538
Y. Wang et al.
Fig. 17.10 (a) Tensile test curve of Cu/Sn(10-μm)/Cu micro-joint under aggressive high temperature storage at 210 °C up to 168 h. (b) The adhesion strength degraded dramatically from 162 to
60 MPa [82]
17.3.1.4 Anisotropic Effect in Microbump
Suh et al found that a very strong orientation relationship exists between Cu 6 Sn 5 and
Cu from the reaction between a pure (100) oriented single crystal Cu and eutectic
SnPb. There are six types of preferred crystallographic orientation relationship identified by Synchrotron X-ray microdiffraction [20, 21]. Figure 17.11a is an orientation
Fig. 17.11 Orientation mapping and histogram of (a), (b) Cu/SnPb and (c), (d) Cu/Sn sample with
4-min reflow time at 250 °C [21]
Y. Wang et al.
Fig. 17.10 (a) Tensile test curve of Cu/Sn(10-μm)/Cu micro-joint under aggressive high temperature storage at 210 °C up to 168 h. (b) The adhesion strength degraded dramatically from 162 to
60 MPa [82]
17.3.1.4 Anisotropic Effect in Microbump
Suh et al found that a very strong orientation relationship exists between Cu 6 Sn 5 and
Cu from the reaction between a pure (100) oriented single crystal Cu and eutectic
SnPb. There are six types of preferred crystallographic orientation relationship identified by Synchrotron X-ray microdiffraction [20, 21]. Figure 17.11a is an orientation
Fig. 17.11 Orientation mapping and histogram of (a), (b) Cu/SnPb and (c), (d) Cu/Sn sample with
4-min reflow time at 250 °C [21]