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183
29. A. Ioffe, A. Rogel, Progress in Semiconductors, 4th edn. A.F. Gibson, F.A. Kroger, R.E. Burgess
(eds.) (Heywood, London, 1960)
30. K. Nomura, H. Ohta, K. Ueda et al., Thin-film transistor fabricated in single-crystalline
transparent oxide semiconductor. Science 300, 1269 (2003)
31. T.Y. Wang, X.Y. Li, et al., Flip-chip technology. In Proceedings Radar Technology Forum in
China, pp. 207–210 (2006). (in Chinese)
32. S. Du, Research on hot-press ultrasonic flip-chip welding process. In Proceedings of the 14th
National Conference on Hybrid Integrated Circuits, pp. 364–368 (2005). (in Chinese)
33. Y.X. Wu, Z.Q. Long et al., Development status of thermal ultrasonic flip-chip welding for new
processes of chip package interconnect. Electron. Process Technol. 25(5), 185–188 (2004). (in
Chinese)
34. M.K. Kelly, O. Ambacher, R. Dimitrov et al., Phys. Status Solidi 159, R3 (1997)
35. J. Karpinski, J. Jun, S. Porowski, Equilibrium pressure of N 2 over GaN and high-pressure
solution growth of GaN. J. Cryst. Growth 66, 1 (1984)
36. P.R. Tavernier, D.R. Clarke, Mechanics of laser-assisted debonding of films. J. Appl. Phys.
89(3), 1517–1536 (2001)
37. S. Wolf, Silicon Processing for the VLSI Era (Lattice Press, California Sunset Beach, 1990)
38. C.Y. Chang, SM Sze (ULSI Technology, The McGraw-Hill Companies, 1996)
39. Wu. Dexin, Q. He, Modern Microelectronics Technology (Chemical Industry Press, Beijing,
2002) (in Chinese)
40. Z. Zhengyong, Semiconductor Integrated Circuit (Tsinghua University Press, Beijing, 2001)
(in Chinese)
41. S. Nakamura, G. Fasol, The Blue Laser Diode (Springer, Berlin, 1997)
42. Z. Teng et al., The design and fabrication of a GaN-based monolithic light-emitting diode array.
J. Semicond. 34(9), 094010 (2013)