16
Y. Li and D. Goyal
6. C. Lee, C. Hung, C. Cheung, P. Yang, C. Kao, D. Chen, M. Shih, C.C. Chien, Y. Hsiao, L.
Chen, M. Su, M. Alfano, J. Siegel, J. Din, B. Black, in Conference Proceedings from the 66th
Electronic Components and Technology Conference (ECTC) (2016), p. 1439
7. S.Y. Hou, W.C. Chen, C. Hu. C. Chiu, K.C. Ting, T.S. Lin, W.H. Wei, W.C. Chiou, J.C. Lin,
C.Y. Chang, C.T. Wang, C.H. Wu, D. Yu, IEEE Trans. Electron Dev. 64(10), 4071 (2017)
8. R. Mahajan, R. Sankman, N. Patel, D. Kim, K. Aygun, Z. Qian, Y. Mekonnen, I. Salama, S.
Sharan, D. Iyengar, D. Mallik, in Conference Proceedings from the 66th Electronic Components
and Technology Conference (ECTC) (2016), p. 558
9. D.B. Ingerly, S. Amin, L. Aryasomayajula, A. Balankutty, D. Borst, A. Chandra, K. Cheemalapati, C.S. Cook, R. Criss, K. Enamul1, W. Gomes, D. Jones, K.C. Kolluru, A. Kandas, G.-S.
Kim, H. Ma, D. Pantuso, C.F. Petersburg, M. Phen-givoni, A.M. Pillai, A. Sairam, P. Shekhar,
P. Sinha, P. Stover, A. Telang, Z. Zell, in Conference Proceedings from the IEEE International
Electron Devices Meeting (IEDM) (2019)
10. C. Tseng, C. Liu, C. Wu, D. Yu, in Conference Proceedings from the 66th Electronic
Components and Technology Conference (ECTC) (2016), p. 1
11. G. Gao, L. Mirkarimi, G. Fountain, L. Wang, C. Uzoh, T. Workman, G. Guevara, C. Mandalapu,
B Lee, R. Katkar, in Conference Proceedings from the 68th Electronic Components and
Technology Conference (ECTC) (2018), p. 314
12. R.R. Tummala, Fundamentals of Microsystems Packaging (McGraw-Hill, 2001), pp. 4–41
13. D.C. Brock, Understanding Moore’s Law: Four Decades of Innovation (Chemical Heritage
Foundation, 2006), pp. 67–84
14. Y. Li, P.K. Muthur Srinath, D. Goyal, J. Electron. Mater. 45(1), 116 (2016)
15. Z. Ma, D.G. Seiler, Metrology and Diagnostic Techniques for Nanoelectronics (Pan Stanford
Publishing Pte. Ltd., 2017)
16. T.M. Bauer, S.L. Shinde, J.E. Massad, D.L. Hetherington, in Conference Proceedings from the
59th Electronic Components and Technology Conference (ECTC) (2009), p. 1165
17. G. Pares, N. Bresson, S. Minoret, V. Lapras, P. Brianceau, J. F. Lugand, R. Anciant, N. Sillon, in
Conference Proceedings from the 11th Electronics Packaging Technology Conference (EPTC)
(2009), p. 772
18. K.-.W Lee, H. Hashimoto, M. Onishi, Y. Sato, M. Murugesan, J.-.C Bea, T. Fukushima, T.
Tananka, M. Koyanagi, in Conference Proceedings from the 64th Electronic Components and
Technology Conference (ECTC) (2014), p. 304
19. A. Eitan, K.Hung, in Conference Proceedings from the 65th Electronic Components and
Technology Conference (ECTC) (2015), p. 460
20. R. Viswanath, A. Chandrasekhar, S. Srinivasan, Z. Qian, R. Mahajan, in Conference Proceedings from the IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
(2018), M-I.1
21. K. Zoschke, M. Wegner, M. Wilke, N. Jürgensen, C. Lopper, I. Kuna, V. Glaw, J. Röder1,
O. Wünsch1, M.J. Wolf, O. Ehrmann, H. Reichl, in Conference Proceedings from the 60th
Electronic Components and Technology Conference (ECTC) (2010), p. 1385
22. C.-H. Liu, J.-L. Tsai, C. Hung-Hsien, C.-L. Lu, S.-C. Chen, in Conference Proceedings from
the 64th Electronic Components and Technology Conference (ECTC) (2014), p. 1628
23. C.-H. Liu, Y.-H. Liao, W.-T. Chen, C.-L. Lu, S.-C. Chen, in Conference Proceedings from the
65th Electronic Components and Technology Conference (ECTC) (2015), p. 1502
24. N. Nabiollahi, N. Moelans, M. Gonzalez, J.D. Messemaeker, C.J. Wilson, K. Croes, E. Beyne,
I.D. Wolf, Microelectr. Reliab. 765 (2015)
