4.3 Non-UPD Deposition of Ultrathin Metallic Layers
117
Table 4.3
Atomic-scale observations of ultrathin electrodeposited layers unrelated to UPD processes
Substrate (method)
Deposit Solution
Overvoltage
Growth characteristics
References
Au(111)
reconstructed
(STM)
Ni
NiSO
4
+ H
3 BO
3
+ HCl
NiSO
4
Ni(NO
3 )
2
η > 80 mV
Layer-by-layer growth up to 5 ML
(all solutions)
[171]
Fe
FeSO
4
+ K
2 SO
4
+ H
2 SO
4
+ KCl
η > 200 mV
Fe forms bcc structure at d
> 3
ML; uniaxially strained deposit
[178]
FeSO
4
+ K
2 SO
4
+ H
2 SO
4
+ KCl
η > 200 mV
Simultaneous growth of a few
atomic layers;
2 ML fcc then bcc crystal structure
[172]
Co
CoSO
4
+ KCl
CoSO
4
+ KSCN
η < 300 mV
Biatomic Co coverage at first, then
layer-by-layer growth
Co UPD, then nanometer-sized Co
islands
[174]
CoSO
4
+ K
2 SO
4
+ H
2 SO
4
+ KCl
η = 270 mV
η = 570 mV
Biatomic Co coverage at first, then
layer-by-layer growth up to 5ML
Biatomic Co coverage at first, then
three-dimensional growth
[179]
Au(111) reconstructed
(AFM)
Co
CoSO
4
+ CoCl
2
+ H
3 BO
3
η = 180 mV
η = 680 mV
Smooth Co film
Granular Co islands
[180]
Au(111) with sub-ML Pd,
unreconstructed
(STM)
Ni
NiSO
4
+ K
2 SO
4
+ H
2 SO
4
+ KCl
Pd pre-coating prevented the
surface reconstruction,
well-ordered Ni monolayer
obtained
[181]
Au(100) (LEED)
Pd
H
2 SO
4
+ HCl
+ PdCl
2
η > 100 mV
Layer-by-layer growth up to 30
ML
[182]
(continued)