Basaran, C., Li, S., & Abdulhamid, M. (2008). Thermomigration induced degradation in solder
alloys. Journal of Applied Physics, 103, 123520.
Basaran, C., Lin, M., & Ye, H. (2003). A thermodynamic model for electrical current induced
damage. International Journal of Solids and Structures, 40(26), 7315–7327.
Black, J. R. (1969). Electromigration failure modes in aluminum metallization for semiconductor
devices. Proceedings of the IEEE, 57(9), 1587–1594.
Blech, I. A. (1976). Electromigration in thin aluminum films on titanium nitride. Journal of Applied
Physics, 47(4), 1203–1208.
Blech, I. A., & Herring, C. (1976). Stress generation by electromigration. Applied Physics Letters,
29(3), 131–133.
Boltzmann, L. (1877). Sitzungberichte der Kaiserlichen Akademie der Wissenschaften.
Mathematisch-Naturwissen Classe. Abt. II, LXXVI, pp 373–435 (Wien. Ber. 1877, 76:373–
435). Reprinted in Wiss. Abhandlungen, Vol. II, reprint 42, p. 164–223, Barth, Leipzig, 1909.
Bosvieux, C., & Friedel, J. (1962). Electrolysis of metallic alloys. Physics Chemistry Solids, 23,
123–136.
Brandt, W., & Kitagawa, M. (1982). Effective stopping-power charges of swift ions in condensed
matter. Physical Review B, 25, 5631. Erratum Phys. Rev. B 26, 3968 (1982).
Fick, A. (1855). On liquid diffusion. Philosophical Magazine and Journal of Science, 10, 31–39.
Genoni, T. C., & Huntington, H. B. (1977). Transport in nearly-free-electron metals.
IV. Electromigration in zinc. Physical Review B, 16, 1344–1315.
Huntington, H. B. (1972). Electro-and thermomigration in metals. In Diffusion, papers presented at
a seminar of the American Society of Metals (pp. 155–184).
Huntington, H. B., & Grone, A. R. (1961). Current-induced marker motion in gold wires. Journal of
Physics and Chemistry of Solids, 20(1-2), 76–87.
Huntington, H. B., Feit, M. D., et al. (1970). Dynamic studies of vacancy motion, Crystal Lattice
Defects 1(3), 8.
Kirchheim, R. (1992). Stress and electromigration in Al-lines of integrated circuits. Acta
Metallurgica et Materialia, 40(2), 309–323.
Kuz'menko, P. F., & Osirovskii, L. F. (1962). Electric transfer of silver in copper. Izv. Vyssh.
Uchebn. Zaved. Chern Met, 11, 146–149.
Landauer, R., & Woo, J. W. F. (1974). Driving force in electromigration. Physical Review B, 10,
1266–1215.
Lloyd, J. R., Tu, K. N.. and Jasvir Jaspal, J. The physics and materials science of electromigration
and thermomigration in solders, Chapter 20 in Handbook of lead-free solder technology for
microelectronic assemblies, Editors Karl J. Puttlitz, Kathleen A. Stalter, (2004) Taylor &
Francis.
Lodding, A. (1965). Current induced motion of lattice defects in indium metal. Journal of Physics
and Chemistry of Solids, 26(1), 143–151.
Sarychev, M. E., et al. (1999). General model for mechanical stress evolution during
electromigration. Journal of Applied Physics, 86(6), 3068–3075.
Seith, W. (1955). Diffusion in Metallen, Platzwechselreaktionen. Heidelberg Berlin: Springer.
Seith, W., & Wever, H. (1953). A new effect in the electrolytic transfer in solid alloys. Zeitscrift für
Elektrochemie, 57(891), 61.
Singh, P., & Ohring, M. (1984). Tracer study of diffusion and electromigration in thin tin films.
Journal of Applied Physics, 56(4), 899–907.
Skaupy, F. (1914). Electrical conduction in metals. Verband Deutscher Physikalischer
Gesellschaften, 16, 156–157.
Sorbello, R. S. (1973). A pseudopotential based theory of the driving forces for electromigration in
metals. Journal of Physics and Chemistry of Solids, 34(6), 937–950.
Sun, P. H., & Ohring, M. (1976). Tracer self‐diffusion and electromigration in thin tin films.
Journal of Applied Physics, 47, 478.
Wever, H., & Seith, W. (1955). Zeitschrift fuer Elektrochemie und Angewandte Physikalische
Chemie, 59, 942–946.
