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32. A. Yabuki, N. Arriffin, Electrical conductivity of copper nanoparticle thin films annealed at
low temperature. Thin Solid Films 518(23), 7033–7037 (2010)
33. J. Kahler et al., Sintering of copper particles for die attach. IEEE Trans. Compon. Packag.
Manuf. Technol. 2(10), 1587–1591 (2012)
34. T. Ishizaki et al., Thermal characterizations of Cu nanoparticle joints for power semiconductor
devices. Microelectron. Reliab. 53(9–11), 1543–1547 (2013)
35. J.-W. Yoon, J.-H. Back, Effect of sintering conditions on the mechanical strength of Cu-sintered
joints for high-power applications. Materials 11(11), 2105 (2018)
36. S. Jeong et al., Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and
their application to printed graphene transistors. J. Mater. Chem. C 1(15), 2704–2710 (2013)
37. Y. Gao et al., Die bonding performance using bimodal Cu particle paste under different sintering
atmospheres. J. Electron. Mater. 46(7), 4575–4581 (2017)
38. Y. Gao et al., Novel copper particle paste with self-reduction and self-protection characteristics
for die attachment of power semiconductor under a nitrogen atmosphere. Mater. Des. 160,
1265–1272 (2018)
39. A.A. Zinn, in Lead Solder-Free Electronics. (Google Patents, 2012)
40. M.J. Davis, A. McGregor, Assessing adhesive bond failures: mixed-mode bond failures
explained. in ISASI Australian Safety Seminar, Canberra (2010)
Y. Dai and C. S. Tan
31. G.V. Franks, F.F. Lange, Plastic-to-brittle transition of saturated, alumina powder compacts. J.
Am. Ceram. Soc. 79(12), 3161–3168 (1996)
32. A. Yabuki, N. Arriffin, Electrical conductivity of copper nanoparticle thin films annealed at
low temperature. Thin Solid Films 518(23), 7033–7037 (2010)
33. J. Kahler et al., Sintering of copper particles for die attach. IEEE Trans. Compon. Packag.
Manuf. Technol. 2(10), 1587–1591 (2012)
34. T. Ishizaki et al., Thermal characterizations of Cu nanoparticle joints for power semiconductor
devices. Microelectron. Reliab. 53(9–11), 1543–1547 (2013)
35. J.-W. Yoon, J.-H. Back, Effect of sintering conditions on the mechanical strength of Cu-sintered
joints for high-power applications. Materials 11(11), 2105 (2018)
36. S. Jeong et al., Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and
their application to printed graphene transistors. J. Mater. Chem. C 1(15), 2704–2710 (2013)
37. Y. Gao et al., Die bonding performance using bimodal Cu particle paste under different sintering
atmospheres. J. Electron. Mater. 46(7), 4575–4581 (2017)
38. Y. Gao et al., Novel copper particle paste with self-reduction and self-protection characteristics
for die attachment of power semiconductor under a nitrogen atmosphere. Mater. Des. 160,
1265–1272 (2018)
39. A.A. Zinn, in Lead Solder-Free Electronics. (Google Patents, 2012)
40. M.J. Davis, A. McGregor, Assessing adhesive bond failures: mixed-mode bond failures
explained. in ISASI Australian Safety Seminar, Canberra (2010)