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29. T.S. Leng, J.C.P. McKeon, H.S. Jang, in Proceedings from the 32th International Symposium
for Testing and Failure Analysis (2006), p. 480
30. Y. Li, L. Hu, G. Li, R. Dias, D. Goyal, Proceedings from the 39th International Symposium for
Testing and Failure Analysis (ISTFA) (ASM International, 2013), pp. 468–470
31. S. Brand, A. Lapadatu, T. Djuric, P. Czurratis, J. Schischka, M. Petzold, J. Micro/Nanolithogr.
MEMS MOEMS 13(1), 011207 (2014)
32. I. De Wolf, A. Khaled, M. Herms, M. Wagner, T. Djuric, P. Czurratis, S. Brand, in Proceedings from the 41st International Symposium for Testing and Failure Analysis (ISTFA) ASM
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33. J. Semmens, in Proceedings of Pan Pacific Conference, Kauai, Hawaii (2008)
34. J. Perraud, S. Enouz-Vedrenne, J. Clement, A. Grivon, in Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2012),
p. 332
35. J. McDonald, Optical microscopy, in Microelectronics Failure Analysis Desk Reference, 7th
edn. (ASM International, 2019), pp. 42–61
36. S.F. Lin, C.H. Chen, C.Y. Lo, Appl. Opt. 54(28), E123–8 (2015)
37. M.H. Ettenberg, D. Malchow, Photon. Tech. Briefs (2007)
38. M. Matysiak1, J.P. Parry, F. Albri, J.G. Crowder, N. Jones, K. Jonas, N. Weston, D.P Hand,
J.D. Shephard, Measur. Sci. Technol. 22, 125502 (2011)
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Technol. 19, 094001 (2008)
40. Y. Li, J.S. Moore, B. Pathangey, R.C. Dias, D. Goyal, IEEE Trans. Device Mater. Reliab. 12(2),
494 (2012)
41. Y. Li, R. Panat, B. Li, R. Mulligan, P. K. Muther Srinath, A. Raman, IEEE Trans. Device Mater.
Reliab. 11(1), 141 (2011)
42. M. Pacheco, D. Goyal, in Proceedings of Electronic Components and Technology Conference
(2011), p. 1263
43. C. Schmidt, C. Hartfield, S.T. Kelly, L. England, S. Kannan, in Conference Proceedings from the
44th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International,
2018), p. 424
44. Y. Li, M. Pacheco, D. Goyal, J.W. Elmer, H.D. Barth, D. Parkinson, in Conference Proceedings
from the 64th Electronic Components and Technology Conference (ECTC) (2014), p. 1457
45. E. Zschech, M. Löffler„ J. Gluch, M.J. Wolf, in Materials Research Society (MRS) Spring
(2016)
46. W. Yun, M. Feser, J. Gelb, L. Hunter, Frontiers of characterization and metrology for
nanoelectronics (2013)
47. J. W. Elmer, Y. Li, H.D. Barth, D.Y. Parkinson, M. Pacheco, D. Goyal, J. Electron. Mater. 4421
(2014)
48. F. Altmann, J. Beyersdorfer, J. Schischka, M. Krause, G. Franz, L. Kwakman, in Conference
Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA)
(ASM International, 2012), p. 39
49. L. Kwakman, M. Straw, G. Coustillier, M. Sentis, J. Beyersdorfer, J. Schischka, F. Naumann,
F. Altmann, in Proceedings from the 39th International Symposium for Testing and Failure
Analysis (ISTFA) (ASM International, 2013), p. 17
50. Meyer, G. Grimm, M. Hecker, M. Weisheit, E. Langer, in Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2013),
p. 12
51. H. Xu, H. Zhang, M. Xue, in Conference Proceedings from the 15th Electronic Components
and Technology Conference (ECTC) (2013), p. 403
52. A. Centrone, Annu. Rev. Anal. Chem. 8, 101 (2015)
53. A. Dazzi, C.B. Prater, Chem. Rev. 117, 5146 (2017)
54. J.Y. Kim, H. Kim, D.W. Hahn, S.M. Hwang, in Proceedings from the 43rd International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2017), p. 40
