10 Fundamentals of Bonding Technology and Process Materials …
327
45. S. Härter, et al., Reliability study of lead-free flip-chips with solder bumps down to 30 μm
diameter (2012)
46. M. Lu, et al., Effect of Sn grain orientation on electromigration degradation mechanism in high
Sn-based Pb-free solders. 92, 211909–211909 (2008)
47. K.N. Tu, A. Gusak, M. Li, Physics and materials challenges for lead-free solders. 93, 1335–1353
(2003)
48. J. Cannis, Green IC packaging. Adv. Packag. 8, 33 (2001)
49. A.U. Telang, et al., Grain-boundary character and grain growth in bulk tin and bulk lead-free
solder alloys. 33, 1412–1423 (2004)
50. S. Terashima, et al., Recrystallization of Sn grains due to thermal strain in Sn1.2Ag0.5Cu0.05Ni
solder. 45, 1383–1390 (2004)
51. Y. Wang, et al., Effects of Sn grain structure on the electromigration of Sn-Ag solder joints.
27, 1131 (2012)
52. B. Zhou, et al., Characterization of recrystallization and microstructure evolution in lead-free
solder joints using EBSD and 3D-XRD. 42 (2012)
53. B. Chao et al., Electromigration enhanced intermetallic growth and void formation in Pb-free
solder joints. J. Appl. Phys. 100(8), 084909 (2006)
54. M.N. Bashir, A.S. Haseeb, Improving mechanical and electrical properties of Cu/SAC305/Cu
solder joints under electromigration by using Ni nanoparticles doped flux (2017)
55. T.R. Bieler, et al., Influence of Sn grain size and orientation on the thermomechanical
response and reliability of Pb-free solder joints. in 56th Electronic Components and Technology
Conference 2006 (2006)
56. K. Murayama, et al., Electro-migration behavior in low temperature flip chip bonding, in 2012
IEEE 62nd Electronic Components and Technology Conference (2012)
57. N. Zhao, Y. Zhong, W. Dong, M.L. Huang, H.T. Ma, C.P. Wong, Formation of highly preferred
orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature
gradient effect. Appl. Phy. Lett. 110(9), 093504 (2017)
58. F. Ochoa, X. Deng, N. Chawla, Effects of cooling rate on creep behavior. J. Electron. Mater.
33(12), 1596–1607 (2004)
59. M. Mueller, et al., Effect of composition and cooling rate on the microstructure of SnAgCusolder joints, in 2007 Proceedings 57th Electronic Components and Technology Conference
(2007)
60. H.T. Lee, K.C. Huang, Effects of cooling rate on the microstructure and morphology of Sn3.0Ag-0.5Cu solder. J. Electron. Mater. 45(1), 182–190 (2015)
61. B.F. Dyson, T.R. Anthony, D. Turnbull, Interstitial diffusion of copper in tin. J. Appl. Phys.
38(8), 3408 (1967)
62. D.C. Yeh, H.B. Huntington, Extreme fast-diffusion system: nickel in single-crystal tin. Phys.
Rev. Lett. 53(15), 1469–1472 (1984)
63. F. Bachmann, R. Hielscher, H. Schaeben, in Texture Analysis with MTEX–Free and Open
Source Software Toolbox, vol. 160 (2010)
64. H.J. Bunge, Texture Analysis in Materials Science: Mathematical Methods (Elsevier,
Amsterdam, 2013)
65. Y.C. Yabansu, D.K. Patel, S.R. Kalidindi, Calibrated localization relationships for elastic
response of polycrystalline aggregates. Acta Mater. 1(81), 151–160 (2014)
66. Y.C. Yabansu, S.R. Kalidindi, Representation and calibration of elastic localization kernels for
a broad class of cubic polycrystals. Acta Mater. 1(94), 26–35 (2015)
67. N.H. Paulson et al., Reduced-order structure-property linkages for polycrystalline microstructures based on 2-point statistics. Acta Mater. 1(129), 428–438 (2017)
68. M.W. Priddy et al., Strategies for rapid parametric assessment of microstructure-sensitive
fatigue for HCP polycrystals. Int. J. Fatigue 104, 231–242 (2017)
69. R. Liu et al., Machine learning approaches for elastic localization linkages in high-contrast
composite materials. Integrating Mater. Manuf. Innovation 4(1), 13 (2015)
70. B. Efron, Bootstrap methods: another look at the Jackknife. Annal. Stat. 7(1), 1–26 (1979)
327
45. S. Härter, et al., Reliability study of lead-free flip-chips with solder bumps down to 30 μm
diameter (2012)
46. M. Lu, et al., Effect of Sn grain orientation on electromigration degradation mechanism in high
Sn-based Pb-free solders. 92, 211909–211909 (2008)
47. K.N. Tu, A. Gusak, M. Li, Physics and materials challenges for lead-free solders. 93, 1335–1353
(2003)
48. J. Cannis, Green IC packaging. Adv. Packag. 8, 33 (2001)
49. A.U. Telang, et al., Grain-boundary character and grain growth in bulk tin and bulk lead-free
solder alloys. 33, 1412–1423 (2004)
50. S. Terashima, et al., Recrystallization of Sn grains due to thermal strain in Sn1.2Ag0.5Cu0.05Ni
solder. 45, 1383–1390 (2004)
