7 Fundamentals and Failures in Die Preparation for 3D Packaging
173
Side View
Top View
Wafer 1
Wafer 2
Adhesive
Load
H
Viscosity
Thickness
F
Velocity
O
O’
X
Y
r
r
r
r
0
X
Wafer 1
Wafer 2
A
Effective contact area
Fig. 7.13 Schematic drawing of thermal sliding debonding process. (Color figure online)
Thermal sliding debonding process can be force control, velocity control, or
mixture of force control and velocity control. During force control debonding
process, a constant force is applied. During velocity control debonding process,
a constant velocity is applied. If debonding process starts as force control at time
zero, by solving Eq. (7.5) and use initial condition
θ(t = 0) = π
(7.6)
we can have a close-formed solution
t =
ηr
3
F H
2θ cos(
θ
2
) − 4 sin(
θ
2
) + sin
3
(
θ
2
)
+ C 0
(7.7)
173
Side View
Top View
Wafer 1
Wafer 2
Adhesive
Load
H
Viscosity
Thickness
F
Velocity
O
O’
X
Y
r
r
r
r
0
X
Wafer 1
Wafer 2
A
Effective contact area
Fig. 7.13 Schematic drawing of thermal sliding debonding process. (Color figure online)
Thermal sliding debonding process can be force control, velocity control, or
mixture of force control and velocity control. During force control debonding
process, a constant force is applied. During velocity control debonding process,
a constant velocity is applied. If debonding process starts as force control at time
zero, by solving Eq. (7.5) and use initial condition
θ(t = 0) = π
(7.6)
we can have a close-formed solution
t =
ηr
3
F H
2θ cos(
θ
2
) − 4 sin(
θ
2
) + sin
3
(
θ
2
)
+ C 0
(7.7)