326
S. Lee
23. S. Shi, D. Lu, C.P. Wong, Study on the relationship between the surface composition of copper
pads and no-flow underfill fluxing capability. IEEE Trans. Electron. Packag. Manuf. 22(4),
268–273 (1999)
24. C.P. Wong, S.H. Shi, No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
G.T.R. Corporation, Editor. U.S (2001)
25. H. Li, et al., Syntheses and characterizations of thermally degradable epoxy resins. III. J. Polym.
Sci. Part A Polym. Chem. 40(11), 1796–1807 (2002)
26. Y. Shi, X. Wei, B. Tolla, Smart chemistry towards highly efficient soldering material
formulation, in Proceedings of SMTA International, p. 436–443
27. Z. Zhang, E. Beatty, C. Wong, Study on the curing process and the gelation of epoxy/anhydride
system for no-flow underfill for flip-chip applications. Macromol. Mater. Eng. 288(4), 365–371
(2003)
28. H. O’Neal et al., Comparison of Tg values for a graphite epoxy composite by differential
scanning calorimetry (DSC), thermomechanical analysis (TMA), and dynamic mechanical
analysis (DMA). J. Adv. Mater. 26(3), 49–54 (1995)
29. B. Schmaltz, Packaging materials for 2.5/3D technology. Int. Symp. Microelectron. 2013(1),
000276–000284 (2013)
30. A. Lucero, G. Xu, D. Huitink, Low-k-package integration challenges and options for reliability
qualification. in Reliability Physics Symposium (IRPS), 2012 IEEE International (IEEE, 2012)
31. J.L. Aw, et al. Thermal compression bonding with non-conductive adhesive of 30 um pitch Cu
pillar micro bumps on organic substrate with bare Cu bondpads, in 2014 IEEE 16th Electronics
Packaging Technology Conference (EPTC) (2014)
32. J. Jing-Ye, et al., The development of high through-put micro-bump-bonded process with
non-conductive paste (NCP), in Microsystems, Packaging, Assembly and Circuits Technology
Conference (IMPACT), 2012 7th International (2012)
33. S.W. Yoon, et al., Fabrication and packaging of microbump interconnections for 3D TSV, in
2009 IEEE International Conference on 3D System Integration (2009)
34. S. Lee, Fundamentals of thermal compression bonding technology and process materials for
2.5/3D packages. 57, 157–203 (2017)
35. S.W. Lau, Thermo-compression bonding (TCB) for fine-pitch copper pillar flip chip interconnect, in Advanced Packaging Symposium (Taipei, Taiwan, 2014)
36. A. Eitan, K. Hung, Thermo-compression bonding for fine-pitch copper-pillar flip-chip interconnect—tool features as enablers of unique technology. in 2015 IEEE 65th Electronic Components
and Technology Conference (ECTC) (2015)
37. Y. Tomita, et al., Advanced packaging technologies on 3D stacked LSI utilizing the micro
interconnections and the layered microthin encapsulation. in 2001 Proceedings. 51st Electronic
Components and Technology Conference (Cat. No.01CH37220) (2001)
38. J. Jing-Ye, et al., The development of high through-put micro-bump-bonded process with nonconductive paste (NCP). in 2012 7th International Microsystems, Packaging, Assembly and
Circuits Technology Conference (IMPACT) (2012)
39. D. Duffy, et al., 3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach
Materials for both thermal compression bonding and mass reflow processes, in 2014 IEEE 64th
Electronic Components and Technology Conference (ECTC) (2014)
40. C.-L. Liang, K.-L. Lin, J.-W. Peng, Microstructural evolution of intermetallic compounds in
TCNCP Cu pillar solder joints. 45 (2015)
41. K. Murayama, M. Aizawa, T. Kurihara. Low stress bonding for large size die application, in
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (2015)
42. K. Murayama, M. Aizawa, T. Kurihara, Study of crystal orientation and microstructure in Sn-Bi
and Sn-Ag-Cu solder with thermal compression bonding and mass reflow. in 2016 IEEE 66th
Electronic Components and Technology Conference (ECTC) (2016)
43. C. Chen, H.M. Tong, K.N. Tu, Electromigration and thermomigration in Pb-free flip-chip solder
joints. Annu. Rev. Mater. Res. 40(1), 531–555 (2010)
44. B. Ebersberger, R. Bauer, L. Alexa, Reliability of lead-free SnAg solder bumps: influence
of electromigration and temperature, in Proceedings Electronic Components and Technology,
2005. ECTC ‘05 (2005)
S. Lee
23. S. Shi, D. Lu, C.P. Wong, Study on the relationship between the surface composition of copper
pads and no-flow underfill fluxing capability. IEEE Trans. Electron. Packag. Manuf. 22(4),
268–273 (1999)
24. C.P. Wong, S.H. Shi, No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
G.T.R. Corporation, Editor. U.S (2001)
