Tae-Kyu Lee Department of Mechanical and Materials Engineering, Portland
State University, Portland, OR, USA
Menglu Li Department of Materials Science and Engineering, UCLA, Los
Angeles, CA, USA
Yan Li Intel Corporation, Chandler, AZ, USA
Kwang-Lung Lin Department of Materials Science and Engineering, National
Cheng Kung University, Tainan, Taiwan, ROC
Jinxin Liu School of Materials Science and Engineering, Sun Yat-sen University,
Guangzhou, China
Pilin Liu Intel Corporation, Chandler, AZ, USA
Yang Liu School of Electronics and Information Technology, Sun Yat-sen
University, Guangzhou, China
Yingxia Liu Department of Materials Science and Engineering, UCLA, Los
Angeles, CA, USA
Huan Ma Intel Corporation, Hillsboro, OR, USA
Ravi Mahajan Intel Fellow, High Density Interconnect Pathfinding, Assembly
Technology, Intel Corporation, Chandler, AZ, USA
Mike Neilsen Sandia National Laboratories, Albuquerque, NM, USA
Erasenthiran Poonjolai Intel Corporation, Chandler, AZ, USA
Bob Sankman Retired Intel Fellow, High Density Interconnect Pathfinding,
Assembly Technology, Intel Corporation, Chandler, AZ, USA
Hualiang Shi Intel Corporation, Chandler, AZ, USA
Songhua Shi Medtronic, Tempe, AZ, USA
Sai Vadlamani Intel Corporation, Chandler, AZ, USA
Tadatomo Suga The University of Tokyo, Tokyo, Japan
Chuan Seng Tan Nanyang Technological University, Singapore, Singapore
Peter Tortorici Medtronic, Tempe, AZ, USA
Prithwish Chatterjee Intel Corporation, Chandler, AZ, USA
K. N. Tu Department of Materials Science and Engineering, UCLA, Los Angeles,
CA, USA
George Vakanas Intel Corporation, Santa Clara, CA, USA
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Contributors