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97. J.H. Lau, L. Ming, N. Fan, R. Tse, Thermocompression bonding for flip-chip technology.
Chip Scale Rev. 19(5), 30–36 (2015)
98. Y. Jung, D. Ryu, M. Gim, C. Kim, Y. Song, J. Kim, J. Yoon and C. Lee, Development of next
generation flip chip interconnection technology using homogenized laser-assisted bonding,
in Electronic Components and Technology Conference, pp. 88–94, (2016)
99. C. Kim, Y. Jung, M. Kim, T. Yoon, Y. Song, S. Na, D. Park, B. Cho, D. Kang, K. Lim and
J. Khim, Development of extremely thin profile flip chip CSP using laser assisted bonding
technology, in 2017 IEEE CPMT Symposium Japan, pp. 45–49 (2017)
100. W.A. Braganca Jr., Y.-S. Eom, K.-S. Jang, S.H. Moon, H.-C. Bae, K.-S. Choi, Collective
laser-assisted bonding process for 3D TSV integration with NCP. ETRI J. 396–407 (2019)
101. Z. Zhang, C.P. Wong, Recent advances in flip-chip underfill: materials, process, and reliability.
IEEE Trans. Adv. Packag. 27(3), 515–524 (2004)
102. M.K. Schwiebert, W.H. Leong, Underfill flow as viscous flow between parallel plates driven
by capillary action. IEEE Trans. Compon. Packag. Manuf. Technol. C 19(2), 133–137 (1996)
103. H. Shi, Epoxy Dewetting Model, Private Communication