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31. J. An, K. Moon, S. Lee, D. Lee, K. Yun, B. Park, H. Lee, J. Sue, Y. Park, G. Choi, H. Kang, C.
Chung, Annealing process and structural considerations in controlling extrusion-type defects
Cu TSV, in IEEE International Interconnect Technology Conference, pp. 1–3 (2012)
32. F. Inoue, T. Shimizu, R. Arima, H. Miyake, S. Shingubara, Electroless deposition of barrier
and seed layers for via last Cu-TSV metalization, in IEEE International Meeting for Future
of Electron Devices, Kansai (IMFEDK), pp. 1–3 (2012)
33. B. Dang, P. Andry, C. Tsang, J. Maria, R. Polastre, R. Trzcinski, A. Prabhakar, J. Knickerbocker, CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration, in Electronic Components and
Technology Conference, pp. 1393–1398 (2010)
34. A. Phommahaxay, G. Potoms, G. Verbinnen, E. Sleeckx, G. Beyer, E. Beyne, A. Guerrero,
D. Bai, X. Liu, K. Yess, K. Arnold, W. Spiess, T. Griesbach, T. Rapps, S. Lutter, Extremely
low-force debonding of thinned CMOS substrate by laser release of a temporary bonding
material, in IEEE 66th Electronic Components and Technology Conference, pp. 1685–1690
(2016)
35. M. Privett, F. Murauer, J. Burggraf, S. Pargfrieder, TSV thinned wafer debonding process
optimization, in IWLPC (Wafer-Level Packaging) Conference Proceedings, pp. 144–148
(2008)
36. B. Dang, B. Webb, C. Tsang, P. Andry, J. Knickerbocker, Factors in the selection of temporary wafer handlers for 3D/2.5D integration, in 2014 IEEE 64th Electronic Components and
Technology Conference (ECTC), pp. 576–581 (2014)
37. T. Mori, T. Yamaguchi, Y. Maruyama, K. Hasegawa, S. Kusumoto, Material Development
for 3D wafer bond and de-bonding process, in 2015 Electronic Components and Technology
Conference, pp. 899–905 (2015)
38. K. Hasegawa, T. Mori, H. Mizuno, H. Ishii, Y. Maruyama, K. Ohkita, Laser releasable temporary bond/de-bond materials for next 3D packages, in 2017 Pan Pacific Microelectronics
Symposium (Pan Pacific), pp. 1–7 (2017)
39. B. Dang, T. Wassick, Y. Liu, Q. Chen, P. Andry, L. Hung, H. Zhang, J. Gelorme, J. Knickerbocker, Feasibility study of si handler debonding by laser release, in 2016 IEEE 66th Electronic
Components and Technology Conference, pp. 1671–1677 (2016)
40. M. Tyona, A theoritical study on spin coating technique. Adv. Mater. Res. 2(4), 195–208
(2013)
41. S. Hellstrom, Published Course Work for Physics, vol. 210 (Stanford University, Autumn,
2007)
42. F. Niklaus, P. Enoksson, E. Kalvesten, G. Stemme, Void-free full wafer adhesive bonding, in
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical
Systems, pp. 247–252 (2000)
43. N. Sahu, B. Parija, S. Panigrahi, Fundamental understanding and modeling of spin coating
process: a review. Indian J. Phys. 83(4), 493–502 (2009)
44. N. Atthi, O. Nimittrakoolchai, W. Jeamsaksiri, S. Supothina, Study of optimization condition
for spin coating of the photoresist film on rectangular substrate by Taguchi design of an
experiment. Songklanakarin J. Sci. Technol. 31(3), 25 (2009)
45. Q. Wang, D. Yu, F. Jiang, H. Liu, X. Jing, The effect of temporary bonding on post processing
in TSV. Microsyst. Technol. 21, 749–755 (2015)
46. P. Montmeat, T. Enot, G. Louro De Oliveira, F. Fournel, Polymer bonding temperature impact
on bonded stack morphology and adherence energy. Microsyst. Technol. 24, 793–799 (2018)
47. H. Ishida, S. Lutter, Permanent wafer bonding and temporary wafer bonding/de-bonding
technology using temperature resistant polymers. J. Photopolym. Sci. Technol. 27(2), 173–176
(2014)
48. M. Vagues, Analysing backside chipping issues of the die at wafer saw. Partial Fulfillment of
MatE 234, 1–23 (2003)
49. H. Mei, R. Huang, J.Y. Chung, C.M. Stafford, H.-H. Yu, Buckling modes of elastic thin films
on elastic substrates. Appl. Phys. Lett. 90, 151902 (2007)
