328
S. Lee
71. M.E. Johnson, L.M. Moore, D. Ylvisaker, Minimax and maximin distance designs. J. Stat.
Plann. Infer. 26(2), 131–148 (1990)
72. P. Darbandi et al., The effect of cooling rate on grain orientation and misorientation microstructure of SAC105 solder joints before and after impact drop tests. J. Electron. Mater. 43(7),
2521–2529 (2014)
73. D.W. Henderson et al., Ag3Sn plate formation in the solidification of near ternary eutectic
Sn–Ag–Cu alloys. J. Mater. Res. 17(11), 2775–2778 (2002)
74. S.K. Kang, et al., Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy
composition, in Proceedings of 53rd Electronic Components and Technology Conference, 2003.
(2003)
75. S.K. Kang et al., Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying
addition. J. Electron. Mater. 35(3), 479–485 (2006)
76. J. Lienig, M. Thiele, Fundamentals of Electromigration-Aware Integrated Circuit Design, 1st
edn. (Springer, Berlin, 2018)
77. R. Kinyanjui et al., Effect of sample size on the solidification temperature and microstructure
of SnAgCu near eutectic alloys. J. Mater. Res. 20(11), 2914–2918 (2005)
78. L.P. Lehman, et al., Microstructure and damage evolution in Sn-Ag-Cu solder joints, in
Proceedings Electronic Components and Technology, 2005. ECTC ‘05 (2005)
79. C.C. Wei et al., Electromigration in Sn–Cu intermetallic compounds. J. Appl. Phy. 105(2),
023715 (2009)
80. S.O. Kasap, Electrical and thermal conduction in solids, Principles of Electronic Materials and
Devices (McGraw-Hill Education, London, 2006), p. 126
81. J. Haimovich, A. Incorporated, Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin
at and below 100 °C. vol. 3 (1993)
82. R. Labie, W. Ruythooren, J. Van Humbeeck, Solid state diffusion in Cu–Sn and Ni–Sn diffusion
couples with flip-chip scale dimensions. Intermetallics 15(3), 396–403 (2007)
83. J. Hah et al., Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder
joints by traditional reflow and thermo-compression bonding (TCB) processes. Materialia 6,
100327 (2019)
84. D. Hiner, et al., Multi-die chip on wafer thermo-compression bonding using non-conductive
film. in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (2015)
S. Lee
71. M.E. Johnson, L.M. Moore, D. Ylvisaker, Minimax and maximin distance designs. J. Stat.
Plann. Infer. 26(2), 131–148 (1990)
72. P. Darbandi et al., The effect of cooling rate on grain orientation and misorientation microstructure of SAC105 solder joints before and after impact drop tests. J. Electron. Mater. 43(7),
2521–2529 (2014)
73. D.W. Henderson et al., Ag3Sn plate formation in the solidification of near ternary eutectic
Sn–Ag–Cu alloys. J. Mater. Res. 17(11), 2775–2778 (2002)
74. S.K. Kang, et al., Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy
composition, in Proceedings of 53rd Electronic Components and Technology Conference, 2003.
(2003)
75. S.K. Kang et al., Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying
addition. J. Electron. Mater. 35(3), 479–485 (2006)
76. J. Lienig, M. Thiele, Fundamentals of Electromigration-Aware Integrated Circuit Design, 1st
edn. (Springer, Berlin, 2018)
77. R. Kinyanjui et al., Effect of sample size on the solidification temperature and microstructure
of SnAgCu near eutectic alloys. J. Mater. Res. 20(11), 2914–2918 (2005)
78. L.P. Lehman, et al., Microstructure and damage evolution in Sn-Ag-Cu solder joints, in
Proceedings Electronic Components and Technology, 2005. ECTC ‘05 (2005)
79. C.C. Wei et al., Electromigration in Sn–Cu intermetallic compounds. J. Appl. Phy. 105(2),
023715 (2009)
80. S.O. Kasap, Electrical and thermal conduction in solids, Principles of Electronic Materials and
Devices (McGraw-Hill Education, London, 2006), p. 126
81. J. Haimovich, A. Incorporated, Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin
at and below 100 °C. vol. 3 (1993)
82. R. Labie, W. Ruythooren, J. Van Humbeeck, Solid state diffusion in Cu–Sn and Ni–Sn diffusion
couples with flip-chip scale dimensions. Intermetallics 15(3), 396–403 (2007)
83. J. Hah et al., Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder
joints by traditional reflow and thermo-compression bonding (TCB) processes. Materialia 6,
100327 (2019)
84. D. Hiner, et al., Multi-die chip on wafer thermo-compression bonding using non-conductive
film. in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (2015)