.Y. Ouyang, J. Electron. Mater. 43, 236 (2013)
41. K. Zeng, K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002)
42. H.Y. Chen, C. Chen, K.N. Tu, Appl. Phys. Lett. 93, 122103 (2008)
43. H.-Y. Chen, C. Chen, J. Mater. Res. 26, 983 (2011)
44. W.N. Hsu, F.Y. Ouyang, Mater. Chem. Phys. 165, 66 (2015)
45. C.M. Tan, A. Roy, Mater. Sci. Eng. R 58, 1 (2007)
46. C.K. Hu, L. Gignac, E. Liniger, B. Herbst, D.L. Rath, S.T. Chen, S. Kaldor, A. Simon, W.T.
Tseng, Appl. Phys. Lett. 83, 869 (2003)
47. Z.H. Gan, W. Shao, S.G. Mhaisalkar, Z. Chen, H. Li, K.N. Tu, A.M. Gusak, J. Mater. Res. 21,
2241 (2006)
48. C.M. Tan, A. Roy, A.V. Vairagar, A. Krishnamoorthy, S.G. Mhaisalkar, IEEE Trans. Dev. Mater.
Reliab. 5, 198 (2005)
49. M.W. Lane, E.G. Liniger, J.R. Lloyd, J. Appl. Phys. 93, 1417 (2003)
50. K.N. Tu, C.C. Yeh, C.Y. Liu, C. Chen, Appl. Phys. Lett. 76, 988 (2000)
51. J.R. Lloyd, Microelectr. Eng. 49, 51 (1999)
52. J.R. Lloyd, P.M. Smith, J. Vac. Sci. Technol. A1, 455 (1983)
53. L. Kisselgof, S.P. Baranowski, M.C. Broomfield, T. Spooner, L. Elliott, L. Brooke, J.R. Lloyd,
SPIE Submicrometer Metall. 1805, 154 (1992)
54. Y. Oba, J.D. Messemaeker, A.M. Tyrovouzi, Y. Miyamori, J.D. Vos, T. Wang., G. Beyer, E.
Beyne, I.D. Wolf, K. Croes, Jap. J. Appl. Phys. 54, 05EE01 (2015)
55. H.J. Choi, S.M. Choi, M.S. Yeo, S.D. Cho, D.C. Baek, J. Park, in Interconnect Technology
Conference (IITC), IEEE International, p. 1 (2012)
56. S. Moreau, D. Bouchu, Reliability Physics Symposium (IRPS), IEEE International, CP. 1.1
(2013)
57. T. Frank, S. Moreau, C. Chappaz, L. Arnaud, P. Leduc, A. Thuaire, L. Anghel, in Electronic
Components and Technology Conference (ECTC) p. 326 (2012)
367
28. Y.W. Chang, C. Chen, T.C. Chang, C.J. Zhan, J.Y. Juang, A.T. Huang, Mater. Lett. 137, 136
(2014)
29. C. Chen, D. Yu, K.N. Chen, MRS Bull. 40, 257 (2015)
30. H.Y. Chen, C.H. Tung, Y.L. Hsiao, JL. Wu, T.C. Yeh, L.L.C. Lin, C. Chen, D.C.H. Yu, in
Electronic Components and Technology Conference (ECTC), p. 620 (2015)
31. H.Y. Chen, D.Y. Shih, C.C. Wei, C.H. Tung, Y.L. Hsiao, D.C.H. Yu, Y.C. Liang, C. Chen, in
Electronic Components and Technology Conference (ECTC), p. 49 (2015)
32. C.C. Wei, C.F. Chen, P.C. Liu, C. Chen, J. Appl. Phys. 105, 023715 (2009)
33. Y.B. Park, S.H. Kim, J.J. Park, J.B. Kim, H.Y. Son, K.W. Han, J.S. Oh, NS. Kim, S. Yoo, in
Electronic Components and Technology Conference (ECTC), p. 1988 (2013)
34. J.Y. Kim, J. Yu, Appl. Phys. Lett. 92, 092109 (2008)
35. S. Kumar, J. Smetana, D. Love, J. Watkowski, R. Parker, C.A. Handwerker, J. Electron. Mater.
40, 2415 (2011)
36. Y. Wang, S.H. Chae, J. Im, P.S. Ho, in Electronic Components and Technology Conference
(ECTC), p. 1953 (2013)
37. P.L. Liu, J.K. Shang, Scripta Mater. 53, 631 (2005)
38. C. Chen, H.Y. Hsiao, Y.W. Chang, F.Y. Ouyang, K.N. Tu, Mater. Sci. Eng. R 73, 85 (2012)
39. F.Y. Ouyang, W.C. Jhu, J. Appl. Phys. 113, 043711 (2013)
40. H. Hsu, T.Y. Lin, F.Y. Ouyang, J. Electron. Mater. 43, 236 (2013)
41. K. Zeng, K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002)
42. H.Y. Chen, C. Chen, K.N. Tu, Appl. Phys. Lett. 93, 122103 (2008)
43. H.-Y. Chen, C. Chen, J. Mater. Res. 26, 983 (2011)
44. W.N. Hsu, F.Y. Ouyang, Mater. Chem. Phys. 165, 66 (2015)
45. C.M. Tan, A. Roy, Mater. Sci. Eng. R 58, 1 (2007)
46. C.K. Hu, L. Gignac, E. Liniger, B. Herbst, D.L. Rath, S.T. Chen, S. Kaldor, A. Simon, W.T.
Tseng, Appl. Phys. Lett. 83, 869 (2003)
47. Z.H. Gan, W. Shao, S.G. Mhaisalkar, Z. Chen, H. Li, K.N. Tu, A.M. Gusak, J. Mater. Res. 21,
2241 (2006)
48. C.M. Tan, A. Roy, A.V. Vairagar, A. Krishnamoorthy, S.G. Mhaisalkar, IEEE Trans. Dev. Mater.
Reliab. 5, 198 (2005)
49. M.W. Lane, E.G. Liniger, J.R. Lloyd, J. Appl. Phys. 93, 1417 (2003)
50. K.N. Tu, C.C. Yeh, C.Y. Liu, C. Chen, Appl. Phys. Lett. 76, 988 (2000)
51. J.R. Lloyd, Microelectr. Eng. 49, 51 (1999)
52. J.R. Lloyd, P.M. Smith, J. Vac. Sci. Technol. A1, 455 (1983)
53. L. Kisselgof, S.P. Baranowski, M.C. Broomfield, T. Spooner, L. Elliott, L. Brooke, J.R. Lloyd,
SPIE Submicrometer Metall. 1805, 154 (1992)
54. Y. Oba, J.D. Messemaeker, A.M. Tyrovouzi, Y. Miyamori, J.D. Vos, T. Wang., G. Beyer, E.
Beyne, I.D. Wolf, K. Croes, Jap. J. Appl. Phys. 54, 05EE01 (2015)
55. H.J. Choi, S.M. Choi, M.S. Yeo, S.D. Cho, D.C. Baek, J. Park, in Interconnect Technology
Conference (IITC), IEEE International, p. 1 (2012)
56. S. Moreau, D. Bouchu, Reliability Physics Symposium (IRPS), IEEE International, CP. 1.1
(2013)
57. T. Frank, S. Moreau, C. Chappaz, L. Arnaud, P. Leduc, A. Thuaire, L. Anghel, in Electronic
Components and Technology Conference (ECTC) p. 326 (2012)