28 Copper Nucleation on Nickel from Pyrophosphate-Based Polyligand Electrolyte
455
20. Im B, Kim S (2014) Nucleation and growth of Cu electrodeposited directly on W diffusion
barrier in neutral electrolyte. Electrochim Acta 130:52–59. https://doi.org/10.1016/j.electacta.
2014.02.154
21. Zheng M, Kelly JJ, Deligianni H (2007) Electrodeposition of Cu on Ta-based layers I.
Electrodeposition on Ta. J Electrochem Soc 154(8):D400–D405. https://doi.org/10.1149/1.
2744153
22. Nagar M, Radisic A, Strubbe K, Vereecken PM (2014) The effect of polyether suppressors
on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating.
Electrochim Acta 127:315–326. https://doi.org/10.1016/j.electacta.2014.02.052
23. Dutra AJB, O’keefe TJ (1999) Copper nucleation on titanium for thin film applications. J Appl
Electrochem 29(10):1217–1227. https://doi.org/10.1023/A:1003537318303
24. Kim S, Duquette DJ (2006) Nucleation characteristics of directly electrodeposited copper on
TiN. J Electrochem Soc 153(9):C673–C676. https://doi.org/10.1149/1.2219712
25. Schrebler Arratia R, Aros Meneses H, Schrebler Guzman R, Carlesi Jara C (2012) Use
of polyethylene glycol as organic additive in copper electrodeposition over stainless steel
cathodes. Lat Am Appl Res 42(4):371–376
26. Mascaro LH, Pereira EC (2000) Deposition of copper on passivated chromium. J Electroanal
Chem 485(1):81–85. https://doi.org/10.1016/S0022-0728(00)00076-0
27. Chang HK, Choe BH, Lee JK (2005) Influence of titanium oxide films on copper nucleation
during electrodeposition. Mater Sci Eng A 409(1):317–328. https://doi.org/10.1016/j.msea.
2005.03.114
28. Argañaraz MBQ, Vázquez CI, Lacconi GI (2010) Copper electrodeposition onto hydrogenated
Si (1 1 1) surfaces: Influence of thiourea. J Electroanal Chem 639(1–2):95–101
29. Khelladi MR, Mentar L, Azizi A, Sahari A, Kahoul A (2009) Electrochemical nucleation
and growth of copper deposition onto FTO and n-Si (100) electrodes. Mater Chem Phys
115(1):385–390. https://doi.org/10.1016/j.matchemphys.2008.12.017
30. Ivanou DK, Ivanova YA, Kulak AI, Streltsov EA (2012) Photoinduced selective copper
electrodeposition on p-Si (111). Electrochem Commun 17:38–40. https://doi.org/10.1016/j.
elecom.2012.01.015
31. Zhu XR (2014) The nucleation and growth kinetics of copper nanoparticles electrodeposited
at water-immiscible interface of castor oiled graphite-epoxy solid electrodes by cyclic voltammetry. Appl Mech Mater 510:86–90. https://doi.org/10.4028/www.scientific.net/AMM.510.86
32. Majidi MR, Asadpour-Zeynali K, Hafezi B (2009) Reaction and nucleation mechanisms
of copper electrodeposition on disposable pencil graphite electrode. Electrochim Acta
54(3):1119–1126. https://doi.org/10.1016/j.electacta.2008.08.035
33. Wu S, Yin Z, He Q, Lu G, Yan Q, Zhang H (2011) Nucleation mechanism of electrochemical
deposition of Cu on reduced graphene oxide electrodes. J Phys Chem C 115(32):15973–15979.
https://doi.org/10.1021/jp201667p
34. Nichols RJ, Schroer D, Meyer H (1995) An in situ scanning probe microscopy study of copper
electrodeposition on conductive polypyrrole. Electrochim Acta 40(10):1479–1485. https://doi.
org/10.1016/0013-4686(95)00051-F
35. Polewska W, Behm RJ, Magnussen OM (2003) In-situ video-STM studies of Cu electrodeposition on Cu (100) in HCl solution. Electrochim Acta 48(20):2915–2921. https://doi.org/10.
1016/S0013-4686(03)00356-6
36. Garcia-Rodriguez DE, Mendoza-Huizar LH, Rios-Reyes CH, Alatorre-Ordaz MA (2012)
Copper electrodeposition on glassy carbon and highly oriented pyrolytic graphite substrates from perchlorate solutions. Quim Nova 35(4):699–704. https://doi.org/10.1590/S010040422012000400008
37. Guascito MR, Malitesta C, Sabbatini L (2012) Nucleation and growth of copper particles on
Pt and Pt/poly-3-methylthiophene modified electrode in presence of Cl − complexing agent.