H. Ma et al.
31. J. An, K. Moon, S. Lee, D. Lee, K. Yun, B. Park, H. Lee, J. Sue, Y. Park, G. Choi, H. Kang, C.
Chung, Annealing process and structural considerations in controlling extrusion-type defects
Cu TSV, in IEEE International Interconnect Technology Conference, pp. 1–3 (2012)
32. F. Inoue, T. Shimizu, R. Arima, H. Miyake, S. Shingubara, Electroless deposition of barrier
and seed layers for via last Cu-TSV metalization, in IEEE International Meeting for Future
of Electron Devices, Kansai (IMFEDK), pp. 1–3 (2012)
33. B. Dang, P. Andry, C. Tsang, J. Maria, R. Polastre, R. Trzcinski, A. Prabhakar, J. Knickerbocker, CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration, in Electronic Components and
Technology Conference, pp. 1393–1398 (2010)
34. A. Phommahaxay, G. Potoms, G. Verbinnen, E. Sleeckx, G. Beyer, E. Beyne, A. Guerrero,
D. Bai, X. Liu, K. Yess, K. Arnold, W. Spiess, T. Griesbach, T. Rapps, S. Lutter, Extremely
low-force debonding of thinned CMOS substrate by laser release of a temporary bonding
material, in IEEE 66th Electronic Components and Technology Conference, pp. 1685–1690
(2016)
35. M. Privett, F. Murauer, J. Burggraf, S. Pargfrieder, TSV thinned wafer debonding process
optimization, in IWLPC (Wafer-Level Packaging) Conference Proceedings, pp. 144–148
(2008)
36. B. Dang, B. Webb, C. Tsang, P. Andry, J. Knickerbocker, Factors in the selection of temporary wafer handlers for 3D/2.5D integration, in 2014 IEEE 64th Electronic Components and
Technology Conference (ECTC), pp. 576–581 (2014)
37. T. Mori, T. Yamaguchi, Y. Maruyama, K. Hasegawa, S. Kusumoto, Material Development
for 3D wafer bond and de-bonding process, in 2015 Electronic Components and Technology
Conference, pp. 899–905 (2015)
38. K. Hasegawa, T. Mori, H. Mizuno, H. Ishii, Y. Maruyama, K. Ohkita, Laser releasable temporary bond/de-bond materials for next 3D packages, in 2017 Pan Pacific Microelectronics
Symposium (Pan Pacific), pp. 1–7 (2017)
39. B. Dang, T. Wassick, Y. Liu, Q. Chen, P. Andry, L. Hung, H. Zhang, J. Gelorme, J. Knickerbocker, Feasibility study of si handler debonding by laser release, in 2016 IEEE 66th Electronic
Components and Technology Conference, pp. 1671–1677 (2016)
40. M. Tyona, A theoritical study on spin coating technique. Adv. Mater. Res. 2(4), 195–208
(2013)
41. S. Hellstrom, Published Course Work for Physics, vol. 210 (Stanford University, Autumn,
2007)
42. F. Niklaus, P. Enoksson, E. Kalvesten, G. Stemme, Void-free full wafer adhesive bonding, in
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical
Systems, pp. 247–252 (2000)
43. N. Sahu, B. Parija, S. Panigrahi, Fundamental understanding and modeling of spin coating
process: a review. Indian J. Phys. 83(4), 493–502 (2009)
44. N. Atthi, O. Nimittrakoolchai, W. Jeamsaksiri, S. Supothina, Study of optimization condition
for spin coating of the photoresist film on rectangular substrate by Taguchi design of an
experiment. Songklanakarin J. Sci. Technol. 31(3), 25 (2009)
45. Q. Wang, D. Yu, F. Jiang, H. Liu, X. Jing, The effect of temporary bonding on post processing
in TSV. Microsyst. Technol. 21, 749–755 (2015)
46. P. Montmeat, T. Enot, G. Louro De Oliveira, F. Fournel, Polymer bonding temperature impact
on bonded stack morphology and adherence energy. Microsyst. Technol. 24, 793–799 (2018)
47. H. Ishida, S. Lutter, Permanent wafer bonding and temporary wafer bonding/de-bonding
technology using temperature resistant polymers. J. Photopolym. Sci. Technol. 27(2), 173–176
(2014)
48. M. Vagues, Analysing backside chipping issues of the die at wafer saw. Partial Fulfillment of
MatE 234, 1–23 (2003)
49. H. Mei, R. Huang, J.Y. Chung, C.M. Stafford, H.-H. Yu, Buckling modes of elastic thin films
on elastic substrates. Appl. Phys. Lett. 90, 151902 (2007)