9 Copper Micro and Nano Particles Mixture for 3D Interconnection …
257
4. Y. Xie et al., Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2)
power chips for electronics packaging. J. Mater. Process. Technol. 255, 644–649 (2018)
5. C. Luk, Y. Chan, K. Hung, Development of gold to gold interconnection flip chip bonding for
chip on suspension assemblies. Microelectron. Reliab. 42(3), 381–389 (2002)
6. T.C. Wei, A.R. Daud, Mechanical and electrical properties of Au-Al and Cu-Al intermetallics
layer at wire bonding interface. J. Electron. Packag. 125(4), 617–620 (2003)
7. J. Kim, C.C. Lee, Fluxless Sn–Ag bonding in vacuum using electroplated layers. Mater. Sci.
Eng., A 448(1–2), 345–350 (2007)
8. C. Yun, et al., Al to Al wafer bonding for MEMS encapsulation and 3-D interconnect. in 2008
IEEE 21st International Conference on Micro Electro Mechanical Systems. (IEEE, 2008)
9. L. Zhang et al., Materials, processing and reliability of low temperature bonding in 3D chip
stacking. J. Alloy. Compd. 750, 980–995 (2018)
10. P. Naik, in Principles of Physics. (PHI Learning Pvt. Ltd., 2012)
11. D.C. Giancoli, D.C. Giancoli, Physics for Scientists and Engineers with Modern Physics, vol.
130215171 (Prentice Hall, Upper Saddle River, NJ, 2000)
12. A.M. James, M.P. Lord, in Macmillan’s chemical and physical data. (Macmillan, 1992)
13. A. Damian, Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D
Interconnect Fabrication (2013)
14. P. Gueguen et al., Copper direct-bonding characterization and its interests for 3D integration.
J. Electrochem. Soc. 156(10), H772–H776 (2009)
15. C.M. Hong, S. Wagner, Inkjet printed copper source/drain metallization for amorphous silicon
thin-film transistors. IEEE Electron Device Lett. 21(8), 384–386 (2000)
16. H.S. Chin, K.Y. Cheong, A.B. Ismail, A review on die attach materials for SiC-based hightemperature power devices. Metallur. Mater. Trans. B 41(4), 824–832 (2010)
17. C.D. Zou, et al., Nanoparticles of the lead-free solder alloy Sn-3.0 Ag-0.5 Cu with large melting
temperature depression. J. Electron. Mater. 38(2), 351–355 (2009)
18. K.-S. Moon et al., Thermal behavior of silver nanoparticles for low-temperature interconnect
applications. J. Electron. Mater. 34(2), 168–175 (2005)
19. R. Zhang et al., Preparation of highly conductive polymer nanocomposites by low temperature
sintering of silver nanoparticles. J. Mater. Chem. 20(10), 2018–2023 (2010)
20. D. Wakuda, K.-S. Kim, K. Suganuma, Ag nanoparticle paste synthesis for room temperature
bonding. IEEE Trans. Compon. Packag. Technol. 33(2), 437–442 (2009)
21. Y. Mou et al., Cu–Cu bonding enhancement at low temperature by using carboxylic acid
surface-modified Cu nanoparticles. Mater. Lett. 227, 179–183 (2018)
22. J. Li et al., Low-temperature and low-pressure Cu–Cu bonding by highly sinterable Cu
nanoparticle paste. Nanoscale Res. Lett. 12(1), 255 (2017)
23. S. Park, et al., Low-pressure sintering bonding with Cu and CuO flake paste for power devices.
in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). (IEEE, 2014)
24. Y.S. Eom et al., Characterization of a hybrid Cu paste as an isotropic conductive adhesive.
ETRI J. 33(6), 864–870 (2011)
25. Y.S. Eom et al., Electrical interconnection with a smart ACA composed of fluxing polymer and
solder powder. ETRI J. 32(3), 414–421 (2010)
26. Y.-S. Eom et al., Electrical and mechanical characterization of an anisotropic conductive
adhesive with a low melting point solder. Microelectron. Eng. 85(11), 2202–2206 (2008)
27. X. Liu, H. Nishikawa, Improved joint strength with sintering bonding using microscale Cu
particles by an oxidation-reduction process. in 2016 IEEE 66th Electronic Components and
Technology Conference (ECTC). (IEEE, 2016)
28. S. Park et al., Surface modification of Cu flakes through Ag precipitation for low-temperature
pressureless sintering bonding. Mater. Lett. 151, 68–71 (2015)
29. L.-N. Ho, H. Nishikawa, Surfactant-free synthesis of copper particles for electrically conductive
adhesive applications. J. Electron. Mater. 41(9), 2527–2532 (2012)