Mater Chem Phys 131(3):719–727. https://doi.org/10.1016/j.matchemphys.2011.10.041
38. Oskam G, Vereecken PM, Searson PC (1999) Electrochemical deposition of copper on nSi/TiN. J Electrochem Soc 146(4):1436–1441. https://doi.org/10.1149/1.1391782
455
20. Im B, Kim S (2014) Nucleation and growth of Cu electrodeposited directly on W diffusion
barrier in neutral electrolyte. Electrochim Acta 130:52–59. https://doi.org/10.1016/j.electacta.
2014.02.154
21. Zheng M, Kelly JJ, Deligianni H (2007) Electrodeposition of Cu on Ta-based layers I.
Electrodeposition on Ta. J Electrochem Soc 154(8):D400–D405. https://doi.org/10.1149/1.
2744153
22. Nagar M, Radisic A, Strubbe K, Vereecken PM (2014) The effect of polyether suppressors
on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating.
Electrochim Acta 127:315–326. https://doi.org/10.1016/j.electacta.2014.02.052
23. Dutra AJB, O’keefe TJ (1999) Copper nucleation on titanium for thin film applications. J Appl
Electrochem 29(10):1217–1227. https://doi.org/10.1023/A:1003537318303
24. Kim S, Duquette DJ (2006) Nucleation characteristics of directly electrodeposited copper on
TiN. J Electrochem Soc 153(9):C673–C676. https://doi.org/10.1149/1.2219712
25. Schrebler Arratia R, Aros Meneses H, Schrebler Guzman R, Carlesi Jara C (2012) Use
of polyethylene glycol as organic additive in copper electrodeposition over stainless steel
cathodes. Lat Am Appl Res 42(4):371–376
26. Mascaro LH, Pereira EC (2000) Deposition of copper on passivated chromium. J Electroanal
Chem 485(1):81–85. https://doi.org/10.1016/S0022-0728(00)00076-0
27. Chang HK, Choe BH, Lee JK (2005) Influence of titanium oxide films on copper nucleation
during electrodeposition. Mater Sci Eng A 409(1):317–328. https://doi.org/10.1016/j.msea.
2005.03.114
28. Argañaraz MBQ, Vázquez CI, Lacconi GI (2010) Copper electrodeposition onto hydrogenated
Si (1 1 1) surfaces: Influence of thiourea. J Electroanal Chem 639(1–2):95–101
29. Khelladi MR, Mentar L, Azizi A, Sahari A, Kahoul A (2009) Electrochemical nucleation
and growth of copper deposition onto FTO and n-Si (100) electrodes. Mater Chem Phys
115(1):385–390. https://doi.org/10.1016/j.matchemphys.2008.12.017
30. Ivanou DK, Ivanova YA, Kulak AI, Streltsov EA (2012) Photoinduced selective copper
electrodeposition on p-Si (111). Electrochem Commun 17:38–40. https://doi.org/10.1016/j.
elecom.2012.01.015
31. Zhu XR (2014) The nucleation and growth kinetics of copper nanoparticles electrodeposited
at water-immiscible interface of castor oiled graphite-epoxy solid electrodes by cyclic voltammetry. Appl Mech Mater 510:86–90. https://doi.org/10.4028/www.scientific.net/AMM.510.86
32. Majidi MR, Asadpour-Zeynali K, Hafezi B (2009) Reaction and nucleation mechanisms
of copper electrodeposition on disposable pencil graphite electrode. Electrochim Acta
54(3):1119–1126. https://doi.org/10.1016/j.electacta.2008.08.035
33. Wu S, Yin Z, He Q, Lu G, Yan Q, Zhang H (2011) Nucleation mechanism of electrochemical
deposition of Cu on reduced graphene oxide electrodes. J Phys Chem C 115(32):15973–15979.
https://doi.org/10.1021/jp201667p
34. Nichols RJ, Schroer D, Meyer H (1995) An in situ scanning probe microscopy study of copper
electrodeposition on conductive polypyrrole. Electrochim Acta 40(10):1479–1485. https://doi.
org/10.1016/0013-4686(95)00051-F
35. Polewska W, Behm RJ, Magnussen OM (2003) In-situ video-STM studies of Cu electrodeposition on Cu (100) in HCl solution. Electrochim Acta 48(20):2915–2921. https://doi.org/10.
1016/S0013-4686(03)00356-6
36. Garcia-Rodriguez DE, Mendoza-Huizar LH, Rios-Reyes CH, Alatorre-Ordaz MA (2012)
Copper electrodeposition on glassy carbon and highly oriented pyrolytic graphite substrates from perchlorate solutions. Quim Nova 35(4):699–704. https://doi.org/10.1590/S010040422012000400008
37. Guascito MR, Malitesta C, Sabbatini L (2012) Nucleation and growth of copper particles on
Pt and Pt/poly-3-methylthiophene modified electrode in presence of Cl − complexing agent.
Mater Chem Phys 131(3):719–727. https://doi.org/10.1016/j.matchemphys.2011.10.041
38. Oskam G, Vereecken PM, Searson PC (1999) Electrochemical deposition of copper on nSi/TiN. J Electrochem Soc 146(4):1436–1441. https://doi.org/10.1149/1.1391782