278
S. Lee
Fig. 10.19 DSC Plots:
(a) heat flow of epoxy flux
measured at different heating
rates, (b) different constant
temperatures, and (c) solder
wetting with no solder
wetting in epoxy flux [1, 27]
(a)
(b)
(c)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
35
61
87
114
140
166
192
218
Temperature (C)
Heat flow (W/g)
With Solder
WO Solder