570
Y. Wang et al.
9. J. Yu, J.Y. Kim, Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder
joints. Acta Mater. 56(19), 5514–5523 (2008)
10. K.-N. Tu, Solder Joint Technology (Springer, US, 2007)
11. K. Nogita, T. Nishimura, Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free
solder alloys. Scr. Mater. 59(2), 191–194 (2008)
12. H. Zhang, E. Perfecto, V.L. Calero-DdelC, F. Pompeo, An effective method for full solder
intermetallic compound formation and Kirkendall void control in Sn-base solder micro-joints,
in 2015 IEEE 65th Electronic Components and Technology Conference (2015), pp. 1695–1700
13. W.-L. Chiu, C.-M. Liu, Y.-S. Haung, C. Chen, Formation of nearly void-free Cu 3 Sn intermetallic joints using nanotwinned Cu metallization. Appl. Phys. Lett. 104(17), 171902
(2014)
14. Y. Liu, J. Wang, L. Yin, P. Kondos, C. Parks, P. Borgesen, D.W. Henderson, E.J. Cotts, N.
Dimitrov, Influence of plating parameters and solution chemistry on the voiding propensity
at electroplated copper-solder interface: plating in acidic copper solution with and without
polyethylene glycol. J. Appl. Electrochem. 38(12), 1695–1705 (2008)
15. J.H.L. Pang, Effect of intermetallic and kirkendall voids growth on board level drop reliability for SnAgCu Lead-Free BGA solder joint, 56th Electronic Components and Technology
Conference, 2006, no. 1 (2006), pp. 275–282
16. Y. Wang, S.-H. Chae, R. Dunne, Y. Takahashi, K. Mawatari, P. Steinmann, T. Bonifield,
T. Jiang, J. Im, P.S. Ho, Effect of intermetallic formation on electromigration reliability of
TSV-microbump joints in 3D interconnect, in 2012 IEEE 62nd Electronic Components and
Technology Conference (2012), pp. 319–325
17. I. Panchenko, K. Croes, I. De Wolf, J. De Messemaeker, E. Beyne, K.J. Wolter, Degradation
of Cu 6 Sn 5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn
microbump interconnects. Microelectron. Eng. 117, 26–34 (2014)
18. L. Mo, Z. Chen, F. Wu, C. Liu, Microstructural and mechanical analysis on Cu–Sn intermetallic
micro-joints under isothermal condition. Intermetallics 66, 13–21 (2015)
19. C. Chen, D. Yu, K. Chen, Vertical interconnects of microbumps in 3D integration. MRS Bull.
40(March), 257–263 (2015)
20. J.O. Suh, K.N. Tu, N. Tamura, Dramatic morphological change of scallop-type Cu 6 Sn 5 formed
on (001) single crystal copper in reaction between molten SnPb solder and Cu. Appl. Phys.
Lett. 91(5), 051907 (2007)
21. J.O. Suh, K.N. Tu, N. Tamura, Preferred orientation relationship between Cu 6 Sn 5 scallop-type
grains and Cu substrate in reactions between molten Sn-based solders and Cu. J. Appl. Phys.
102(6) (2007)
22. Y. Tian, R. Zhang, C. Hang, L. Niu, C. Wang, Relationship between morphologies and orientations of Cu 6 Sn 5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads. Mater. Charact.
88(100), 58–68 (2014)
23. H.F. Zou, H.J. Yang, Z.F. Zhang, Morphologies, orientation relationships and evolution of
Cu 6 Sn 5 grains formed between molten Sn and Cu single crystals. Acta Mater. 56, 2649–2662
(2008)
24. M. Li, M. Yang, J. Kim, Textured growth of Cu 6 Sn 5 grains formed at a Sn3.5Ag/Cu interface.
Mater. Lett. 66(1), 135–137 (2012)
25. G. Hariharan, R. Chaware, I. Singh, J. Lin, L. Yip, K. Ng, S.Y. Pai, A comprehensive reliability
study on a CoWoS 3D IC package (2015), pp. 573–577
26. Y. T. Chen, Chemical effect on diffusion in intermetallic compounds. Ph.D. thesis, UCLA,
2016
27. C.C. Lee, T.-F. Yang, C.-S. Wu, K.-S. Kao, R.-C. Cheng, T.-H. Chen, Reliability estimation
and failure mode prediction for 3D chip stacking package with the application of wafer-level
underfill. Microelectron. Eng. 107, 107–113 (2013)
28. H.H. Hsu, S.-Y. Huang, T.-C. Chang, A.T. Wu, Nucleation and propagation of voids in
microbumps for 3 dimensional integrated circuits. Appl. Phys. Lett. 99(25), 251913 (2011)
29. G. Ghosh, Elastic properties, hardness, and indentation fracture toughness of intermetallics
relevant to electronic packaging. J. Mater. Res. 19(05), 1439–1454 (2004)