25. H. Li, et al., Syntheses and characterizations of thermally degradable epoxy resins. III. J. Polym.
Sci. Part A Polym. Chem. 40(11), 1796–1807 (2002)
26. Y. Shi, X. Wei, B. Tolla, Smart chemistry towards highly efficient soldering material
formulation, in Proceedings of SMTA International, p. 436–443
27. Z. Zhang, E. Beatty, C. Wong, Study on the curing process and the gelation of epoxy/anhydride
system for no-flow underfill for flip-chip applications. Macromol. Mater. Eng. 288(4), 365–371
(2003)
28. H. O’Neal et al., Comparison of Tg values for a graphite epoxy composite by differential
scanning calorimetry (DSC), thermomechanical analysis (TMA), and dynamic mechanical
analysis (DMA). J. Adv. Mater. 26(3), 49–54 (1995)
29. B. Schmaltz, Packaging materials for 2.5/3D technology. Int. Symp. Microelectron. 2013(1),
000276–000284 (2013)
30. A. Lucero, G. Xu, D. Huitink, Low-k-package integration challenges and options for reliability
qualification. in Reliability Physics Symposium (IRPS), 2012 IEEE International (IEEE, 2012)
31. J.L. Aw, et al. Thermal compression bonding with non-conductive adhesive of 30 um pitch Cu
pillar micro bumps on organic substrate with bare Cu bondpads, in 2014 IEEE 16th Electronics
Packaging Technology Conference (EPTC) (2014)
32. J. Jing-Ye, et al., The development of high through-put micro-bump-bonded process with
non-conductive paste (NCP), in Microsystems, Packaging, Assembly and Circuits Technology
Conference (IMPACT), 2012 7th International (2012)
33. S.W. Yoon, et al., Fabrication and packaging of microbump interconnections for 3D TSV, in
2009 IEEE International Conference on 3D System Integration (2009)
34. S. Lee, Fundamentals of thermal compression bonding technology and process materials for
2.5/3D packages. 57, 157–203 (2017)
35. S.W. Lau, Thermo-compression bonding (TCB) for fine-pitch copper pillar flip chip interconnect, in Advanced Packaging Symposium (Taipei, Taiwan, 2014)
36. A. Eitan, K. Hung, Thermo-compression bonding for fine-pitch copper-pillar flip-chip interconnect—tool features as enablers of unique technology. in 2015 IEEE 65th Electronic Components
and Technology Conference (ECTC) (2015)
37. Y. Tomita, et al., Advanced packaging technologies on 3D stacked LSI utilizing the micro
interconnections and the layered microthin encapsulation. in 2001 Proceedings. 51st Electronic
Components and Technology Conference (Cat. No.01CH37220) (2001)
38. J. Jing-Ye, et al., The development of high through-put micro-bump-bonded process with nonconductive paste (NCP). in 2012 7th International Microsystems, Packaging, Assembly and
Circuits Technology Conference (IMPACT) (2012)
39. D. Duffy, et al., 3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach
Materials for both thermal compression bonding and mass reflow processes, in 2014 IEEE 64th
Electronic Components and Technology Conference (ECTC) (2014)
40. C.-L. Liang, K.-L. Lin, J.-W. Peng, Microstructural evolution of intermetallic compounds in
TCNCP Cu pillar solder joints. 45 (2015)
41. K. Murayama, M. Aizawa, T. Kurihara. Low stress bonding for large size die application, in
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (2015)
42. K. Murayama, M. Aizawa, T. Kurihara, Study of crystal orientation and microstructure in Sn-Bi
and Sn-Ag-Cu solder with thermal compression bonding and mass reflow. in 2016 IEEE 66th
Electronic Components and Technology Conference (ECTC) (2016)
43. C. Chen, H.M. Tong, K.N. Tu, Electromigration and thermomigration in Pb-free flip-chip solder
joints. Annu. Rev. Mater. Res. 40(1), 531–555 (2010)
44. B. Ebersberger, R. Bauer, L. Alexa, Reliability of lead-free SnAg solder bumps: influence
of electromigration and temperature, in Proceedings Electronic Components and Technology,
2005. ECTC ‘05 (2005)