270
S. Lee
Fig. 10.12 Temperature gradient of bond head and bond stage [16]
than −50 °C/s in free air. The expected cooling rate is approximately −50 °C/s
with a full load. Constant vacuum pressure and real-time monitoring system should
be employed into TCB tool to ensure that the die and substrate are held flat firmly
during bonding process. The monitoring system can be considered as a process
gauge because vacuum leakage can indicate the presence of foreign materials on the
bonding stage or other anomalies during bonding process.
10.2.2.3 Thermal Compression Bonding Process
Figure 10.13 shows a typical process profile of temperature, force, and displacement
for the TCB head in a bonding cycle. These three factors are most significant process
S. Lee
Fig. 10.12 Temperature gradient of bond head and bond stage [16]
than −50 °C/s in free air. The expected cooling rate is approximately −50 °C/s
with a full load. Constant vacuum pressure and real-time monitoring system should
be employed into TCB tool to ensure that the die and substrate are held flat firmly
during bonding process. The monitoring system can be considered as a process
gauge because vacuum leakage can indicate the presence of foreign materials on the
bonding stage or other anomalies during bonding process.
10.2.2.3 Thermal Compression Bonding Process
Figure 10.13 shows a typical process profile of temperature, force, and displacement
for the TCB head in a bonding cycle. These three factors are most significant process