7 Fundamentals and Failures in Die Preparation for 3D Packaging
197
50. R. Huang, Kinetic wrinkling of an elastic film on a viscoelastic substrate. J. Mech. Phys.
Solids 53, 63–89 (2005)
51. K. Tamura, K. Nakada, N. Taneichi, P. Andry, J. Knickerbocker and C. Rosenthal, Novel
adhesive development for CMOS-compatible thin wafer handling, in Proceedings of the 60th
Electronic Components and Technology Conference (ECTC), pp. 1239–1244 (2010)
52. H. Mei, R. Huang, Concomitant wrinkling and buckle-delamination of elastic thin films on
compliant substrates. Mech. Mater. 43, 627–642 (2011)
53. H. Shi, Fundamentals and Failures in die preparation for 3D packaging, in 3D Microelectronic
Packaging: From Fundamentals to Applications (Springer, 2017), pp. 101–128
54. A. Phommahaxay, A. Jourdain, P. Bex, A. Van den Eede, B. Swinnen, G. Beyer, A. Miller,
E. Beyne, Evolution of temporary wafer (de)bonding technology towards low temperature
processes for enhanced 3D integration, in 2012 3rd IEEE International Workshop on Low
Temperature Bonding for 3D Integration, pp. 229–233 (2012)
55. W. Bair, Temporary bonding and debonding—an update on materials, in Handbook of 3D
Integration, Volume 3: 3D Process Technology (EBSCO Publishing, 2014), pp. 147–157
56. K. Abadie, P. Montméat, T. Enot, F. Fournel, M. Wimplinger, Application of temporary
adherence to improve the manufacturing of 3D thin silicon wafers. Int. J. Adhes. Adhes. 91,
123–130 (2019)
57. B.C.A.P. Webb, Simulation of thermal pulse evolution during laser debonding, in 2015
Electronic Components and Technology Conference, pp. 1423–1429 (2015)
58. N. Bityurin, B.S. Luk’yanchuk, M.H. Hong, T.C. Chong, Models for laser ablation of
polymers. Chem. Rev. 103, 519–552 (2003)
59. L. Torrisi, A. Borrielli, D. Margarone, Study on the ablation threshold induced by pulsed
lasers at different wavelengths. Nucl. Instrum. Method. Phy. Res. B 255, 373–379 (2007)
60. A. Phommahaxay, A. Nakamura, A. Jourdain, G. Verbinnen, Y. Kamochi, I. Koyama, Y. Iwai,
M. Sawano, S. Tan, A. Miller, G. Beyer, E. Sleeckx, E. Beyne, Demonstration of a novel
low cost single material temporary bond solution for high topography substrates based on a
mechanical wafer debonding and innovative adhesive removal, in Electronic Components &
Technology Conference, pp. 1430–1435 (2015)
61. B.A. Miller-Chou, J.L. Koeni, A review of polymer dissolution. Prog. Polym. Sci. 28, 1223–
1270 (2003)
62. R. Dahiya, G. Gottardi, N. Laidani, PDMS residues-free micro/macrostructures on flexible
substrates. Microelectron. Eng. 136, 57–62 (2015)
63. J. Li, H. Hwang, E.-C. Ahn, Q. Chen, P. Kim, T. Lee, M. Chung, T. Chung, Laser dicing
and subsequent die strength enhancement technologies for ultra-thin wafer, in Electronics
Components and Technology Conference, pp. 761–766 (2007)
64. C.M. Dunsky, Laser material processing in microelectronics manufacturing: status and near
term-term opportunities, in Proceedings of SPIE 5713, Photon Processing in Microelectronics
and Photonics IV, pp. 200–214 (2005)
65. S.Y. Luo, Z.W. Wang, Studies of chipping mechanisms for dicing silicon wafers. Int. J. Adv.
Manuf. 35, 1206–1218 (2008)
66. K.W. Shi, K.Y. Yow, “The characteristics and factors of a wafer dicing blade and its optimized
interactions required for singulation high metal stack LowK wafers, in IEEE 15th Electronics
Packaging Technology Conference (EPTC), pp. 208–212 (2013)
67. E. Fogarassy, S. Lazare, Laser Ablation of Electronic Materials (North-Holland, 1992)
68. J.C. Miller, Laser Ablation (Springer, 1994)
69. R.E. Russo, X.L. Mao, O.V. Borisvo, Laser Ablation Sampling. Trac-Trends Anal. Chem.
17(8–9), 461–469 (1988)
70. S.S. Mao, Experimental and Theoretical Studies of Picosecond Laser Interactions with
Electronic Materials-Laser Ablation (University of California, Berkeley, 2000)
71. J.R. Ho, C.P. Grigoropoulos, J.A.C. Humphrey, Computational study of heat transfer and gas
dynamics in the pulsed laser evaporation of metals. J. Appl. Phys. 78, 4606–4709 (1995)
72. G. Callies, P. Berger, H. Hugel, Time-resolved observation of gas-dynamic discontinuities
arising during excimer laser ablation and their interpretation. J. Phy. D, 794–806 (1995)
