280
S. Papazoglou and I. Zergioti
Table 9.1
(continued)
Transferred material
Substrate
Feature size
(µm)
Laser source
Wavelength Pulse
duration
Application
Author, year
References
Cr, In
2 O
3
Glass, silicon
3
KrF
248 nm
500 fs
Diffractive
microstructures
Zergioti (1998)
[13]
Silver NP ink
Si wafers
16
Fiber
343 nm
30 ps
Metallic
interconnections
Biver (2014)
[39]
Silver nanopaste
Si or c-cut (0001)
sapphire wafers
50
Nd:YVO
4
355
65
Microwave
interconnects
Breckenfeld
(2015)
[121]
Silver NP ink
Glass
5–25
Nd:YVO
4
355 nm
30 ns
OTFT
Kim (2010)
[61]
Silver NP ink
Glass
12, 30, 70
Nd:YVO
4
266 nm
20 ns
Rapid
prototyping of
microelectronic
devices
Duocastella
(2012)
[15]
Organic materials-polymers
PHEMA, PVA, and
PVP polymers
Circular Si
membranes
20–250
Nd:YAG
266 nm
4 ns
Capacitive
chemical sensor
Tsouti (2010)
[78]
Polyethylene
Paper or Mylar
Nd:YAG
1.06
µm
Image recording Levene (1970)
[3]
Cationic polymer:
polyethylenimine (PEI)
Glass coated with
PEG polymer
200–300
XeCl
308 nm
30 ns
Cell-based
biosensors
Dinca (2011)
[77]
SWCNT suspension
Glass slides or
fused silica plates
400
XeCl
308 nm
30 ns
Chemical
sensors
Palla-Papavlu
(2014)
[81]
Polymer/carbon
nanotube (CNT)
composite layers
Glass and Al
electrodes
pre-patterned on
SiO
2 /Si
70
Nd:YAG
266 nm
4 ns
Chemical
sensors
Boutopoulos
(2010)
[82]
(continued)