454
A. Maizelis and B. Bairachniy
2. Grujicic D, Pesic B (2005) Reaction and nucleation mechanisms of copper electrodeposition
from ammoniacal solutions on vitreous carbon. Electrochim Acta 50(22):4426–4443. https://
doi.org/10.1016/j.electacta.2005.02.012
3. Matsushima JT, Santos LCD, Couto AB, Baldan MR, Ferreira NG (2012) Electrodeposition of
Cu nanoparticles on BDD electrodes: reactions and nucleation mechanism. J Electrochem Soc
159(4):D246–D252. https://doi.org/10.1149/2.093204jes
4. Deng Y, Ling H, Feng X, Hang T, Li M (2015) Electrodeposition and characterization
of copper nanocone structures. Cryst Eng Commun 17(4):868–876. https://doi.org/10.1039/
C4CE01993H
5. Tsakova V, Borissov D, Ranguelov B, Stromberg C, Schultze JW (2001) Electrochemical
incorporation of copper in polyaniline layers. Electrochim Acta 46(26):4213–4222. https://
doi.org/10.1016/S0013-4686(01)00705-8
6. Lai SC, Lazenby RA, Kirkman PM, Unwin PR (2015) Nucleation, aggregative growth and
detachment of metal nanoparticles during electrodeposition at electrode surfaces. Chem Sci
6(2):1126–1138. https://doi.org/10.1039/C4SC02792B
7. Simkunaite D, Valsiunas I, Jasulaitiene V, Selskis A (2015) The initial stages of copper deposition onto glassy carbon electrode modified with selenium compounds. Chemija 26(4):229–237
8. Li Y, Sun JZ, Bian C, Tong JH, Dong HP, Zhang H, Xia SH (2015) Copper nano-clusters
prepared by one-step electrodeposition and its application on nitrate sensing. AIP Adv
5(4):041312. https://doi.org/10.1063/1.4905712
9. Losey MW, Griffiths SK, Hachman JT (2006) Nucleation and adhesion of electrodeposited
copper on anodized thin-film aluminum for LIGA microfabrication. J Electrochem Soc
153(12):D177–D186. https://doi.org/10.1149/1.2354453
10. Luyima A, Cui W, Heckman C, Moats MS (2016) Examination of copper electrowinning
smoothing agents. Part IV: nucleation and growth of copper on stainless steel. Miner Metall
Proc 33(1):39–46
11. Aromaa J, Kekki A, Stefanova A, Forsen O (2012) Copper nucleation and growth patterns on
stainless steel cathode blanks in copper electrorefining. J Solid State Electr 16(11):3529–3537.
https://doi.org/10.1007/s10008-012-1898-x
12. Palomar-Pardave M, Garfias-Garcia E, Romero-Romo M, Ramirez-Silva MT, Batina N (2011)
Influence of the substrate’s surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold. Electrochim Acta 56(27):10083–10092.
https://doi.org/10.1016/j.electacta.2011.08.105
13. Willis M, Alkire R (2009) Additive-assisted nucleation and growth by electrodeposition I.
Experimental studies with copper seed arrays on gold films. J Electrochem Soc 156(10):D377–
D384. https://doi.org/10.1149/1.3183502
14. Garfias-Garcia E, Palomar-Pardave M, Romero-Romo M, Ramirez-Silva MT, Batina N (2007)
Kinetics mechanism of copper UPD nucleation and growth on mono and polycrystalline gold.
ECS Trans 3(34):35–43. https://doi.org/10.1149/1.2795610
15. Molodkina EB, Ehrenburg MR, Danilov AI, Feliu JM (2016) Two-dimensional Cu deposition
on Pt(100) and stepped surfaces of platinum single crystals. Electrochim Acta 194: 385–394.
https://doi.org/10.1016/j.electacta.2016.02.082
16. Emekli U, West AC (2009) Effect of additives and pulse plating on copper nucleation onto Ru.
Electrochim Acta 54(4):1177–1183. https://doi.org/10.1016/j.electacta.2008.08.065
17. Rigano PM, Mayer C, Chierchie T (1988) Electrochemical nucleation and growth of copper
on polycrystalline palladium. J Electroanal Chem Interfacial Electrochem 248(1):219–228.
