Glue(n − 1)

ILD(n − 1)

Glue(n − 2)

ILD(n − 2)

Glue(1)

ILD(1)

Package

(a)
P(n)
P(n − 1)
P3
P2
P1
Heat sink
Package
Si_1
Si_2
Si_3
Si_(n − 1)
Si_(n)
Cu + ILD
Cu + ILD
Cu + ILD
Cu + ILD
Cu + ILD
Si(n)
Cu(n − 1)
Si(n − 1)
Cu(n − 2)
Si(2)
Cu(1)
Si(1)
Chip layer n
Chip layer n − 1
Glue layer
(polymide)
Chip layer 2
Chip layer 1
R(n)
R(n − 1)
R(2)
R(1)
(b)
320
Network-on-Chip
Figure 11.1
(a) A cross section of vertically stacked layers for an n-layer 3D IC; (b) heat dissipation in an
n-layer 3D IC.