490
5 Methods of Detecting Hardware Trojans in Microcircuits
(continued)
Testing method
Die-to-database
Value of the least significant bit during measurement of the
table position coordinates
0.6 nm
Range of correction of reference image element dimensions
50–250 nm
Mask dimensions
5 × 5 (127 × 127 mm)
6 × 6 (153 × 153 mm)
Time of control of the working field region of 100 × 100 mm 2
depending on detectability: 150 nm 300 nm
22 min 15 min
Time of preparation for control (mask loading and orientation) 5–7 min
Filtration range of adjacent defects
±1, ±2 pixels
Filtration range of isolated defects
1, 2, …, 10 (and more) pixels
Maximum height of the pellicle frame
6.5 mm
Power consumption
1.7 kW
M-6729B operation modes
Automatic control mode
Automatic mask control mode Die-to-Database (D2DB) is the main operating mode
of the station. In this mode, topology data is read from the mask with high precision
and compared to the design data acquired from the design system.
Control process is reflected on the monitor screen (Fig. 5.11). The data on the
detected defects are dynamically displayed on the screen; there is also a possibility
of interrupting the test.
Based on the results of control, the file of defects list (Fig. 5.12) is generated,
which can be sent to the station of automated defect retouching or to any other
repair, review, or analysis station.
Express assessment of topology defects of the mask identified during automatic
control is provided by the mode of presentation of defects to the operator on the
monitor display in transmitted or reflected light.
Classification of defects
The station includes the defects classification mode (Fig. 5.13) performed using the
reference description.
Type of the identified defects and the distance to the topology of the closest
element are determined.
Off-line review platform is a special platform (Fig. 5.14) that allows the user to
quickly view the list of identified defects on an external computer. The following
images are provided for each separate defect: view—image of the defect in
the topology received from the TDI camera; ref—corresponding topology in the
reference; Place—position of the defect on the mask.
After viewing and analyzing the defects, the operator can draw up a conclusion
about their character: whether it is a Trojan element or a process defect, exclude
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