Chapter 9
Packaging of Group-III Nitride LED
Group-III nitride LED encapsulation is one of the key technologies of solid-state
lighting. The technology aims to improve light extraction efficiency, beam profile,
color conversion, reliability and thermal management of the LEDs. This chapter will
mainly introduce the LED related packaging materials, design, process and related
technology. In the end, a brief description of the latest LED packaging trends is
discussed.
9.1 Group III Nitride LED Packaging Materials
Encapsulation of solid-state lighting has its own characteristics. One of the essential
issues is to control the raw materials. Considering the application environment of the
devices, especially for those LEDs operated outdoor, the device will be vulnerable
unless its reliability is optimized. Therefore, the control of the encapsulating material
is important.
9.1.1 LED Chip
The first material used in LED packaging is LED chip itself. The function of LED
is to convert electricity into light. LED can be categorized into three main types
according to the number of surface electrode on the chip such as single, double and
multi-electrodes chip.
LED chip with single electrode usually has vertical structure as illustrated in
Fig. 9.1.
LED chip with double electrodes are commonly based on insulating substrate,
e.g. sapphire. Hence the device has planar structure as shown in Fig. 9.2.
© Science Press and Springer Nature Singapore Pte Ltd. 2020
J. Li et al., III-Nitrides Light Emitting Diodes: Technology and Applications,
Springer Series in Materials Science 306,
https://doi.org/10.1007/978-981-15-7949-3_9
185
Packaging of Group-III Nitride LED
Group-III nitride LED encapsulation is one of the key technologies of solid-state
lighting. The technology aims to improve light extraction efficiency, beam profile,
color conversion, reliability and thermal management of the LEDs. This chapter will
mainly introduce the LED related packaging materials, design, process and related
technology. In the end, a brief description of the latest LED packaging trends is
discussed.
9.1 Group III Nitride LED Packaging Materials
Encapsulation of solid-state lighting has its own characteristics. One of the essential
issues is to control the raw materials. Considering the application environment of the
devices, especially for those LEDs operated outdoor, the device will be vulnerable
unless its reliability is optimized. Therefore, the control of the encapsulating material
is important.
9.1.1 LED Chip
The first material used in LED packaging is LED chip itself. The function of LED
is to convert electricity into light. LED can be categorized into three main types
according to the number of surface electrode on the chip such as single, double and
multi-electrodes chip.
LED chip with single electrode usually has vertical structure as illustrated in
Fig. 9.1.
LED chip with double electrodes are commonly based on insulating substrate,
e.g. sapphire. Hence the device has planar structure as shown in Fig. 9.2.
© Science Press and Springer Nature Singapore Pte Ltd. 2020
J. Li et al., III-Nitrides Light Emitting Diodes: Technology and Applications,
Springer Series in Materials Science 306,
https://doi.org/10.1007/978-981-15-7949-3_9
185