100
P. Kumar et al.
Acknowledgements The authors (PK & ID) acknowledge financial support for some of the reported work by the National Science Foundation (DMR-0513874 and DMR-1309843), Cisco
Research Council and the Semiconductor Research Corporation. The contributions of, and collaborations with several colleagues (Dr. Lutz Meinshausen, formerly of Washington State University, and
currently at Global Foundries, Dresden, Germany; Dr. Tae-Kyu Lee, formerly of Cisco Systems, and
currently at Portland State University; Dr. Ravi Mahajan of Intel Corporation; Dr. Vijay Sarihan of
Freescale Semiconductor, and Professor Muhannad Bakir of Georgia Tech) are gratefully acknowledged. The assistance of current and former colleagues (Dr. Hanry Yang of Washington State
University, and Dr. Zhe Huang, formerly of Washington State University, and currently at Seagate
Technologies) with the literature survey is also gratefully acknowledged. The author (ZH) acknowledges financial support for his research by the Pearl River Science and Technology Nova Program
of Guangzhou under grant no. 2012J2200074, the National Natural Science Foundation of China
(NSFC) under grant no. 51004118, and Guangdong Natural Science Foundation under grant no.
2015A030312011. The author (ZH) also acknowledges useful discussions with Dr. F. Roters of Max
Planck Institute for Iron Research on the CPFE method and Prof. N. Provatas of McGill University
on phase crystal models. The editors would like to thank George Vakanas from Intel Corporation
for his critical review of this Chapter.
References
1. H.J. Bunge, R.A. Schwarzer, Orientation stereology—a new branch in texture research. Adv.
Eng. Mater. 3, 25–39 (2001)
2. H.J. Bunge, Texture Analysis in Materials Science—Mathematical Methods (Butterworth &
Co, London, 1982)
3. T. Hrncir, J. Dluhos, L. Hladik, E. Moyal, Advances in FIB-SEM analysis of TSV and solder
bumps—approaching higher precision, throughput and comprehensiveness, in IST-FA 2014:
Proceedings of the 40th International Symposium for Testing and Failure Analysis (Houston,
Texas, USA, November 2014)
4. B. Wu, A. Kumar, S. Pamarthy, High aspect ratio silicon etch: a review. J. App. Phys. 108,
051101 (2010)
5. L.B. Mauer, J. Taddei, R. Yousself, Wet silicon etch process for TSV reveal, in Electronic
Components and Technology Conference, IEEE, p. 878 (2014)
6. C. Okoro, K. Vanstreels, R. Labie, O. Luhn, B. Vandevelde, B. Verlinden, D. Vandepitte,
Influence of annealing condition on the mechanical and microstructural behavior of electroplated Cu-TSV. J. Micromech. Microeng. 20, 045032 (2010)
7. H. Wang, P. Cheng, H. Wang, R. Liu, L. Sun, Q. Rao, Z. Wang, T. Gu, G. Ding, Effect of current
density on microstructure and mechanical property of Cu micro-cylinders electrode-posited in
through silicon vias. Mater. Charact. 109, 164–172 (2015)
8. K.E. Elder, M. Grant, Modeling elastic and plastic deformations in nonequilibrium processing
using phase field crystals. Phys. Rev. E 70, 051605 (2004)
9. P. Stefanovic, M. Haataja, N. Provatas, Phase field crystal study of deformation and plasticity
in nanocrystalline materials. Phys. Rev. E 80, 046107 (2009)
10. Natinoal Science and Technology Council, Materials genome initiative for global competitiveness. National Science and Technology Council, Washington, D.C. (2011). http://www.
mgi.gov. Accessed 21 June 2016
11. S.R. Kalidindi, M. De Graef, Materials data science: current status and future outlook. Annu.
Rev. Mater. Res. 45, 171–193 (2015)
P. Kumar et al.
Acknowledgements The authors (PK & ID) acknowledge financial support for some of the reported work by the National Science Foundation (DMR-0513874 and DMR-1309843), Cisco
Research Council and the Semiconductor Research Corporation. The contributions of, and collaborations with several colleagues (Dr. Lutz Meinshausen, formerly of Washington State University, and
currently at Global Foundries, Dresden, Germany; Dr. Tae-Kyu Lee, formerly of Cisco Systems, and
currently at Portland State University; Dr. Ravi Mahajan of Intel Corporation; Dr. Vijay Sarihan of
Freescale Semiconductor, and Professor Muhannad Bakir of Georgia Tech) are gratefully acknowledged. The assistance of current and former colleagues (Dr. Hanry Yang of Washington State
University, and Dr. Zhe Huang, formerly of Washington State University, and currently at Seagate
Technologies) with the literature survey is also gratefully acknowledged. The author (ZH) acknowledges financial support for his research by the Pearl River Science and Technology Nova Program
of Guangzhou under grant no. 2012J2200074, the National Natural Science Foundation of China
(NSFC) under grant no. 51004118, and Guangdong Natural Science Foundation under grant no.
2015A030312011. The author (ZH) also acknowledges useful discussions with Dr. F. Roters of Max
Planck Institute for Iron Research on the CPFE method and Prof. N. Provatas of McGill University
on phase crystal models. The editors would like to thank George Vakanas from Intel Corporation
for his critical review of this Chapter.
References
1. H.J. Bunge, R.A. Schwarzer, Orientation stereology—a new branch in texture research. Adv.
Eng. Mater. 3, 25–39 (2001)
2. H.J. Bunge, Texture Analysis in Materials Science—Mathematical Methods (Butterworth &
Co, London, 1982)
3. T. Hrncir, J. Dluhos, L. Hladik, E. Moyal, Advances in FIB-SEM analysis of TSV and solder
bumps—approaching higher precision, throughput and comprehensiveness, in IST-FA 2014:
Proceedings of the 40th International Symposium for Testing and Failure Analysis (Houston,
Texas, USA, November 2014)
4. B. Wu, A. Kumar, S. Pamarthy, High aspect ratio silicon etch: a review. J. App. Phys. 108,
051101 (2010)
5. L.B. Mauer, J. Taddei, R. Yousself, Wet silicon etch process for TSV reveal, in Electronic
Components and Technology Conference, IEEE, p. 878 (2014)
6. C. Okoro, K. Vanstreels, R. Labie, O. Luhn, B. Vandevelde, B. Verlinden, D. Vandepitte,
Influence of annealing condition on the mechanical and microstructural behavior of electroplated Cu-TSV. J. Micromech. Microeng. 20, 045032 (2010)
7. H. Wang, P. Cheng, H. Wang, R. Liu, L. Sun, Q. Rao, Z. Wang, T. Gu, G. Ding, Effect of current
density on microstructure and mechanical property of Cu micro-cylinders electrode-posited in
through silicon vias. Mater. Charact. 109, 164–172 (2015)
8. K.E. Elder, M. Grant, Modeling elastic and plastic deformations in nonequilibrium processing
using phase field crystals. Phys. Rev. E 70, 051605 (2004)
9. P. Stefanovic, M. Haataja, N. Provatas, Phase field crystal study of deformation and plasticity
in nanocrystalline materials. Phys. Rev. E 80, 046107 (2009)
10. Natinoal Science and Technology Council, Materials genome initiative for global competitiveness. National Science and Technology Council, Washington, D.C. (2011). http://www.
mgi.gov. Accessed 21 June 2016
11. S.R. Kalidindi, M. De Graef, Materials data science: current status and future outlook. Annu.
Rev. Mater. Res. 45, 171–193 (2015)