Ye, H., Basaran, C., & Hopkins, D. (2003a). Thermomigration in Pb-Sn solder joints under joule
heating during electric current stressing. Applied Physics Letters, 82(8).
Ye, H., Basaran, C., & Hopkins, D. (2003c). Damage mechanics of microelectronics solder joints
under high current densities. International Journal of Solids and Structures, 40(15), 4021–4032.
#34.
Ye, H., Basaran, C., & Hopkins, D. (2003e). Mechanical degradation of microelectronics solder
joints under current stressing. International Journal of Solids and Structures, 40(26),
7269–7284.
Ye, H., Basaran, C., & Hopkins, D. (2003f). Measurement of high electrical current density effects
in solder joints. Microelectronics Reliability, 43(12), 2021–2029.
Ye, H., Basaran, C., & Hopkins, D. (2004a). Pb phase coarsening in eutectic Pb/Sn flip chip solder
joint under electrical current stressing. International Journal of Solids and Structures, 41,
2743–2755.
Ye, H., Basaran, C., & Hopkins, D. (2004b). Deformation of microelectronic solder joints under
current stressing and numerical simulation I. International Journal of Solids and Structures, 41,
4939–4958.
Ye, H., Basaran, C., & Hopkins, D. (2004c). Deformation of microelectronic solder joints under
current stressing and numerical simulation II. International Journal of Solids and Structures, 41,
4959–4973.
Ye, H., Basaran, C., & Hopkins, D. (2004d). Mechanical implications of high current densities in
flip chip solder joints. International Journal of Damage Mechanics, 13(4), 335–346.
Ye, H., Basaran, C., & Hopkins, D. (2006). Experimental damage mechanics of micro/power
electronics solder joints under electrical current stresses. International Journal of Damage
Mechanics, 15, 41–68.
Ye, H., Basaran, C., & Hopkins, D. (2003d). Numerical simulation of stress evolution during
Electromigration in IC interconnect lines. IEEE Transactions on Components and Packaging
Technologies, 26(3), 673–681.
Ye, H., Hopkins, D., & Basaran, C. (2003b). Measuring joint reliability: applying the Moire
interferometry technique. Advanced Packaging, 1, 17–20. Review article.
References
425
heating during electric current stressing. Applied Physics Letters, 82(8).
Ye, H., Basaran, C., & Hopkins, D. (2003c). Damage mechanics of microelectronics solder joints
under high current densities. International Journal of Solids and Structures, 40(15), 4021–4032.
#34.
Ye, H., Basaran, C., & Hopkins, D. (2003e). Mechanical degradation of microelectronics solder
joints under current stressing. International Journal of Solids and Structures, 40(26),
7269–7284.
Ye, H., Basaran, C., & Hopkins, D. (2003f). Measurement of high electrical current density effects
in solder joints. Microelectronics Reliability, 43(12), 2021–2029.
Ye, H., Basaran, C., & Hopkins, D. (2004a). Pb phase coarsening in eutectic Pb/Sn flip chip solder
joint under electrical current stressing. International Journal of Solids and Structures, 41,
2743–2755.
Ye, H., Basaran, C., & Hopkins, D. (2004b). Deformation of microelectronic solder joints under
current stressing and numerical simulation I. International Journal of Solids and Structures, 41,
4939–4958.
Ye, H., Basaran, C., & Hopkins, D. (2004c). Deformation of microelectronic solder joints under
current stressing and numerical simulation II. International Journal of Solids and Structures, 41,
4959–4973.
Ye, H., Basaran, C., & Hopkins, D. (2004d). Mechanical implications of high current densities in
flip chip solder joints. International Journal of Damage Mechanics, 13(4), 335–346.
Ye, H., Basaran, C., & Hopkins, D. (2006). Experimental damage mechanics of micro/power
electronics solder joints under electrical current stresses. International Journal of Damage
Mechanics, 15, 41–68.
Ye, H., Basaran, C., & Hopkins, D. (2003d). Numerical simulation of stress evolution during
Electromigration in IC interconnect lines. IEEE Transactions on Components and Packaging
Technologies, 26(3), 673–681.
Ye, H., Hopkins, D., & Basaran, C. (2003b). Measuring joint reliability: applying the Moire
interferometry technique. Advanced Packaging, 1, 17–20. Review article.
References
425