30. T. Ishizaki et al., Reliability of Cu nanoparticle joint for high temperature power electronics.
Microelectron. Reliab. 54(9–10), 1867–1871 (2014)
257
4. Y. Xie et al., Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2)
power chips for electronics packaging. J. Mater. Process. Technol. 255, 644–649 (2018)
5. C. Luk, Y. Chan, K. Hung, Development of gold to gold interconnection flip chip bonding for
chip on suspension assemblies. Microelectron. Reliab. 42(3), 381–389 (2002)
6. T.C. Wei, A.R. Daud, Mechanical and electrical properties of Au-Al and Cu-Al intermetallics
layer at wire bonding interface. J. Electron. Packag. 125(4), 617–620 (2003)
7. J. Kim, C.C. Lee, Fluxless Sn–Ag bonding in vacuum using electroplated layers. Mater. Sci.
Eng., A 448(1–2), 345–350 (2007)
8. C. Yun, et al., Al to Al wafer bonding for MEMS encapsulation and 3-D interconnect. in 2008
IEEE 21st International Conference on Micro Electro Mechanical Systems. (IEEE, 2008)
9. L. Zhang et al., Materials, processing and reliability of low temperature bonding in 3D chip
stacking. J. Alloy. Compd. 750, 980–995 (2018)
10. P. Naik, in Principles of Physics. (PHI Learning Pvt. Ltd., 2012)
11. D.C. Giancoli, D.C. Giancoli, Physics for Scientists and Engineers with Modern Physics, vol.
130215171 (Prentice Hall, Upper Saddle River, NJ, 2000)
12. A.M. James, M.P. Lord, in Macmillan’s chemical and physical data. (Macmillan, 1992)
13. A. Damian, Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D
Interconnect Fabrication (2013)
14. P. Gueguen et al., Copper direct-bonding characterization and its interests for 3D integration.
J. Electrochem. Soc. 156(10), H772–H776 (2009)
15. C.M. Hong, S. Wagner, Inkjet printed copper source/drain metallization for amorphous silicon
thin-film transistors. IEEE Electron Device Lett. 21(8), 384–386 (2000)
16. H.S. Chin, K.Y. Cheong, A.B. Ismail, A review on die attach materials for SiC-based hightemperature power devices. Metallur. Mater. Trans. B 41(4), 824–832 (2010)
17. C.D. Zou, et al., Nanoparticles of the lead-free solder alloy Sn-3.0 Ag-0.5 Cu with large melting
temperature depression. J. Electron. Mater. 38(2), 351–355 (2009)
18. K.-S. Moon et al., Thermal behavior of silver nanoparticles for low-temperature interconnect
applications. J. Electron. Mater. 34(2), 168–175 (2005)
19. R. Zhang et al., Preparation of highly conductive polymer nanocomposites by low temperature
sintering of silver nanoparticles. J. Mater. Chem. 20(10), 2018–2023 (2010)
20. D. Wakuda, K.-S. Kim, K. Suganuma, Ag nanoparticle paste synthesis for room temperature
bonding. IEEE Trans. Compon. Packag. Technol. 33(2), 437–442 (2009)
21. Y. Mou et al., Cu–Cu bonding enhancement at low temperature by using carboxylic acid
surface-modified Cu nanoparticles. Mater. Lett. 227, 179–183 (2018)
22. J. Li et al., Low-temperature and low-pressure Cu–Cu bonding by highly sinterable Cu
nanoparticle paste. Nanoscale Res. Lett. 12(1), 255 (2017)
23. S. Park, et al., Low-pressure sintering bonding with Cu and CuO flake paste for power devices.
in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). (IEEE, 2014)
24. Y.S. Eom et al., Characterization of a hybrid Cu paste as an isotropic conductive adhesive.
ETRI J. 33(6), 864–870 (2011)
25. Y.S. Eom et al., Electrical interconnection with a smart ACA composed of fluxing polymer and
solder powder. ETRI J. 32(3), 414–421 (2010)
26. Y.-S. Eom et al., Electrical and mechanical characterization of an anisotropic conductive
adhesive with a low melting point solder. Microelectron. Eng. 85(11), 2202–2206 (2008)
27. X. Liu, H. Nishikawa, Improved joint strength with sintering bonding using microscale Cu
particles by an oxidation-reduction process. in 2016 IEEE 66th Electronic Components and
Technology Conference (ECTC). (IEEE, 2016)
28. S. Park et al., Surface modification of Cu flakes through Ag precipitation for low-temperature
pressureless sintering bonding. Mater. Lett. 151, 68–71 (2015)
29. L.-N. Ho, H. Nishikawa, Surfactant-free synthesis of copper particles for electrically conductive
adhesive applications. J. Electron. Mater. 41(9), 2527–2532 (2012)
30. T. Ishizaki et al., Reliability of Cu nanoparticle joint for high temperature power electronics.
Microelectron. Reliab. 54(9–10), 1867–1871 (2014)