420
S. Shi et al.
Table 14.3
Some of typical surface finish specifications [5]
Process
abbreviation
ENIG
E-NI/E-Au
Ni/Reductive
Au
OSP
Imm. Ag
Imm. Sn
E-Ni/Pd/I-Au
ENEPIG
HASL
SnPb
ASIG
Full name
Eletroless
nickel
immersion
gold
Electroplated
nickel and
gold
Electroless
nickel
electroless
thick gold
Organic
solderability
preservative
Immersion
silver
Immersion
tin
Electroless
nickel &
palladium
immersion
gold
Hot air
solder
leveling
Autocatalytic
silver
immersion
gold
Layer
thickness (μm)
Ni: 3–5
Au:
0.05–0.1
Ni: 3–8
Au: 1–2
Ni: 3–6
Au: 0.2–1.0
0.2–0.5
0.2–0.5
0.8–1.2
Ni: 4–7
Pd: 0.05–0.2
Au: 0.03–0.08
10
Ag: 0.13–0.25
Au: 0.02–0.06
Composition
Ni: ~90%
Ni
+
~7–10% P
Au: 99.99%
Au
Ni: Pure Ni
Au: Au with
0% or 0.2%
Co.
Ni: pure NI
Au: 99.99%
Benzimidazoles Ag
Sn
Ni, Pd, Au
63% Sn
37% Pb
Ag, Cu
Max. process
temperature
(°C)
90
90
90
40
50
70
70
250
61
Multiple
reflows
4
4
4
4+
5
5
5
5
5
Shelf life
(month)
12
12
12
6
12
12
12
12
12
(continued)