Y. Li and D. Goyal
6. C. Lee, C. Hung, C. Cheung, P. Yang, C. Kao, D. Chen, M. Shih, C.C. Chien, Y. Hsiao, L.
Chen, M. Su, M. Alfano, J. Siegel, J. Din, B. Black, in Conference Proceedings from the 66th
Electronic Components and Technology Conference (ECTC) (2016), p. 1439
7. S.Y. Hou, W.C. Chen, C. Hu. C. Chiu, K.C. Ting, T.S. Lin, W.H. Wei, W.C. Chiou, J.C. Lin,
C.Y. Chang, C.T. Wang, C.H. Wu, D. Yu, IEEE Trans. Electron Dev. 64(10), 4071 (2017)
8. R. Mahajan, R. Sankman, N. Patel, D. Kim, K. Aygun, Z. Qian, Y. Mekonnen, I. Salama, S.
Sharan, D. Iyengar, D. Mallik, in Conference Proceedings from the 66th Electronic Components
and Technology Conference (ECTC) (2016), p. 558
9. D.B. Ingerly, S. Amin, L. Aryasomayajula, A. Balankutty, D. Borst, A. Chandra, K. Cheemalapati, C.S. Cook, R. Criss, K. Enamul1, W. Gomes, D. Jones, K.C. Kolluru, A. Kandas, G.-S.
Kim, H. Ma, D. Pantuso, C.F. Petersburg, M. Phen-givoni, A.M. Pillai, A. Sairam, P. Shekhar,
P. Sinha, P. Stover, A. Telang, Z. Zell, in Conference Proceedings from the IEEE International
Electron Devices Meeting (IEDM) (2019)
10. C. Tseng, C. Liu, C. Wu, D. Yu, in Conference Proceedings from the 66th Electronic
Components and Technology Conference (ECTC) (2016), p. 1
11. G. Gao, L. Mirkarimi, G. Fountain, L. Wang, C. Uzoh, T. Workman, G. Guevara, C. Mandalapu,
B Lee, R. Katkar, in Conference Proceedings from the 68th Electronic Components and
Technology Conference (ECTC) (2018), p. 314
12. R.R. Tummala, Fundamentals of Microsystems Packaging (McGraw-Hill, 2001), pp. 4–41
13. D.C. Brock, Understanding Moore’s Law: Four Decades of Innovation (Chemical Heritage
Foundation, 2006), pp. 67–84
14. Y. Li, P.K. Muthur Srinath, D. Goyal, J. Electron. Mater. 45(1), 116 (2016)
15. Z. Ma, D.G. Seiler, Metrology and Diagnostic Techniques for Nanoelectronics (Pan Stanford
Publishing Pte. Ltd., 2017)
16. T.M. Bauer, S.L. Shinde, J.E. Massad, D.L. Hetherington, in Conference Proceedings from the
59th Electronic Components and Technology Conference (ECTC) (2009), p. 1165
17. G. Pares, N. Bresson, S. Minoret, V. Lapras, P. Brianceau, J. F. Lugand, R. Anciant, N. Sillon, in
Conference Proceedings from the 11th Electronics Packaging Technology Conference (EPTC)
(2009), p. 772
18. K.-.W Lee, H. Hashimoto, M. Onishi, Y. Sato, M. Murugesan, J.-.C Bea, T. Fukushima, T.
Tananka, M. Koyanagi, in Conference Proceedings from the 64th Electronic Components and
Technology Conference (ECTC) (2014), p. 304
19. A. Eitan, K.Hung, in Conference Proceedings from the 65th Electronic Components and
Technology Conference (ECTC) (2015), p. 460
20. R. Viswanath, A. Chandrasekhar, S. Srinivasan, Z. Qian, R. Mahajan, in Conference Proceedings from the IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
(2018), M-I.1
21. K. Zoschke, M. Wegner, M. Wilke, N. Jürgensen, C. Lopper, I. Kuna, V. Glaw, J. Röder1,
O. Wünsch1, M.J. Wolf, O. Ehrmann, H. Reichl, in Conference Proceedings from the 60th
Electronic Components and Technology Conference (ECTC) (2010), p. 1385
22. C.-H. Liu, J.-L. Tsai, C. Hung-Hsien, C.-L. Lu, S.-C. Chen, in Conference Proceedings from
the 64th Electronic Components and Technology Conference (ECTC) (2014), p. 1628
23. C.-H. Liu, Y.-H. Liao, W.-T. Chen, C.-L. Lu, S.-C. Chen, in Conference Proceedings from the
65th Electronic Components and Technology Conference (ECTC) (2015), p. 1502
24. N. Nabiollahi, N. Moelans, M. Gonzalez, J.D. Messemaeker, C.J. Wilson, K. Croes, E. Beyne,
I.D. Wolf, Microelectr. Reliab. 765 (2015)