References
Abdulhamid, M., Li, S., & Basaran, C. (2008). Thermomigration in lead-free solder joints.
International Journal of Materials and Structural Integrity, 2(1/2), 11–34.
Barberan, N., & Echenique, P. M. (1986). Effective charge of slow ions in solids. Journal of Physics
B: Atomic and Molecular Physics, 19, 3.
Thermodynamic State Index
Thermodynamic State Index
Fig. 8.8 TSI evolution (a) in three different solder joints at À20
C (b) in solder #7 at different
temperatures
Table 8.2 (continued)
Property
Unit
SAC405
Creep activation energy
um
2 s
À2 kg mol
À1
7.95 Â 10
16
Heat of transport(Q*)
k g u m
2 s
À2
À3.68 Â 10
À08
Density
kg um
À3
7.39 Â 10
À15
Specific heat
um
2 s
À2 K
À1
2.19 Â 10
14
Heat conductivity
kg um s
À3 K
À1
5.73 Â 10
7
0
10
20
30
40
50
60
70
80
-50 -45 -40 -35 -30 -25 -20 -15 -10 -5
0
Ambient Temperature (ć)
Time to Failure (hour)
Experimental
Simulational
Fig. 8.9 Comparison of
experiment and simulation
result
References
423
Abdulhamid, M., Li, S., & Basaran, C. (2008). Thermomigration in lead-free solder joints.
International Journal of Materials and Structural Integrity, 2(1/2), 11–34.
Barberan, N., & Echenique, P. M. (1986). Effective charge of slow ions in solids. Journal of Physics
B: Atomic and Molecular Physics, 19, 3.
Thermodynamic State Index
Thermodynamic State Index
Fig. 8.8 TSI evolution (a) in three different solder joints at À20
C (b) in solder #7 at different
temperatures
Table 8.2 (continued)
Property
Unit
SAC405
Creep activation energy
um
2 s
À2 kg mol
À1
7.95 Â 10
16
Heat of transport(Q*)
k g u m
2 s
À2
À3.68 Â 10
À08
Density
kg um
À3
7.39 Â 10
À15
Specific heat
um
2 s
À2 K
À1
2.19 Â 10
14
Heat conductivity
kg um s
À3 K
À1
5.73 Â 10
7
0
10
20
30
40
50
60
70
80
-50 -45 -40 -35 -30 -25 -20 -15 -10 -5
0
Ambient Temperature (ć)
Time to Failure (hour)
Experimental
Simulational
Fig. 8.9 Comparison of
experiment and simulation
result
References
423