https://doi.org/10.1016/0022-0728(88)85163-5
18. Ballesteros JC, Chainet E, Ozil P, Trejo G, Meas Y (2010) Initial stages of the electrocrystallization of copper from non-cyanide alkaline bath containing glycine. J Electroanal Chem
645(2):94–102. https://doi.org/10.1016/j.jelechem.2010.05.002
19. Zhang QB, Hua YX (2014) Electrochemical synthesis of copper nanoparticles using cuprous
oxide as a precursor in choline chlorideurea deep eutectic solvent: nucleation and growth mechanism. Phys Chem Chem Phys 16(48):27088–27095. https://doi.org/10.1039/C4CP03041A
A. Maizelis and B. Bairachniy
2. Grujicic D, Pesic B (2005) Reaction and nucleation mechanisms of copper electrodeposition
from ammoniacal solutions on vitreous carbon. Electrochim Acta 50(22):4426–4443. https://
doi.org/10.1016/j.electacta.2005.02.012
3. Matsushima JT, Santos LCD, Couto AB, Baldan MR, Ferreira NG (2012) Electrodeposition of
Cu nanoparticles on BDD electrodes: reactions and nucleation mechanism. J Electrochem Soc
159(4):D246–D252. https://doi.org/10.1149/2.093204jes
4. Deng Y, Ling H, Feng X, Hang T, Li M (2015) Electrodeposition and characterization
of copper nanocone structures. Cryst Eng Commun 17(4):868–876. https://doi.org/10.1039/
C4CE01993H
5. Tsakova V, Borissov D, Ranguelov B, Stromberg C, Schultze JW (2001) Electrochemical
incorporation of copper in polyaniline layers. Electrochim Acta 46(26):4213–4222. https://
doi.org/10.1016/S0013-4686(01)00705-8
6. Lai SC, Lazenby RA, Kirkman PM, Unwin PR (2015) Nucleation, aggregative growth and
detachment of metal nanoparticles during electrodeposition at electrode surfaces. Chem Sci
6(2):1126–1138. https://doi.org/10.1039/C4SC02792B
7. Simkunaite D, Valsiunas I, Jasulaitiene V, Selskis A (2015) The initial stages of copper deposition onto glassy carbon electrode modified with selenium compounds. Chemija 26(4):229–237
8. Li Y, Sun JZ, Bian C, Tong JH, Dong HP, Zhang H, Xia SH (2015) Copper nano-clusters
prepared by one-step electrodeposition and its application on nitrate sensing. AIP Adv
5(4):041312. https://doi.org/10.1063/1.4905712
9. Losey MW, Griffiths SK, Hachman JT (2006) Nucleation and adhesion of electrodeposited
copper on anodized thin-film aluminum for LIGA microfabrication. J Electrochem Soc
153(12):D177–D186. https://doi.org/10.1149/1.2354453
10. Luyima A, Cui W, Heckman C, Moats MS (2016) Examination of copper electrowinning
smoothing agents. Part IV: nucleation and growth of copper on stainless steel. Miner Metall
Proc 33(1):39–46
11. Aromaa J, Kekki A, Stefanova A, Forsen O (2012) Copper nucleation and growth patterns on
stainless steel cathode blanks in copper electrorefining. J Solid State Electr 16(11):3529–3537.
https://doi.org/10.1007/s10008-012-1898-x
12. Palomar-Pardave M, Garfias-Garcia E, Romero-Romo M, Ramirez-Silva MT, Batina N (2011)
Influence of the substrate’s surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold. Electrochim Acta 56(27):10083–10092.
https://doi.org/10.1016/j.electacta.2011.08.105
13. Willis M, Alkire R (2009) Additive-assisted nucleation and growth by electrodeposition I.
Experimental studies with copper seed arrays on gold films. J Electrochem Soc 156(10):D377–
D384. https://doi.org/10.1149/1.3183502
14. Garfias-Garcia E, Palomar-Pardave M, Romero-Romo M, Ramirez-Silva MT, Batina N (2007)
Kinetics mechanism of copper UPD nucleation and growth on mono and polycrystalline gold.
ECS Trans 3(34):35–43. https://doi.org/10.1149/1.2795610
15. Molodkina EB, Ehrenburg MR, Danilov AI, Feliu JM (2016) Two-dimensional Cu deposition
on Pt(100) and stepped surfaces of platinum single crystals. Electrochim Acta 194: 385–394.
https://doi.org/10.1016/j.electacta.2016.02.082
16. Emekli U, West AC (2009) Effect of additives and pulse plating on copper nucleation onto Ru.
Electrochim Acta 54(4):1177–1183. https://doi.org/10.1016/j.electacta.2008.08.065
17. Rigano PM, Mayer C, Chierchie T (1988) Electrochemical nucleation and growth of copper
on polycrystalline palladium. J Electroanal Chem Interfacial Electrochem 248(1):219–228.
https://doi.org/10.1016/0022-0728(88)85163-5
18. Ballesteros JC, Chainet E, Ozil P, Trejo G, Meas Y (2010) Initial stages of the electrocrystallization of copper from non-cyanide alkaline bath containing glycine. J Electroanal Chem
645(2):94–102. https://doi.org/10.1016/j.jelechem.2010.05.002
19. Zhang QB, Hua YX (2014) Electrochemical synthesis of copper nanoparticles using cuprous
oxide as a precursor in choline chlorideurea deep eutectic solvent: nucleation and growth mechanism. Phys Chem Chem Phys 16(48):27088–27095. https://doi.org/10.1039/C4CP03041A