Y. Wang et al.
9. J. Yu, J.Y. Kim, Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder
joints. Acta Mater. 56(19), 5514–5523 (2008)
10. K.-N. Tu, Solder Joint Technology (Springer, US, 2007)
11. K. Nogita, T. Nishimura, Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free
solder alloys. Scr. Mater. 59(2), 191–194 (2008)
12. H. Zhang, E. Perfecto, V.L. Calero-DdelC, F. Pompeo, An effective method for full solder
intermetallic compound formation and Kirkendall void control in Sn-base solder micro-joints,
in 2015 IEEE 65th Electronic Components and Technology Conference (2015), pp. 1695–1700
13. W.-L. Chiu, C.-M. Liu, Y.-S. Haung, C. Chen, Formation of nearly void-free Cu 3 Sn intermetallic joints using nanotwinned Cu metallization. Appl. Phys. Lett. 104(17), 171902
(2014)
14. Y. Liu, J. Wang, L. Yin, P. Kondos, C. Parks, P. Borgesen, D.W. Henderson, E.J. Cotts, N.
Dimitrov, Influence of plating parameters and solution chemistry on the voiding propensity
at electroplated copper-solder interface: plating in acidic copper solution with and without
polyethylene glycol. J. Appl. Electrochem. 38(12), 1695–1705 (2008)
15. J.H.L. Pang, Effect of intermetallic and kirkendall voids growth on board level drop reliability for SnAgCu Lead-Free BGA solder joint, 56th Electronic Components and Technology
Conference, 2006, no. 1 (2006), pp. 275–282
16. Y. Wang, S.-H. Chae, R. Dunne, Y. Takahashi, K. Mawatari, P. Steinmann, T. Bonifield,
T. Jiang, J. Im, P.S. Ho, Effect of intermetallic formation on electromigration reliability of
TSV-microbump joints in 3D interconnect, in 2012 IEEE 62nd Electronic Components and
Technology Conference (2012), pp. 319–325
17. I. Panchenko, K. Croes, I. De Wolf, J. De Messemaeker, E. Beyne, K.J. Wolter, Degradation
of Cu 6 Sn 5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn
microbump interconnects. Microelectron. Eng. 117, 26–34 (2014)
18. L. Mo, Z. Chen, F. Wu, C. Liu, Microstructural and mechanical analysis on Cu–Sn intermetallic
micro-joints under isothermal condition. Intermetallics 66, 13–21 (2015)
19. C. Chen, D. Yu, K. Chen, Vertical interconnects of microbumps in 3D integration. MRS Bull.
40(March), 257–263 (2015)
20. J.O. Suh, K.N. Tu, N. Tamura, Dramatic morphological change of scallop-type Cu 6 Sn 5 formed
on (001) single crystal copper in reaction between molten SnPb solder and Cu. Appl. Phys.
Lett. 91(5), 051907 (2007)
21. J.O. Suh, K.N. Tu, N. Tamura, Preferred orientation relationship between Cu 6 Sn 5 scallop-type
grains and Cu substrate in reactions between molten Sn-based solders and Cu. J. Appl. Phys.
102(6) (2007)
22. Y. Tian, R. Zhang, C. Hang, L. Niu, C. Wang, Relationship between morphologies and orientations of Cu 6 Sn 5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads. Mater. Charact.
88(100), 58–68 (2014)
23. H.F. Zou, H.J. Yang, Z.F. Zhang, Morphologies, orientation relationships and evolution of
Cu 6 Sn 5 grains formed between molten Sn and Cu single crystals. Acta Mater. 56, 2649–2662
(2008)
24. M. Li, M. Yang, J. Kim, Textured growth of Cu 6 Sn 5 grains formed at a Sn3.5Ag/Cu interface.
Mater. Lett. 66(1), 135–137 (2012)
25. G. Hariharan, R. Chaware, I. Singh, J. Lin, L. Yip, K. Ng, S.Y. Pai, A comprehensive reliability
study on a CoWoS 3D IC package (2015), pp. 573–577
26. Y. T. Chen, Chemical effect on diffusion in intermetallic compounds. Ph.D. thesis, UCLA,
2016
27. C.C. Lee, T.-F. Yang, C.-S. Wu, K.-S. Kao, R.-C. Cheng, T.-H. Chen, Reliability estimation
and failure mode prediction for 3D chip stacking package with the application of wafer-level
underfill. Microelectron. Eng. 107, 107–113 (2013)
28. H.H. Hsu, S.-Y. Huang, T.-C. Chang, A.T. Wu, Nucleation and propagation of voids in
microbumps for 3 dimensional integrated circuits. Appl. Phys. Lett. 99(25), 251913 (2011)
29. G. Ghosh, Elastic properties, hardness, and indentation fracture toughness of intermetallics
relevant to electronic packaging. J. Mater. Res. 19(05), 1439–1454 (2004)