188
H. Ma et al.
Fig. 7.26 Schematic drawing of die pick (a) single needle, (b) potential die bending, (c) multi
needle assembly with more even ejection and (d) shows the die crack due to die bending. (Color
figure online)
Fig. 7.27 Von Mises stress contour for the IC chip. (Color figure online) [92]
H. Ma et al.
Fig. 7.26 Schematic drawing of die pick (a) single needle, (b) potential die bending, (c) multi
needle assembly with more even ejection and (d) shows the die crack due to die bending. (Color
figure online)
Fig. 7.27 Von Mises stress contour for the IC chip. (Color figure online) [92]