14 Fundamentals of Advanced Materials …
421
Table 14.3
(continued)
Process
abbreviation
ENIG
E-NI/E-Au
Ni/Reductive
Au
OSP
Imm. Ag
Imm. Sn
E-Ni/Pd/I-Au
ENEPIG
HASL
SnPb
ASIG
Coplanarity
Very good
Very good
Very good
Very good
Very good
Very good
Very good
Poor
Very good
Minimum
space/line
(μm)
40/40
20/20
40/40
20/20
40/40
40/40
40/40
100/100 40/40
Cost
High
Very high
Very high
Low
Medium
Medium
Very high
Very high Medium
US-wire
bonding (Al
wire)
Yes
No
No
No
Yes
No
Yes
No
Yes
TS-wire
bonding/TAB
(Au wire)
No
Yes
Yes
No
No
No
Yes
No
Yes