Chapter 4
Microstructure and Mechanical
Reliability Issues of TSV
Praveen Kumar, Tae-Kyu Lee, Indranath Dutta, Zhiheng Huang,
and Paul Conway
4.1 Introduction
Following Chap. 3 on materials, processing and assembly, this chapter discusses the
microstructural and reliability issues of TSVs. This chapter begins with microstructural characterization and stress measurement; it then discusses detailed reliability issues associated with TSVs; finally it presents promising techniques towards
atomistically-informed reliability modeling of TSVs.
P. Kumar
Department of Materials Engineering, Indian Institute of Science, Bangalore 560012, India
e-mail: praveenk@materials.iisc.ernet.in
T.-K. Lee
Department of Mechanical and Materials Engineering, Portland State University, Portland, OR
97207, USA
e-mail: taeklee@pdx.edu
I. Dutta (B)
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA
99164, USA
e-mail: idutta@wsu.edu
Z. Huang
School of Materials Science and Engineering, Sun Yat-sen University, 135 West Xingang Road,
Guangzhou 510275, China
e-mail: hzh29@mail.sysu.edu.cn
P. Conway
The Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough
University, Loughborough, Leicestershire LE11 3TU, UK
e-mail: p.p.conway@lboro.ac.uk
© The Editor(s) (if applicable) and The Author(s), under exclusive
license to Springer Nature Singapore Pte Ltd. 2021
Y. Li and D. Goyal (eds.), 3D Microelectronic Packaging,
Springer Series in Advanced Microelectronics 64,
https://doi.org/10.1007/978-981-15-7090-2_4
71
Microstructure and Mechanical
Reliability Issues of TSV
Praveen Kumar, Tae-Kyu Lee, Indranath Dutta, Zhiheng Huang,
and Paul Conway
4.1 Introduction
Following Chap. 3 on materials, processing and assembly, this chapter discusses the
microstructural and reliability issues of TSVs. This chapter begins with microstructural characterization and stress measurement; it then discusses detailed reliability issues associated with TSVs; finally it presents promising techniques towards
atomistically-informed reliability modeling of TSVs.
P. Kumar
Department of Materials Engineering, Indian Institute of Science, Bangalore 560012, India
e-mail: praveenk@materials.iisc.ernet.in
T.-K. Lee
Department of Mechanical and Materials Engineering, Portland State University, Portland, OR
97207, USA
e-mail: taeklee@pdx.edu
I. Dutta (B)
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA
99164, USA
e-mail: idutta@wsu.edu
Z. Huang
School of Materials Science and Engineering, Sun Yat-sen University, 135 West Xingang Road,
Guangzhou 510275, China
e-mail: hzh29@mail.sysu.edu.cn
P. Conway
The Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough
University, Loughborough, Leicestershire LE11 3TU, UK
e-mail: p.p.conway@lboro.ac.uk
© The Editor(s) (if applicable) and The Author(s), under exclusive
license to Springer Nature Singapore Pte Ltd. 2021
Y. Li and D. Goyal (eds.), 3D Microelectronic Packaging,
Springer Series in Advanced Microelectronics 64,
https://doi.org/10.1007/978-981-15-7090-2_4
71