197
50. R. Huang, Kinetic wrinkling of an elastic film on a viscoelastic substrate. J. Mech. Phys.
Solids 53, 63–89 (2005)
51. K. Tamura, K. Nakada, N. Taneichi, P. Andry, J. Knickerbocker and C. Rosenthal, Novel
adhesive development for CMOS-compatible thin wafer handling, in Proceedings of the 60th
Electronic Components and Technology Conference (ECTC), pp. 1239–1244 (2010)
52. H. Mei, R. Huang, Concomitant wrinkling and buckle-delamination of elastic thin films on
compliant substrates. Mech. Mater. 43, 627–642 (2011)
53. H. Shi, Fundamentals and Failures in die preparation for 3D packaging, in 3D Microelectronic
Packaging: From Fundamentals to Applications (Springer, 2017), pp. 101–128
54. A. Phommahaxay, A. Jourdain, P. Bex, A. Van den Eede, B. Swinnen, G. Beyer, A. Miller,
E. Beyne, Evolution of temporary wafer (de)bonding technology towards low temperature
processes for enhanced 3D integration, in 2012 3rd IEEE International Workshop on Low
Temperature Bonding for 3D Integration, pp. 229–233 (2012)
55. W. Bair, Temporary bonding and debonding—an update on materials, in Handbook of 3D
Integration, Volume 3: 3D Process Technology (EBSCO Publishing, 2014), pp. 147–157
56. K. Abadie, P. Montméat, T. Enot, F. Fournel, M. Wimplinger, Application of temporary
adherence to improve the manufacturing of 3D thin silicon wafers. Int. J. Adhes. Adhes. 91,
123–130 (2019)
57. B.C.A.P. Webb, Simulation of thermal pulse evolution during laser debonding, in 2015
Electronic Components and Technology Conference, pp. 1423–1429 (2015)
58. N. Bityurin, B.S. Luk’yanchuk, M.H. Hong, T.C. Chong, Models for laser ablation of
polymers. Chem. Rev. 103, 519–552 (2003)
59. L. Torrisi, A. Borrielli, D. Margarone, Study on the ablation threshold induced by pulsed
lasers at different wavelengths. Nucl. Instrum. Method. Phy. Res. B 255, 373–379 (2007)
60. A. Phommahaxay, A. Nakamura, A. Jourdain, G. Verbinnen, Y. Kamochi, I. Koyama, Y. Iwai,
M. Sawano, S. Tan, A. Miller, G. Beyer, E. Sleeckx, E. Beyne, Demonstration of a novel
low cost single material temporary bond solution for high topography substrates based on a
mechanical wafer debonding and innovative adhesive removal, in Electronic Components &
Technology Conference, pp. 1430–1435 (2015)
61. B.A. Miller-Chou, J.L. Koeni, A review of polymer dissolution. Prog. Polym. Sci. 28, 1223–
1270 (2003)
62. R. Dahiya, G. Gottardi, N. Laidani, PDMS residues-free micro/macrostructures on flexible
substrates. Microelectron. Eng. 136, 57–62 (2015)
63. J. Li, H. Hwang, E.-C. Ahn, Q. Chen, P. Kim, T. Lee, M. Chung, T. Chung, Laser dicing
and subsequent die strength enhancement technologies for ultra-thin wafer, in Electronics
Components and Technology Conference, pp. 761–766 (2007)
64. C.M. Dunsky, Laser material processing in microelectronics manufacturing: status and near
term-term opportunities, in Proceedings of SPIE 5713, Photon Processing in Microelectronics
and Photonics IV, pp. 200–214 (2005)
65. S.Y. Luo, Z.W. Wang, Studies of chipping mechanisms for dicing silicon wafers. Int. J. Adv.
Manuf. 35, 1206–1218 (2008)
66. K.W. Shi, K.Y. Yow, “The characteristics and factors of a wafer dicing blade and its optimized
interactions required for singulation high metal stack LowK wafers, in IEEE 15th Electronics
Packaging Technology Conference (EPTC), pp. 208–212 (2013)
67. E. Fogarassy, S. Lazare, Laser Ablation of Electronic Materials (North-Holland, 1992)
68. J.C. Miller, Laser Ablation (Springer, 1994)
69. R.E. Russo, X.L. Mao, O.V. Borisvo, Laser Ablation Sampling. Trac-Trends Anal. Chem.
17(8–9), 461–469 (1988)
70. S.S. Mao, Experimental and Theoretical Studies of Picosecond Laser Interactions with
Electronic Materials-Laser Ablation (University of California, Berkeley, 2000)
71. J.R. Ho, C.P. Grigoropoulos, J.A.C. Humphrey, Computational study of heat transfer and gas
dynamics in the pulsed laser evaporation of metals. J. Appl. Phys. 78, 4606–4709 (1995)
72. G. Callies, P. Berger, H. Hugel, Time-resolved observation of gas-dynamic discontinuities
arising during excimer laser ablation and their interpretation. J. Phy. D, 794–806 (1995)