Contributors
Liangbiao Chen ON Semiconductor, 82 Running Hill Rd, South Portland, ME,
USA
Paul Conway The Wolfson School of Mechanical, Electrical and Manufacturing
Engineering, Loughborough University, Loughborough, Leicestershire, UK
Yuanyuan Dai Nanyang Technological University, Singapore, Singapore
Indranath Dutta School of Mechanical and Materials Engineering, Washington
State University, Pullman, WA, USA
Xuejun Fan Department of Mechanical Engineering, Lamar University,
Beaumont, TX, USA
Amlan Ganguly Computer Engineering Department, Rochester Institute of
Technology, Rochester, NY, USA
Deepak Goyal Intel Corporation, Chandler, AZ, USA
Ran He The University of Tokyo, Tokyo, Japan
Zhiheng Huang School of Materials Science and Engineering, Sun Yat-sen
University, Guangzhou, China
Tengfei Jiang Department of Material Science and Engineering, University of
Central Florida, Orlando, FL, USA
Satish G. Kandlikar Mechanical Engineering Department, Rochester Institute of
Technology, Rochester, NY, USA
Praveen Kumar Department of Materials Engineering, Indian Institute of Science,
Bangalore, India
Antonio La Manna IMEC, Louvain, Belgium
Sangil Lee Invensas Corporation, San Jose, CA, USA
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