Y. Li and D. Goyal
28. S. Haque, G. Lu, J. Goings, J. Sigmund, Microelectron. Reliab. 40, 465 (2000)
29. T.S. Leng, J.C.P. McKeon, H.S. Jang, in Proceedings from the 32th International Symposium
for Testing and Failure Analysis (2006), p. 480
30. Y. Li, L. Hu, G. Li, R. Dias, D. Goyal, Proceedings from the 39th International Symposium for
Testing and Failure Analysis (ISTFA) (ASM International, 2013), pp. 468–470
31. S. Brand, A. Lapadatu, T. Djuric, P. Czurratis, J. Schischka, M. Petzold, J. Micro/Nanolithogr.
MEMS MOEMS 13(1), 011207 (2014)
32. I. De Wolf, A. Khaled, M. Herms, M. Wagner, T. Djuric, P. Czurratis, S. Brand, in Proceedings from the 41st International Symposium for Testing and Failure Analysis (ISTFA) ASM
International, 2015), p. 119
33. J. Semmens, in Proceedings of Pan Pacific Conference, Kauai, Hawaii (2008)
34. J. Perraud, S. Enouz-Vedrenne, J. Clement, A. Grivon, in Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2012),
p. 332
35. J. McDonald, Optical microscopy, in Microelectronics Failure Analysis Desk Reference, 7th
edn. (ASM International, 2019), pp. 42–61
36. S.F. Lin, C.H. Chen, C.Y. Lo, Appl. Opt. 54(28), E123–8 (2015)
37. M.H. Ettenberg, D. Malchow, Photon. Tech. Briefs (2007)
38. M. Matysiak1, J.P. Parry, F. Albri, J.G. Crowder, N. Jones, K. Jonas, N. Weston, D.P Hand,
J.D. Shephard, Measur. Sci. Technol. 22, 125502 (2011)
39. M. Feser, J. Gelb, H. Chang, H. Cui, F. Duewer, S.H. Lau, A. Tkachuk, W. Yun, Meas. Sci.
Technol. 19, 094001 (2008)
40. Y. Li, J.S. Moore, B. Pathangey, R.C. Dias, D. Goyal, IEEE Trans. Device Mater. Reliab. 12(2),
494 (2012)
41. Y. Li, R. Panat, B. Li, R. Mulligan, P. K. Muther Srinath, A. Raman, IEEE Trans. Device Mater.
Reliab. 11(1), 141 (2011)
42. M. Pacheco, D. Goyal, in Proceedings of Electronic Components and Technology Conference
(2011), p. 1263
43. C. Schmidt, C. Hartfield, S.T. Kelly, L. England, S. Kannan, in Conference Proceedings from the
44th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International,
2018), p. 424
44. Y. Li, M. Pacheco, D. Goyal, J.W. Elmer, H.D. Barth, D. Parkinson, in Conference Proceedings
from the 64th Electronic Components and Technology Conference (ECTC) (2014), p. 1457
45. E. Zschech, M. Löffler„ J. Gluch, M.J. Wolf, in Materials Research Society (MRS) Spring
(2016)
46. W. Yun, M. Feser, J. Gelb, L. Hunter, Frontiers of characterization and metrology for
nanoelectronics (2013)
47. J. W. Elmer, Y. Li, H.D. Barth, D.Y. Parkinson, M. Pacheco, D. Goyal, J. Electron. Mater. 4421
(2014)
48. F. Altmann, J. Beyersdorfer, J. Schischka, M. Krause, G. Franz, L. Kwakman, in Conference
Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA)
(ASM International, 2012), p. 39
49. L. Kwakman, M. Straw, G. Coustillier, M. Sentis, J. Beyersdorfer, J. Schischka, F. Naumann,
F. Altmann, in Proceedings from the 39th International Symposium for Testing and Failure
Analysis (ISTFA) (ASM International, 2013), p. 17
50. Meyer, G. Grimm, M. Hecker, M. Weisheit, E. Langer, in Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2013),
p. 12
51. H. Xu, H. Zhang, M. Xue, in Conference Proceedings from the 15th Electronic Components
and Technology Conference (ECTC) (2013), p. 403
52. A. Centrone, Annu. Rev. Anal. Chem. 8, 101 (2015)
53. A. Dazzi, C.B. Prater, Chem. Rev. 117, 5146 (2017)
54. J.Y. Kim, H. Kim, D.W. Hahn, S.M. Hwang, in Proceedings from the 43rd International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2017), p. 40