346
K.-L. Lin
38. E.A. Brandes (ed.), Smithells Metals Reference Book (Butterworths, London, 1983)
39. K. Hoshino, Y. Iijima, K. Hirano, Interdiffusion and Kirkendall effect in Cu–Sn alloys. Trans.
Jpn. Inst. Met. 21(10), 674–682 (1980)
40. B.F. Dyson, T.R. Anthony, D. Turnbull, Interstitial diffusion of copper in tin. J. Appl. Phys. 38,
3408 (1967)
41. D.C. Yeh, H.B. Huntington, Extreme fast-diffusion system: nickel in single-crystal tin. Phys.
Rev. Lett. 53, 1469–1472 (1984)
42. Y. Wang, I.M. De Rosa, K.N. Tu, Size effect on ductile-to-brittle transition in Cu-solder-Cu
micro-joints, in 61st Electronic Components and Technology Conference, IEEE (CPMT, Lake
Buena Vista, Florida, 2015), p. 632
43. W.L. Chiu, C.M. Liu, Y.S. Haung et al., Formation of nearly void-free Cu 3 Sn intermetallic
joints using nanotwinned Cu metallization. Appl. Phys. Lett. 104, 171902 (2014)
44. H.Y. Hsiao, C.M. Liu, H.W. Lin et al., Unidirectional growth of microbumps on (111)-oriented
and nanotwinned copper. Science 336, 1007–1010 (2012)
45. Y.H. Hsiao, K.L. Lin, The formation and conversion of intermetallic compounds in the Cu
pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing. J. Mat. Sci. Mat.
Electr. http://doi.org/10.1007/s10854-015-4011-2
K.-L. Lin
38. E.A. Brandes (ed.), Smithells Metals Reference Book (Butterworths, London, 1983)
39. K. Hoshino, Y. Iijima, K. Hirano, Interdiffusion and Kirkendall effect in Cu–Sn alloys. Trans.
Jpn. Inst. Met. 21(10), 674–682 (1980)
40. B.F. Dyson, T.R. Anthony, D. Turnbull, Interstitial diffusion of copper in tin. J. Appl. Phys. 38,
3408 (1967)
41. D.C. Yeh, H.B. Huntington, Extreme fast-diffusion system: nickel in single-crystal tin. Phys.
Rev. Lett. 53, 1469–1472 (1984)
42. Y. Wang, I.M. De Rosa, K.N. Tu, Size effect on ductile-to-brittle transition in Cu-solder-Cu
micro-joints, in 61st Electronic Components and Technology Conference, IEEE (CPMT, Lake
Buena Vista, Florida, 2015), p. 632
43. W.L. Chiu, C.M. Liu, Y.S. Haung et al., Formation of nearly void-free Cu 3 Sn intermetallic
joints using nanotwinned Cu metallization. Appl. Phys. Lett. 104, 171902 (2014)
44. H.Y. Hsiao, C.M. Liu, H.W. Lin et al., Unidirectional growth of microbumps on (111)-oriented
and nanotwinned copper. Science 336, 1007–1010 (2012)
45. Y.H. Hsiao, K.L. Lin, The formation and conversion of intermetallic compounds in the Cu
pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing. J. Mat. Sci. Mat.
Electr. http://doi.org/10.1007/s10854-015-4011-2