18 Fault Isolation and Failure Analysis of 3D Packaging
615
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1. Y. Li, Y. Cai, M. Pacheco, R.C. Dias, D. Goyal, in Proceedings from the 38th International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2012), p. 95
2. R. Agarwal, W. Zhang, P. Limaye, R. Labie, B. Dimcic, A. Phommahaxay, P. Soussan, in
Proceedings of Electronic Components and Technology Conference (ECTC) (2010), p. 858
3. Y. Li, P.K. Muthur Srinath, D. Goyal, J. Electron. Mater. (2015)
4. Z. Ma, D.G. Seiler, in Metrology and Diagnostic Techniques for Nanoelectronics (Pan Stanford
Publishing Pte. Ltd., 2017)
5. R. Mahajan, R. Sankman, N. Patel, D. Kim, K. Aygun, Z. Qian, Y. Mekonnen, I. Salama, S.
Sharan, D. Iyengar, D. Mallik, in Conference Proceedings from the 66 th Electronic Components
and Technology Conference (ECTC) (2016), p. 558
6. Y. Cai, Z. Wang, R.C. Dias, D. Goyal, in Proceedings from the 36th International Symposium
for Testing and Failure Analysis (ISTFA) (ASM International, 2010), p. 1309
7. D. Smolyansky, Printed Circuit Design (2002), p. 20
8. D. Abessolo-Bidzo, P. Poirier, P. Descamps, B. Domenges, in Proceedings from the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (2005),
p. 318
9. S.H. Hall, G.W. Hal, J.A. McCall, High-Speed Digital System Design: A Handbook of
Interconnect Theory and Design Practices (Wiley, NY, 2000)
10. K. Matsumoto, H. Otsuka, O. Horiuchi, Y.G. Han, W. Choi, H. Tomokage, Trans. Jpn. Inst.
Electron. Pack. 6(1), 57 (2013)
11. R. Schlangen, S. Motegi, T. Nagatomo, C. Schmidt, F. Altmann, H. Murakami, S. Hollingshead,
J. West, in Proceedings from the 37th International Symposium for Testing and Failure Analysis
(ISTFA) (ASM International, 2011), p. 68
12. F. Naumann, F. Altmann, C. Grosse, R. Herold, in Proceedings from the 40th International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2014), p. 130
13. M. Xie, T. Begala, S. Khalsa, D. Goyal, Y. Li, O. Hatch, in Proceedings of Electronic
Components and Technology Conference (2016) (to be published)
14. R. Dias, L. Skoglund, Z. Wang, D. Smith, in Proceedings from the 27th International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2001), p. 77
15. M. Xie, Z. Qian, M. Pacheco, Z. Wang, R. Dias, V. Talanov, Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2012),
p. 11
16. J. Gaudestad, D. Nuez, P. Tan, in Proceedings from the 40th International Symposium for
Testing and Failure Analysis (ISTFA) (ASM International, 2014), p. 43
17. A. Orozco, N.E. Gagliolo, C. Rowlett, E. Wong, A. Moghe, J. Gaudestad, V. Talanov, A.
Jeffers, K. Torkashvan, F. C. Wellstood, S. Dobritz, M. Boettcher, A.B. Cawthorne, F. Infante,
in Proceedings from the 40th International Symposium for Testing and Failure Analysis (ISTFA)
(ASM International, 2014), p. 33
18. W. Lawton, J. Barrett, Microelectron. Reliab. 36, 1803 (1996)
19. J.E. Semmens, Microelectron. Reliab. 40, 1539 (2000)
20. D.A. Hutt, D.P. Webb, K.C. Hung, C.W. Tang, P.P. Conway, D.C. Whalley, Y.C. Chan,
in Proceedings from the 2000 IEEE/CPMT Int’l Electronics Manufacturing Technology
Symposium (2000), p. 191
21. J.E. Semmens, L.W. Kessler, Microelectron. Reliab. 42, 1735 (2002)
22. B.T. Khuri-Yakub, Ultrasonics 31(5), 361 (1993)
23. G.A.D. Briggs, O.V. Kolosov, Acoustic Microscopy, 2nd edn. (Oxford University, 2009)
24. T.M. Moore, C.D. Hartfield, in Proceedings from AIP, vol. 449 (1998), p. 598
25. A.J. Komrowski, L.A. Curiel, Q. Nguyen, D.J.D. Sullivan, L. Logan-Willams, in Proceedings
from the 30 th International Symposium for Testing and Failure Analysis (2004), p. 1
26. L. Angrisani, L. Bechou, D. Dallet, P. Daponte, Y. Ousten, Measurement 31, 77 (2002)
27. J. Sigmund, M. Kearney, Adv. Pack. (1998)
615
References
1. Y. Li, Y. Cai, M. Pacheco, R.C. Dias, D. Goyal, in Proceedings from the 38th International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2012), p. 95
2. R. Agarwal, W. Zhang, P. Limaye, R. Labie, B. Dimcic, A. Phommahaxay, P. Soussan, in
Proceedings of Electronic Components and Technology Conference (ECTC) (2010), p. 858
3. Y. Li, P.K. Muthur Srinath, D. Goyal, J. Electron. Mater. (2015)
4. Z. Ma, D.G. Seiler, in Metrology and Diagnostic Techniques for Nanoelectronics (Pan Stanford
Publishing Pte. Ltd., 2017)