51. Y. Wang, et al., Effects of Sn grain structure on the electromigration of Sn-Ag solder joints.
27, 1131 (2012)
52. B. Zhou, et al., Characterization of recrystallization and microstructure evolution in lead-free
solder joints using EBSD and 3D-XRD. 42 (2012)
53. B. Chao et al., Electromigration enhanced intermetallic growth and void formation in Pb-free
solder joints. J. Appl. Phys. 100(8), 084909 (2006)
54. M.N. Bashir, A.S. Haseeb, Improving mechanical and electrical properties of Cu/SAC305/Cu
solder joints under electromigration by using Ni nanoparticles doped flux (2017)
55. T.R. Bieler, et al., Influence of Sn grain size and orientation on the thermomechanical
response and reliability of Pb-free solder joints. in 56th Electronic Components and Technology
Conference 2006 (2006)
56. K. Murayama, et al., Electro-migration behavior in low temperature flip chip bonding, in 2012
IEEE 62nd Electronic Components and Technology Conference (2012)
57. N. Zhao, Y. Zhong, W. Dong, M.L. Huang, H.T. Ma, C.P. Wong, Formation of highly preferred
orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature
gradient effect. Appl. Phy. Lett. 110(9), 093504 (2017)
58. F. Ochoa, X. Deng, N. Chawla, Effects of cooling rate on creep behavior. J. Electron. Mater.
33(12), 1596–1607 (2004)
59. M. Mueller, et al., Effect of composition and cooling rate on the microstructure of SnAgCusolder joints, in 2007 Proceedings 57th Electronic Components and Technology Conference
(2007)
60. H.T. Lee, K.C. Huang, Effects of cooling rate on the microstructure and morphology of Sn3.0Ag-0.5Cu solder. J. Electron. Mater. 45(1), 182–190 (2015)
61. B.F. Dyson, T.R. Anthony, D. Turnbull, Interstitial diffusion of copper in tin. J. Appl. Phys.
38(8), 3408 (1967)
62. D.C. Yeh, H.B. Huntington, Extreme fast-diffusion system: nickel in single-crystal tin. Phys.
Rev. Lett. 53(15), 1469–1472 (1984)
63. F. Bachmann, R. Hielscher, H. Schaeben, in Texture Analysis with MTEX–Free and Open
Source Software Toolbox, vol. 160 (2010)
64. H.J. Bunge, Texture Analysis in Materials Science: Mathematical Methods (Elsevier,
Amsterdam, 2013)
65. Y.C. Yabansu, D.K. Patel, S.R. Kalidindi, Calibrated localization relationships for elastic
response of polycrystalline aggregates. Acta Mater. 1(81), 151–160 (2014)
66. Y.C. Yabansu, S.R. Kalidindi, Representation and calibration of elastic localization kernels for
a broad class of cubic polycrystals. Acta Mater. 1(94), 26–35 (2015)
67. N.H. Paulson et al., Reduced-order structure-property linkages for polycrystalline microstructures based on 2-point statistics. Acta Mater. 1(129), 428–438 (2017)
68. M.W. Priddy et al., Strategies for rapid parametric assessment of microstructure-sensitive
fatigue for HCP polycrystals. Int. J. Fatigue 104, 231–242 (2017)
69. R. Liu et al., Machine learning approaches for elastic localization linkages in high-contrast
composite materials. Integrating Mater. Manuf. Innovation 4(1), 13 (2015)
70. B. Efron, Bootstrap methods: another look at the Jackknife. Annal. Stat. 7(1), 1–26 (1979)