424
8 Unified Mechanics of Metals under High Electrical Current Density:. . .
alloys. Journal of Applied Physics, 103, 123520.
Basaran, C., Lin, M., & Ye, H. (2003). A thermodynamic model for electrical current induced
damage. International Journal of Solids and Structures, 40(26), 7315–7327.
Black, J. R. (1969). Electromigration failure modes in aluminum metallization for semiconductor
devices. Proceedings of the IEEE, 57(9), 1587–1594.
Blech, I. A. (1976). Electromigration in thin aluminum films on titanium nitride. Journal of Applied
Physics, 47(4), 1203–1208.
Blech, I. A., & Herring, C. (1976). Stress generation by electromigration. Applied Physics Letters,
29(3), 131–133.
Boltzmann, L. (1877). Sitzungberichte der Kaiserlichen Akademie der Wissenschaften.
Mathematisch-Naturwissen Classe. Abt. II, LXXVI, pp 373–435 (Wien. Ber. 1877, 76:373–
435). Reprinted in Wiss. Abhandlungen, Vol. II, reprint 42, p. 164–223, Barth, Leipzig, 1909.
Bosvieux, C., & Friedel, J. (1962). Electrolysis of metallic alloys. Physics Chemistry Solids, 23,
123–136.
Brandt, W., & Kitagawa, M. (1982). Effective stopping-power charges of swift ions in condensed
matter. Physical Review B, 25, 5631. Erratum Phys. Rev. B 26, 3968 (1982).
Fick, A. (1855). On liquid diffusion. Philosophical Magazine and Journal of Science, 10, 31–39.
Genoni, T. C., & Huntington, H. B. (1977). Transport in nearly-free-electron metals.
IV. Electromigration in zinc. Physical Review B, 16, 1344–1315.
Huntington, H. B. (1972). Electro-and thermomigration in metals. In Diffusion, papers presented at
a seminar of the American Society of Metals (pp. 155–184).
Huntington, H. B., & Grone, A. R. (1961). Current-induced marker motion in gold wires. Journal of
Physics and Chemistry of Solids, 20(1-2), 76–87.
Huntington, H. B., Feit, M. D., et al. (1970). Dynamic studies of vacancy motion, Crystal Lattice
Defects 1(3), 8.
Kirchheim, R. (1992). Stress and electromigration in Al-lines of integrated circuits. Acta
Metallurgica et Materialia, 40(2), 309–323.
Kuz'menko, P. F., & Osirovskii, L. F. (1962). Electric transfer of silver in copper. Izv. Vyssh.
Uchebn. Zaved. Chern Met, 11, 146–149.
Landauer, R., & Woo, J. W. F. (1974). Driving force in electromigration. Physical Review B, 10,
1266–1215.
Lloyd, J. R., Tu, K. N.. and Jasvir Jaspal, J. The physics and materials science of electromigration
and thermomigration in solders, Chapter 20 in Handbook of lead-free solder technology for
microelectronic assemblies, Editors Karl J. Puttlitz, Kathleen A. Stalter, (2004) Taylor &
Francis.
Lodding, A. (1965). Current induced motion of lattice defects in indium metal. Journal of Physics
and Chemistry of Solids, 26(1), 143–151.
Sarychev, M. E., et al. (1999). General model for mechanical stress evolution during
electromigration. Journal of Applied Physics, 86(6), 3068–3075.
Seith, W. (1955). Diffusion in Metallen, Platzwechselreaktionen. Heidelberg Berlin: Springer.
Seith, W., & Wever, H. (1953). A new effect in the electrolytic transfer in solid alloys. Zeitscrift für
Elektrochemie, 57(891), 61.
Singh, P., & Ohring, M. (1984). Tracer study of diffusion and electromigration in thin tin films.
Journal of Applied Physics, 56(4), 899–907.
Skaupy, F. (1914). Electrical conduction in metals. Verband Deutscher Physikalischer
Gesellschaften, 16, 156–157.
Sorbello, R. S. (1973). A pseudopotential based theory of the driving forces for electromigration in
metals. Journal of Physics and Chemistry of Solids, 34(6), 937–950.
Sun, P. H., & Ohring, M. (1976). Tracer self‐diffusion and electromigration in thin tin films.
Journal of Applied Physics, 47, 478.
Wever, H., & Seith, W. (1955). Zeitschrift fuer Elektrochemie und Angewandte Physikalische
Chemie, 59, 942–946.
424
8 Unified Mechanics of Metals under High Electrical Current Density:. . .