5. R. Mahajan, R. Sankman, N. Patel, D. Kim, K. Aygun, Z. Qian, Y. Mekonnen, I. Salama, S.
Sharan, D. Iyengar, D. Mallik, in Conference Proceedings from the 66 th Electronic Components
and Technology Conference (ECTC) (2016), p. 558
6. Y. Cai, Z. Wang, R.C. Dias, D. Goyal, in Proceedings from the 36th International Symposium
for Testing and Failure Analysis (ISTFA) (ASM International, 2010), p. 1309
7. D. Smolyansky, Printed Circuit Design (2002), p. 20
8. D. Abessolo-Bidzo, P. Poirier, P. Descamps, B. Domenges, in Proceedings from the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (2005),
p. 318
9. S.H. Hall, G.W. Hal, J.A. McCall, High-Speed Digital System Design: A Handbook of
Interconnect Theory and Design Practices (Wiley, NY, 2000)
10. K. Matsumoto, H. Otsuka, O. Horiuchi, Y.G. Han, W. Choi, H. Tomokage, Trans. Jpn. Inst.
Electron. Pack. 6(1), 57 (2013)
11. R. Schlangen, S. Motegi, T. Nagatomo, C. Schmidt, F. Altmann, H. Murakami, S. Hollingshead,
J. West, in Proceedings from the 37th International Symposium for Testing and Failure Analysis
(ISTFA) (ASM International, 2011), p. 68
12. F. Naumann, F. Altmann, C. Grosse, R. Herold, in Proceedings from the 40th International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2014), p. 130
13. M. Xie, T. Begala, S. Khalsa, D. Goyal, Y. Li, O. Hatch, in Proceedings of Electronic
Components and Technology Conference (2016) (to be published)
14. R. Dias, L. Skoglund, Z. Wang, D. Smith, in Proceedings from the 27th International
Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2001), p. 77
15. M. Xie, Z. Qian, M. Pacheco, Z. Wang, R. Dias, V. Talanov, Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA) (ASM International, 2012),
p. 11
16. J. Gaudestad, D. Nuez, P. Tan, in Proceedings from the 40th International Symposium for
Testing and Failure Analysis (ISTFA) (ASM International, 2014), p. 43
17. A. Orozco, N.E. Gagliolo, C. Rowlett, E. Wong, A. Moghe, J. Gaudestad, V. Talanov, A.
Jeffers, K. Torkashvan, F. C. Wellstood, S. Dobritz, M. Boettcher, A.B. Cawthorne, F. Infante,
in Proceedings from the 40th International Symposium for Testing and Failure Analysis (ISTFA)
(ASM International, 2014), p. 33
18. W. Lawton, J. Barrett, Microelectron. Reliab. 36, 1803 (1996)
19. J.E. Semmens, Microelectron. Reliab. 40, 1539 (2000)
20. D.A. Hutt, D.P. Webb, K.C. Hung, C.W. Tang, P.P. Conway, D.C. Whalley, Y.C. Chan,
in Proceedings from the 2000 IEEE/CPMT Int’l Electronics Manufacturing Technology
Symposium (2000), p. 191
21. J.E. Semmens, L.W. Kessler, Microelectron. Reliab. 42, 1735 (2002)
22. B.T. Khuri-Yakub, Ultrasonics 31(5), 361 (1993)
23. G.A.D. Briggs, O.V. Kolosov, Acoustic Microscopy, 2nd edn. (Oxford University, 2009)
24. T.M. Moore, C.D. Hartfield, in Proceedings from AIP, vol. 449 (1998), p. 598
25. A.J. Komrowski, L.A. Curiel, Q. Nguyen, D.J.D. Sullivan, L. Logan-Willams, in Proceedings
from the 30 th International Symposium for Testing and Failure Analysis (2004), p. 1
26. L. Angrisani, L. Bechou, D. Dallet, P. Daponte, Y. Ousten, Measurement 31, 77 (2002)
27. J. Sigmund, M. Kearney, Adv. Pack. (1998)